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Toshiba Semiconductor and Storage TCK22923G,LF
- Part No.:
- TCK22923G,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 6-UFBGA, WLCSP
- Datasheet:
-
TCK22923G,LF.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 WCSP6E
- Quantity:
- Payment:
- Shipping:
Inventory:4,890
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Product details
Overview
TCK22923G,LF from Toshiba Electronic Devices & Storage Corporation is a 2 A, 25 mΩ load switch IC with slew rate control and output auto-discharge, designed for power sequencing in portable electronics. It operates from 1.1 V to 5.5 V input, features 1364 μs VOUT rise time at VIN = 5 V, built-in reverse current blocking when VIN = 0 V, and uses an active-high control pin with internal pull-down. It serves as a high-density power gate in smartphone PMIC subsystems.
For engineers reviewing the TCK22923G,LF datasheet, TCK22923G,LF pinout, TCK22923G,LF application, or TCK22923G,LF equivalent, key selection criteria include controlled inrush current (1364 μs rise time), ultra-small WCSP6E footprint (0.8 mm × 1.2 mm), guaranteed 2 A DC output, integrated auto-discharge, and reverse current blocking at zero-input voltage.
Technical Context
The TCK22923G,LF integrates a p-channel MOSFET pass switch with a dedicated slew rate control driver that sets VOUT rise time to 1364 μs under 5 V input and 5 Ω/1.0 μF load conditions. Its internal discharge n-channel MOSFET activates during OFF state to rapidly sink output capacitance, preventing floating rail issues in multi-rail systems.
It implements reverse current blocking when VIN = 0 V - independent of control state - by leveraging body-diode isolation and auxiliary circuitry. The control pin includes Schmitt-trigger input and a built-in pull-down resistor, ensuring default-OFF behavior without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 2.0 A DC - supports USB-powered peripherals and baseband processors requiring stable 2 A rail switching. |
| ON Resistance | 25 mΩ typ. at VIN = 5.0 V, IOUT = −0.5 A - limits conduction loss to ≤25 mV drop at 1 A, enabling efficient low-voltage operation. |
| VOUT Rise Time | 1364 μs typ. at VIN = 5 V, RL = 5 Ω, CL = 1.0 μF - provides controlled inrush limiting to prevent supply sag and system reset. |
| Input Voltage Range | 1.1 V to 5.5 V - compatible with Li-ion battery, LDO, and buck converter outputs across portable platforms. |
| Quiescent Current | 0.1 μA typ. (ON state, VIN = 1.8–5.5 V) - enables always-on power gating without measurable battery drain. |
| Reverse Blocking | Active when VIN = 0 V - prevents backfeed from powered output rails into discharged input sources, critical for battery safety. |
| Output Auto-Discharge | Integrated discharge FET with 100 Ω typ. RSD - clears VOUT within milliseconds after shutdown, avoiding unintended wake-up or latch-up. |
Pinout & Package
Package: WCSP6E (0.8 mm × 1.2 mm, thickness 0.55 mm), ultra-thin wafer-level chip-scale package with solder bumps; weight ≈1 mg. Optimized for high-density mobile PCBs with 0.4 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, B1 | VOUT | Switched output node - connects to downstream load; dual pins reduce IR drop and thermal resistance. |
| C1 | GND | Power ground reference - shared return path for pass FET, discharge FET, and control logic. |
| A2, B2 | VIN | Input power rail - dual pins minimize voltage drop and improve current sharing up to 2 A DC. |
| C2 | Control | Active-high enable input with Schmitt trigger and internal pull-down - ensures defined OFF state if left unconnected. |
Key Features
| Feature | Design Value |
|---|---|
| Slew Rate Control | Fixed 1364 μs VOUT rise time eliminates need for external RC networks while guaranteeing repeatable inrush control. |
| Output Auto-Discharge | Integrated 100 Ω discharge path reduces VOUT to <0.1 V within ~1 ms after disable, preventing cross-rail coupling. |
| Reverse Current Blocking | Hardware-enforced isolation when VIN = 0 V - no software or timing dependency; protects battery and upstream regulators. |
| Ultra-Small WCSP6E | 0.8 mm × 1.2 mm footprint saves >60% board area vs. comparable SOT-23 or DFN packages, enabling tighter layout in camera modules. |
| Pull-Down Control Pin | Internal MΩ-range resistor ensures fail-safe OFF state - removes requirement for external pull-down resistor in space-constrained designs. |
Applications
| Smartphone Power Rail Switching | Wearable Sensor Subsystem Enable |
|---|---|
|
Use Scenario: Enabling/disabling camera module power rail during sleep/wake cycles in LTE smartphones. IC Role / Device Role / Timing Role: Load switch controlling 2.8 V VIO rail with controlled 1364 μs ramp to avoid PMIC brownout. Use Value: Prevents system reset during camera activation while maintaining <0.1 μA quiescent draw in standby mode. |
Use Scenario: Power gating accelerometer and gyroscope supply in Bluetooth earbuds during motion-detection idle periods. IC Role / Device Role / Timing Role: Low-leakage 2 A switch with auto-discharge clearing sensor VDD before deep-sleep entry. Use Value: Eliminates floating sensor rail that causes false wake events; WCSP6E fits within 3.5 mm × 3.5 mm earbud PCB real estate. |
| USB-C Peripheral Power Management | Multi-Rail IoT Edge Node Sequencing |
|
Use Scenario: Isolating 5 V USB-C VBUS from internal 3.3 V logic rail during hot-plug detection and enumeration. IC Role / Device Role / Timing Role: Reverse-current-blocking load switch activated only after CC line negotiation completes. Use Value: Blocks backfeed from 3.3 V domain into disconnected VBUS, satisfying USB PD specification safety requirements. |
