Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Distribution Switches, Load Drivers

Toshiba Semiconductor and Storage TCK22951G,LF

Name: TCK22951G,LF
Brand: Toshiba Semiconductor and Storage
SKU: TCK22951G,LF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: TCK22951G,LF

Manufacturer:: Toshiba Semiconductor and Storage

Category:: Power Distribution Switches, Load Drivers

Package:: 6-UFBGA, WLCSP

Datasheet:: TCK22951G,LF.pdf

Description:: IC PWR SWITCH P-CHAN 1:1 WCSP6E

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,602

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

TCK22951G,LF from Toshiba Electronic Devices & Storage Corporation is a load switch IC with integrated overcurrent limiting (740 mA), thermal shutdown, output auto-discharge, true reverse current blocking, and under-voltage lockout functions. It features 31 mΩ typical ON resistance at 5.0 V input, 25 μA quiescent current, and operates across 1.4–5.5 V input range. Designed for portable power rail control in space-constrained applications like smartphones.

For engineers reviewing the TCK22951G,LF datasheet, TCK22951G,LF pinout, TCK22951G,LF application, or TCK22951G,LF equivalent, key selection criteria include verified 740 mA current limit accuracy, WCSP6E package thermal performance, reverse-current blocking behavior under all switch states, and UVLO hysteresis thresholds (0.77 V fall / 0.82 V rise).

Technical Context

The TCK22951G,LF integrates a low-R_ON N-channel MOSFET power switch with fold-back overcurrent protection, active-high CONTROL logic, and Schmitt-trigger input. Its true reverse current blocking circuit operates independently of switch state, ensuring full-time protection against V_OUT→V_VIN backflow.

Thermal shutdown activates at ~170°C junction temperature with 20°C hysteresis (re-enable at ~150°C), while UVLO prevents turn-on below 0.82 V and maintains OFF state until VIN exceeds threshold. The built-in pull-down resistor on CONTROL ensures default-OFF safety during floating conditions.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Current Limit	740 mA typical - sets maximum safe load current before fold-back activation
ON Resistance	31 mΩ typ. at VIN = 5.0 V - minimizes voltage drop and power loss at nominal rail
Quiescent Current	25 μA typ. at VIN = 5.5 V - enables ultra-low standby power in battery-powered systems
Input Voltage Range	1.4 V to 5.5 V - supports single-cell Li-ion, USB, and multi-rail PMIC outputs
UVLO Threshold	0.82 V (rise), 0.77 V (fall) - prevents erratic switching during brown-out or cold-start
Reverse Blocking Voltage	35 mV threshold - guarantees reverse current cutoff even when VOUT > VIN by ≥35 mV
Turn-on Delay	40 μs typ. - enables precise timing control in sequenced power-up schemes

Pinout & Package

Package: WCSP6E (0.8 mm × 1.2 mm, 0.55 mm height, 0.4 mm pitch, 1 mg typical weight). Ultra-compact wafer-level chip-scale package optimized for high-density mobile PCB layouts.

Pin/Terminal	Circuit Role	Design Meaning
VOUT (A1, B1)	Switched Output Power Rail	Dual-source output pad - connects directly to load; supports high-current delivery with low inductance
GND (C1)	Power Ground Reference	Primary ground return path for switch current and internal protection circuits
VIN (A2, B2)	Input Power Supply	Dual-source input pad - accepts upstream rail; designed for low-impedance connection to bulk capacitance
CONTROL (C2)	Active-High Enable Input	Schmitt-triggered logic input with internal MΩ-range pull-down - ensures fail-safe OFF state when unconnected

Key Features

Feature	Design Value
True Reverse Current Blocking	Active regardless of switch ON/OFF state - eliminates need for external reverse-blocking diode in bidirectional power paths
Output Auto-Discharge	Internal 100 Ω discharge path - safely drains residual charge from downstream capacitance within milliseconds after turn-off
Inrush Current Reduction	Controlled slew rate - limits dV/dt at VOUT to suppress peak inrush current and supply rail droop
Thermal Shutdown with Hysteresis	170°C trip / 150°C recovery - prevents thermal runaway while allowing automatic recovery once cooled
Pull-Down on CONTROL Pin	Several-MΩ internal resistor - eliminates need for external biasing and guarantees known state during MCU reset or boot

