Toshiba Semiconductor and Storage TCK22972G,LF

Overview

TCK22972G,LF from Toshiba Electronic Devices & Storage Corporation is a 2 A, 25 mΩ load switch IC with slew rate control and reverse current blocking, designed for power management in space-constrained portable electronics operating from 1.1 V to 5.5 V input. It features 666 μs controlled VOUT rise time, active-high control with internal pull-down, and built-in reverse current blocking when VIN = 0 V.

For engineers reviewing the TCK22972G,LF datasheet, TCK22972G,LF pinout, TCK22972G,LF application, or TCK22972G,LF equivalent, key selection criteria include slew-controlled turn-on timing, ultra-low quiescent current in ON/OFF states, WCSP6E package compatibility, and absence of output auto-discharge - critical for battery-powered systems requiring precise power sequencing and leakage control.

Technical Context

The TCK22972G,LF integrates a p-channel MOSFET pass switch with a dedicated slew rate control driver that limits dV/dt at VOUT to 666 μs (typ.) under 5 V input and 5 Ω/1 μF load conditions. Its reverse current blocking function operates independently when VIN = 0 V, preventing backflow from VOUT to VIN without external components.

Control logic is active-high with an integrated ~few-MΩ pull-down resistor ensuring default OFF state when the Control pin is floating. Unlike TCK2292xG variants, TCK22972G,LF omits output auto-discharge circuitry, simplifying discharge path design where rapid VOUT decay is not required.

Key Specifications

Pinout & Package

Package: WCSP6E (0.8 mm × 1.2 mm, thickness 0.55 mm), ultra-compact wafer-level chip-scale package with 0.4 mm pitch - optimized for high-density PCB layouts in smartphones and wearables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Compared with TCK22971G,LF and TPS22967DSGT, the TCK22972G,LF uniquely balances moderate slew control (666 μs), zero-external-component reverse blocking, and ultra-small WCSP6E packaging - making it optimal for battery-critical, space-constrained portable designs where both inrush mitigation and leakage prevention are mandatory.

Availability

TCK22972G,LF is available at Aetrix Electronics and suitable for smartphone power rail switching, wearable sensor subsystem enable, and USB-C peripheral power management requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for TCK22972G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on reliability and integration.

The TCK2292xG/TCK2297xG family targets portable electronics power management, delivering ultra-low IQ, slew-controlled switching, and reverse current blocking in wafer-level packages for maximum board-area efficiency.

FAQ

What is the maximum continuous output current rating for the TCK22972G,LF?

The TCK22972G,LF is rated for 2.0 A DC continuous output current under specified thermal conditions. This rating assumes proper PCB copper area and ambient temperature ≤85°C. Pulse current up to 3.0 A is allowed for 100 μs pulses at 2% duty cycle, but sustained operation above 2.0 A may exceed junction temperature limits and reduce reliability.

Does the TCK22972G,LF include output auto-discharge functionality?

No, the TCK22972G,LF does not include output auto-discharge. Per Toshiba's Function Table, auto-discharge is built into TCK2292xG variants only (e.g., TCK22921G). The TCK22972G,LF is explicitly marked "N/A" for this feature, meaning VOUT remains floating after turn-off unless externally discharged.

What is the purpose of the internal pull-down resistor on the Control pin of the TCK22972G,LF?

The internal pull-down resistor (~few MΩ) on the Control pin of the TCK22972G,LF ensures the device remains in the OFF state during power-up, MCU reset, or unconnected control lines. This eliminates the need for an external pull-down resistor and prevents unintended power delivery to downstream circuits before system initialization completes.

Can the TCK22972G,LF block reverse current when VIN is disconnected?

Yes, the TCK22972G,LF provides reverse current blocking when VIN = 0 V, limiting reverse leakage to ≤2 μA (max) at VOUT = 5.0 V. This function is implemented internally and requires no external components, protecting upstream supplies or batteries from backfeed when the input rail is powered down.

What package type and dimensions does the TCK22972G,LF use?

The TCK22972G,LF uses the WCSP6E package: a 0.8 mm × 1.2 mm wafer-level chip-scale package with 0.4 mm pitch and 0.55 mm thickness. It contains six terminals arranged in a 3×2 grid (A1/B1/VOUT, C1/GND, A2/B2/VIN, C2/Control), optimized for high-density portable PCB layouts.