Use Scenario: Sequential powering of RF transceiver, MCU core, and analog front-end in LPWA sensor nodes. IC Role / Device Role / Timing Role: First-stage load switch in three-rail power sequence, with precise rise/fall timing coordinated via GPIO. Use Value: Ensures clean power-up order without external timing capacitors; 25 mΩ RON minimizes voltage droop on 1.8 V MCU rail. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK22922G,LF | Rise time = 666 μs (vs. 1364 μs); otherwise identical pinout, specs, and features. | Better suited for faster rail activation where moderate inrush control suffices (e.g., display bias supplies). | Select TCK22922G,LF when shorter turn-on time is required without changing layout or firmware. |
| TCK22925G,LF | Rise time = 3380 μs; higher slew control granularity for ultra-sensitive analog rails. | Preferred for noise-critical applications like audio codec power domains where EMI must be minimized. | Choose TCK22925G,LF when maximum inrush suppression is needed and longer enable delay is acceptable. |
Compared with TCK22922G,LF and TCK22925G,LF, the TCK22923G,LF delivers balanced inrush control (1364 μs) - sufficient to prevent supply collapse in mid-speed digital loads without over-penalizing startup latency, making it optimal for general-purpose 2 A rail switching in mobile SoC subsystems.
Availability
TCK22923G,LF is available at Aetrix Electronics and suitable for smartphone power management, wearable sensor enable, and USB-C peripheral isolation requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for TCK22923G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power management and analog integration.
The TCK2292xG series targets portable electronics power architecture, delivering ultra-compact, low-RON load switches with programmable slew rates and integrated safety functions for battery-powered devices.
FAQ
What is the VOUT rise time specification for TCK22923G,LF?
The TCK22923G,LF has a typical VOUT rise time of 1364 μs when tested at VIN = 5.0 V with RL = 5 Ω and CL = 1.0 μF. This value is fixed by internal slew rate control circuitry and does not require external components. The TCK22923G,LF maintains this timing across its full operating temperature range (−40°C to +85°C), ensuring consistent inrush behavior in portable device power sequencing.
Does TCK22923G,LF include output auto-discharge functionality?
Yes, the TCK22923G,LF integrates an output auto-discharge function using an internal n-channel MOSFET with 100 Ω typical on-resistance. When the control pin is driven low, the discharge path activates and pulls VOUT to GND within milliseconds. This feature is confirmed in the Function Table and Electrical Characteristics section of the official Toshiba datasheet for TCK22923G,LF.
What package type and dimensions does TCK22923G,LF use?
The TCK22923G,LF uses the WCSP6E wafer-level chip-scale package measuring 0.8 mm × 1.2 mm with 0.55 mm thickness and 0.4 mm pin pitch. It contains six solder bumps arranged in a 3×2 grid, with dual VIN and VOUT connections for current handling and thermal performance. This package is specified in Toshiba's Package Dimension drawing and Land Pattern documentation for TCK22923G,LF.
Is reverse current blocking supported when VIN = 0 V on TCK22923G,LF?
Yes, the TCK22923G,LF provides hardware-based reverse current blocking when VIN = 0 V, regardless of control pin state. This function prevents backflow from a powered VOUT rail into a discharged or disconnected input source. It is explicitly documented in the Absolute Maximum Ratings, Function Table, and Application Note sections of the TCK22923G,LF datasheet.
What is the maximum continuous output current rating for TCK22923G,LF?
The TCK22923G,LF is rated for 2.0 A DC continuous output current, as stated in the Absolute Maximum Ratings table. This rating applies under standard board-mount conditions (FR4, 40 mm × 40 mm, 50% copper coverage). Derating is required above +40°C ambient per the PD–Ta curve; at 85°C, usable current drops to approximately 1.3 A to maintain junction temperature ≤150°C.
TCK22923G,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 6-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 1.1V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2A
- Rds On (Typ):
- 25mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Slew Rate Controlled
- Fault Protection:
- Reverse Current
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WCSPE (0.80x1.2)
TCK22923G,LF FAQ
1.How can I place an order for TCK22923G,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCK22923G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCK22923G,LF reliable?
The price and inventory of TCK22923G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK22923G,LF is usually 5 days.
3.What payment methods are accepted for TCK22923G,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK22923G,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCK22923G,LF?
TCK22923G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCK22923G,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCK22923G,LF?
For technical support, including TCK22923G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK22923G,LF requirements.
6.How does Aetrix verify that TCK22923G,LF is sourced from the original manufacturer or authorized distributors?
All TCK22923G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK22923G,LF meets industry standards.
7.What is the process for return or replacement of TCK22923G,LF?
All TCK22923G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK22923G,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCK22923G,LF part is unused and in its original packaging.
Return procedure for TCK22923G,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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