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Toshiba Semiconductor and Storage TCK22946G,LF
- Part No.:
- TCK22946G,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 6-UFBGA, WLCSP
- Datasheet:
-
TCK22946G,LF.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 WCSP6E
- Quantity:
- Payment:
- Shipping:
Inventory:3,554
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Product details
Overview
TCK22946G,LF from Toshiba Electronic Devices & Storage Corporation is a load switch IC with integrated overcurrent limiting (400 mA), true reverse current blocking, output auto-discharge, thermal shutdown, and under-voltage lockout-designed for power rail control in space-constrained portable electronics. It features 31 mΩ typical ON resistance at 5.0 V input and 25 μA quiescent current, enabling efficient battery-powered operation in smartphones and wearables.
For engineers reviewing the TCK22946G,LF datasheet, TCK22946G,LF pinout, TCK22946G,LF application, or TCK22946G,LF equivalent, key selection criteria include its WCSP6E ultra-small package (0.8 mm × 1.2 mm), active-high CONTROL logic, guaranteed 400 mA current limit, and full-time reverse-current protection-critical for USB-OTG, PMIC sequencing, and always-on subsystems.
Technical Context
The TCK22946G,LF integrates a low-RON N-channel MOSFET power switch with fold-back overcurrent protection, thermal shutdown triggered at ~170°C junction temperature, and hysteresis-based UVLO (0.82 V rise / 0.77 V fall). Its CONTROL pin includes internal pull-down and Schmitt-trigger input for noise immunity.
True reverse current blocking operates independently of switch state, enforcing <2 μA reverse leakage at 5.0 V VOUT–VIN, while output auto-discharge activates on CONTROL low to rapidly discharge downstream capacitance via a 100 Ω internal discharge path.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current Limit | 400 mA (fold-back type; provides robust short-circuit protection without latch-up) |
| ON Resistance | 31 mΩ typ. at VIN = 5.0 V (minimizes voltage drop and power loss in 3.3–5.5 V rails) |
| Quiescent Current | 25 μA typ. at VIN = 5.5 V (enables >1-year battery life in always-on standby modes) |
| Input Voltage Range | 1.1 V to 5.5 V (supports Li-ion, Li-poly, and regulated 1.2/1.8/3.3/5.0 V supplies) |
| UVLO Threshold | 0.82 V (rise), 0.77 V (fall) - prevents erratic switching during brown-out conditions |
| Reverse Blocking Voltage | 35 mV threshold - ensures immediate blocking when VOUT exceeds VIN by ≥35 mV |
| Thermal Shutdown | ~170°C activation with ~20°C hysteresis - protects against sustained overload or poor PCB thermal design |
Pinout & Package
Package: WCSP6E (0.8 mm × 1.2 mm, 0.55 mm height, 0.4 mm pitch, 1 mg typical weight). Ultra-compact wafer-level chip-scale package optimized for high-density mobile PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, B1 | VOUT | Switched output node; dual pins reduce trace inductance and improve current handling |
| C1 | GND | Power ground reference; must be connected to low-impedance system ground plane |
| A2, B2 | VIN | Input power supply; dual pins support higher current and lower parasitic resistance |
| C2 | CONTROL | Active-high digital enable; internal ~few-MΩ pull-down ensures safe OFF state at power-up or floating condition |
Key Features
| Feature | Design Value |
|---|---|
| True Reverse Current Blocking | Blocks reverse current from VOUT to VIN regardless of switch state (full-time protection); <2 μA leakage at 5 V differential |
| Output Auto-Discharge | Internal 100 Ω discharge path activates on CONTROL low, reducing VOUT to <0.1 V within ~1 ms (CL = 10 μF) |
| Inrush Current Reduction | Controlled slew rate limits dV/dt at turn-on, suppressing peak input current and preventing supply rail collapse |
| Thermal Shutdown with Hysteresis | Shuts down at ~170°C junction temp; re-enables only after cooling to ~150°C - avoids oscillation during thermal overload |
| Under-Voltage Lockout | Hysteresis-enabled UVLO prevents unstable switching during startup/brown-out; release occurs only after VIN rises above 0.82 V |
Applications
| Smartphone Power Rail Control | USB OTG Power Switching |
|---|---|
Use Scenario: Enabling/disabling camera module, NFC, or display backlight power in modern smartphones with tight board area constraints. IC Role / Device Role / Timing Role: Load switch managing isolated 3.3 V or 5.0 V power domain; sequenced via AP GPIO with precise timing control. Use Value: WCSP6E footprint saves >0.5 mm² vs. SOT-23; 400 mA limit safely powers typical camera modules; auto-discharge prevents backfeed into disabled rails. |
Use Scenario: Controlling VBUS power delivery from smartphone to peripheral devices in USB On-The-Go configurations. IC Role / Device Role / Timing Role: Bidirectional power gate with mandatory reverse-current blocking to prevent peripheral back-driving host battery. Use Value: True reverse current blocking engages instantly at VOUT–VIN ≥35 mV - eliminates need for external diode or complex control logic. |
| Wearable Sensor Subsystem | PMIC Output Sequencing |
Use Scenario: Power gating low-power sensors (e.g., accelerometers, HRMs) in fitness trackers to extend multi-week battery life. IC Role / Device Role / Timing Role: Always-on load switch controlled by microcontroller wake signal; enables fast, low-leakage power domain isolation. Use Value: 25 μA IQ in ON state and sub-2.5 μA in OFF state minimize quiescent drain; 1.1 V minimum VIN supports single-cell Li-ion operation down to 3.0 V. |
Use Scenario: Adding independent enable control and fault protection to fixed-output LDOs or DC-DC converters in multi-rail PMIC designs. IC Role / Device Role / Timing Role: Secondary protection layer downstream of PMIC outputs; adds current limiting, thermal shutdown, and UVLO not present in base regulator. Use Value: 31 mΩ RON adds <15 mV drop at 500 mA - negligible impact on regulation accuracy; built-in UVLO prevents rail instability during cold-start. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK22951G,LF | 740 mA current limit; otherwise identical pinout, package, and feature set | Suitable where higher output current is required (e.g., larger displays or multi-sensor clusters) | Select TCK22951G,LF if system peak load exceeds 400 mA but remains ≤740 mA; same PCB layout and firmware interface |
| TPS22916BYFPR | 450 mA limit, 29 mΩ RON, 0.5 μA IQ(OFF); no true reverse blocking; different 6-pin DSBGA package (0.9 mm × 1.3 mm) | Lacks full-time reverse-current protection; requires external circuitry for VOUT-to-VIN blocking | Choose TPS22916BYFPR only if reverse blocking is unnecessary and ultra-low OFF-state IQ is prioritized over protection integrity |
Compared with TCK22946G,LF, TCK22951G,LF offers higher current capacity in identical form factor, while TPS22916BYFPR trades reverse-current safety for lower OFF-state leakage - making TCK22946G,LF optimal for USB, OTG, and battery-isolation use cases demanding full protection.