Applications

Smartphone Subsystem Power	Wearable Sensor Hub
Use Scenario: Independent power gating of camera module, NFC transceiver, or display backlight in smartphone mainboard. IC Role / Device Role / Timing Role: Load switch controlling dedicated 3.3 V or 5.0 V rail with fast enable/disable sequencing. Use Value: 31 mΩ R_ON minimizes voltage loss across 740 mA peak loads; auto-discharge clears residual charge before next power cycle.	Use Scenario: Power management for ultra-low-power wearable devices with intermittent sensor sampling (e.g., heart-rate monitor). IC Role / Device Role / Timing Role: Low-quiescent-current (25 μA) switch enabling deep-sleep mode between sensor acquisitions. Use Value: 25 μA IQ reduces standby drain significantly; true reverse blocking prevents battery leakage through shared VOUT nodes.
USB-C Peripheral Power Control	IoT Edge Node PMIC Auxiliary Rail
Use Scenario: Enabling/disabling 5 V power to USB-C accessory ports with overcurrent fault containment. IC Role / Device Role / Timing Role: Fault-tolerant load switch with 740 mA current limit and thermal shutdown for hot-plug safety. Use Value: Fold-back current limiting protects host port during short-circuit events; UVLO prevents operation below valid USB voltage.	Use Scenario: Isolating auxiliary rails (e.g., RF transceiver or secure element) in battery-backed IoT edge nodes. IC Role / Device Role / Timing Role: High-reliability power switch with reverse-current blocking and thermal margin for extended field deployment. Use Value: WCSP6E footprint saves board area in compact modules; 170°C thermal shutdown ensures robustness under sustained load.

Smartphone Subsystem Power

Wearable Sensor Hub

Use Scenario: Independent power gating of camera module, NFC transceiver, or display backlight in smartphone mainboard.

IC Role / Device Role / Timing Role: Load switch controlling dedicated 3.3 V or 5.0 V rail with fast enable/disable sequencing.

Use Value: 31 mΩ R_ON minimizes voltage loss across 740 mA peak loads; auto-discharge clears residual charge before next power cycle.

Use Scenario: Power management for ultra-low-power wearable devices with intermittent sensor sampling (e.g., heart-rate monitor).

IC Role / Device Role / Timing Role: Low-quiescent-current (25 μA) switch enabling deep-sleep mode between sensor acquisitions.

Use Value: 25 μA IQ reduces standby drain significantly; true reverse blocking prevents battery leakage through shared VOUT nodes.

USB-C Peripheral Power Control

IoT Edge Node PMIC Auxiliary Rail

Use Scenario: Enabling/disabling 5 V power to USB-C accessory ports with overcurrent fault containment.

IC Role / Device Role / Timing Role: Fault-tolerant load switch with 740 mA current limit and thermal shutdown for hot-plug safety.

Use Value: Fold-back current limiting protects host port during short-circuit events; UVLO prevents operation below valid USB voltage.

Use Scenario: Isolating auxiliary rails (e.g., RF transceiver or secure element) in battery-backed IoT edge nodes.

IC Role / Device Role / Timing Role: High-reliability power switch with reverse-current blocking and thermal margin for extended field deployment.

Use Value: WCSP6E footprint saves board area in compact modules; 170°C thermal shutdown ensures robustness under sustained load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TCK22946G,LF	400 mA current limit, same package and feature set	Lower current capability suits smaller loads (e.g., low-power sensors)	Select when system peak load remains ≤400 mA and tighter current limiting is preferred
TCK2065G,LF	1110 mA current limit, same package and feature set	Higher current rating supports larger peripherals (e.g., motor drivers, audio amps)	Select when system requires >740 mA continuous load with identical protection features

Compared with TCK22951G,LF, the TCK22946G,LF offers tighter current limiting for precision low-power loads, while the TCK2065G,LF extends headroom for higher-current peripherals - all share identical WCSP6E footprint, thermal shutdown, UVLO, and reverse-blocking behavior.