Availability
TCK22946G,LF is available at Aetrix Electronics and suitable for smartphone power management, wearable sensor subsystems, USB OTG implementations, and PMIC output sequencing requiring stable component supply across high-volume production cycles.
Supply support for TCK22946G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with leadership in power management, logic, and analog ICs.
The TCK22xxxG series targets ultra-compact, high-protection load switching in portable electronics - emphasizing minimal footprint, full reverse-current blocking, and robust thermal/current fault handling for battery-sensitive applications.
FAQ
What is the maximum input voltage rating for the TCK22946G,LF?
The TCK22946G,LF has an absolute maximum input voltage (VIN) rating of 6.0 V. Its recommended operating range is 1.1 V to 5.5 V per datasheet specifications. Exceeding 6.0 V risks permanent damage to the internal MOSFET and protection circuitry. The TCK22946G,LF is designed for single-cell Li-ion (up to 4.4 V) and regulated 3.3 V/5.0 V rails - never intended for 12 V or higher systems.
Does the TCK22946G,LF provide reverse current blocking when the switch is turned OFF?
Yes, the TCK22946G,LF provides true reverse current blocking regardless of switch state - both when ON and OFF. This is implemented via a dedicated internal circuit that blocks current flow from VOUT to VIN whenever VOUT exceeds VIN by ≥35 mV. The TCK22946G,LF achieves <2 μA reverse leakage at 5.0 V differential, eliminating need for external blocking diodes in USB OTG or shared-bus architectures.
What is the purpose of the internal pull-down resistor on the CONTROL pin of the TCK22946G,LF?
The TCK22946G,LF integrates a pull-down resistor (~few MΩ) between CONTROL and GND to ensure the device defaults to OFF at power-up or if the CONTROL line is left floating. This fail-safe behavior prevents unintended power delivery to downstream circuits. Combined with Schmitt-trigger input, it also improves noise immunity - the TCK22946G,LF requires CONTROL ≥1.0 V (at VIN ≥1.2 V) to activate, guaranteeing clean switching even in noisy environments.
How does the overcurrent protection function in the TCK22946G,LF?
The TCK22946G,LF implements fold-back overcurrent limiting with a nominal trip point of 400 mA. When output current exceeds this threshold, the device reduces output voltage to limit power dissipation and prevent thermal runaway - rather than latching off. Recovery is automatic once load current falls below the limit. This behavior is confirmed in Toshiba's Application Note and distinguishes the TCK22946G,LF from hiccup-mode or latch-off alternatives.
Can the TCK22946G,LF be used with input voltages below 1.2 V?
Yes - the TCK22946G,LF supports minimum input voltage of 1.1 V, verified in datasheet operating conditions. At VIN = 1.1 V, RON increases to 179 mΩ (typ.), and VIH threshold drops to 0.9 V. This enables compatibility with deeply discharged Li-ion cells and low-voltage microcontrollers. However, UVLO remains active down to 0.77 V falling threshold, ensuring reliable disable behavior even near end-of-discharge.
TCK22946G,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 6-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 1.1V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 400mA
- Rds On (Typ):
- 31mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WCSPE (0.80x1.2)
TCK22946G,LF FAQ
1.How can I place an order for TCK22946G,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCK22946G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCK22946G,LF reliable?
The price and inventory of TCK22946G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK22946G,LF is usually 5 days.
3.What payment methods are accepted for TCK22946G,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK22946G,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCK22946G,LF?
TCK22946G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCK22946G,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCK22946G,LF?
For technical support, including TCK22946G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK22946G,LF requirements.
6.How does Aetrix verify that TCK22946G,LF is sourced from the original manufacturer or authorized distributors?
All TCK22946G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK22946G,LF meets industry standards.
7.What is the process for return or replacement of TCK22946G,LF?
All TCK22946G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK22946G,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCK22946G,LF part is unused and in its original packaging.
Return procedure for TCK22946G,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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