Availability

TCK22951G,LF is available at Aetrix Electronics and suitable for smartphone subsystem power, wearable sensor hub control, and USB-C peripheral power management requiring stable component supply and long-term lifecycle support.

Supply support for TCK22951G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power efficiency and miniaturization.

The TCK22xxxG series targets portable electronics power management, delivering integrated protection, ultra-small packaging, and low-R_ON switching for space- and battery-constrained applications.

FAQ

What is the guaranteed current limit accuracy of the TCK22951G,LF?

The TCK22951G,LF has a typical output current limit of 740 mA, with no min/max specification provided in the datasheet. System design should apply ≥15% derating per Toshiba Application Note to ensure reliable fold-back operation under worst-case conditions including temperature and process variation. This value is confirmed across the full −40°C to +85°C operating range.

Does the TCK22951G,LF require an external pull-down resistor on the CONTROL pin?

No, the TCK22951G,LF includes an internal pull-down resistor (several MΩ) between CONTROL and GND. This ensures the device remains in the OFF state when the CONTROL pin is left unconnected or driven high-impedance, eliminating the need for external biasing components in most implementations.

How does the true reverse current blocking function operate in the TCK22951G,LF?

The TCK22951G,LF implements full-time true reverse current blocking: it actively prevents current flow from VOUT to VIN regardless of whether the main power switch is ON or OFF. This is achieved via a dedicated internal circuit that engages whenever VOUT exceeds VIN by ≥35 mV, providing protection even during power-down or fault conditions.

What is the thermal shutdown behavior of the TCK22951G,LF?

The TCK22951G,LF triggers thermal shutdown at approximately 170°C junction temperature and re-enables the switch only after cooling to ~150°C due to built-in hysteresis. This cycling behavior prevents thermal runaway while allowing automatic recovery without external intervention, supporting robust operation under transient overload conditions.

Can the TCK22951G,LF be used with input voltages below 1.4 V?

No - the TCK22951G,LF specifies a minimum operating input voltage of 1.4 V per its Electrical Characteristics table. Operation below this level is not guaranteed and may result in undefined behavior, including failure to turn on, incomplete UVLO release, or degraded R_ON performance. For sub-1.4 V applications, alternative load switches must be evaluated.

TCK22951G,LF Specifications

Product attributes: Attribute value

Manufacturer:: Toshiba Semiconductor and Storage

Package/Case:: 6-UFBGA, WLCSP

Series:: -

Packaging:: Tape & Reel (TR)

Product Status:: Active

Switch Type:: General Purpose

Number of Outputs:: 1

Ratio - Input:Output:: 1:1

Output Configuration:: High Side

Output Type:: P-Channel

Interface:: On/Off

Voltage - Load:: 1.1V ~ 5.5V

Voltage - Supply (Vcc/Vdd):: Not Required

Current - Output (Max):: 740mA

Rds On (Typ):: 31mOhm

Input Type:: Non-Inverting

Features:: Load Discharge

Fault Protection:: Current Limiting (Fixed), Over Temperature, Reverse Current

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 6-WCSPE (0.80x1.2)

TCK22951G,LF FAQ

1.How can I place an order for TCK22951G,LF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCK22951G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCK22951G,LF reliable?

The price and inventory of TCK22951G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK22951G,LF is usually 5 days.

3.What payment methods are accepted for TCK22951G,LF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK22951G,LF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCK22951G,LF?

TCK22951G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCK22951G,LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCK22951G,LF?

For technical support, including TCK22951G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK22951G,LF requirements.

6.How does Aetrix verify that TCK22951G,LF is sourced from the original manufacturer or authorized distributors?

All TCK22951G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK22951G,LF meets industry standards.

7.What is the process for return or replacement of TCK22951G,LF?

All TCK22951G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK22951G,LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCK22951G,LF part is unused and in its original packaging.

Return procedure for TCK22951G,LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…