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Toshiba Semiconductor and Storage TCK22973G,LF
- Part No.:
- TCK22973G,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 6-UFBGA, WLCSP
- Datasheet:
-
TCK22973G,LF.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 WCSP6E
- Quantity:
- Payment:
- Shipping:
Inventory:4,985
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Product details
Overview
TCK22973G,LF from Toshiba Electronic Devices & Storage Corporation is a 2 A, 25 mΩ load switch IC with slew rate control and reverse current blocking, designed for power management in space-constrained portable electronics operating from 1.1 V to 5.5 V input. It features 1364 μs VOUT rise time, active-high control with internal pull-down, and built-in reverse current blocking when VIN = 0 V.
For engineers reviewing the TCK22973G,LF datasheet, TCK22973G,LF pinout, TCK22973G,LF application, or TCK22973G,LF equivalent, key selection criteria include controlled inrush current (1364 μs rise time), ultra-small WCSP6E package (0.8 mm × 1.2 mm), low quiescent current (0.1 μA typ. in ON state at VIN = 1.8–5.5 V), and guaranteed reverse current blocking at VIN = 0 V.
Technical Context
The TCK22973G,LF integrates a p-channel MOSFET pass switch with slew rate control driver and reverse current blocking circuitry. Its 1364 μs rise time is fixed by internal RC timing and applies under VIN = 5.0 V, RL = 5 Ω, CL = 1.0 μF conditions.
It operates with active-high logic control and includes an internal pull-down resistor on the Control pin, ensuring default OFF state when un-driven. Unlike TCK2292xG variants, it lacks output auto-discharge functionality but retains full reverse current blocking when VIN = 0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 2.0 A DC - supports USB-powered peripherals and sensor rails requiring stable high-current switching |
| ON Resistance | 25 mΩ typ. at VIN = 5.0 V, IOUT = −0.5 A - minimizes conduction loss and thermal rise in 5 V rail switching |
| Rise Time | 1364 μs at VIN = 5.0 V - limits inrush current to ~0.37 A peak into 1 μF load capacitance, preventing supply droop |
| Input Voltage Range | 1.1 V to 5.5 V - enables use across Li-ion battery (2.7–4.2 V), LDO outputs (1.2–3.3 V), and USB 5 V domains |
| Quiescent Current | 0.1 μA typ. (ON state, VIN = 1.8–5.5 V) - extends battery life in always-on subsystems like real-time clocks or wake-up sensors |
| Reverse Blocking | Built-in at VIN = 0 V - prevents backfeed from powered VOUT to disconnected VIN, critical for hot-swap and battery backup paths |
| Control Logic | Active High with internal pull-down - eliminates need for external biasing; ensures safe default-OFF behavior |
Pinout & Package
Package: WCSP6E (0.8 mm × 1.2 mm, thickness 0.55 mm), ultra-compact wafer-level chip-scale package with solder bumps, optimized for high-density mobile PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, B1 | VOUT | Switched output node - connects to load; dual pins reduce trace resistance and improve current handling |
| C1 | GND | Power ground reference - shared return path for switch and control circuitry; must be low-impedance |
| A2, B2 | VIN | Input power supply - dual pins minimize voltage drop and thermal stress under 2 A load |
| C2 | Control | Active-high enable input - internal ~few-MΩ pull-down holds OFF during boot or floating states |
Key Features
| Feature | Design Value |
|---|---|
| Slew Rate Controlled Rise Time | Fixed 1364 μs at VIN = 5 V - ensures predictable inrush limiting without external RC components |
| Reverse Current Blocking | Active when VIN = 0 V - blocks backflow from VOUT to VIN, protecting upstream sources during hot-plug or battery removal |
| Ultra-Small WCSP6E Footprint | 0.8 mm × 1.2 mm area - saves >60% board space vs. comparable SOT-23 or DFN packages, enabling thinner smartphones and wearables |
| Low Quiescent Current | 0.1 μA typical in ON state - reduces standby power loss in always-on subsystems such as PMIC sequencers or sensor hubs |
| Integrated Pull-Down on Control | Internal few-MΩ resistor - guarantees known OFF state without external components, simplifying layout and reducing BOM count |
Applications
| Smartphone Power Rail Switching | USB-C Port Power Management |
|---|---|
|
Use Scenario: Enabling/disabling camera module or display backlight power in smartphone mainboard with strict size constraints. IC Role / Device Role / Timing Role: Load switch controlling 2 A VCCIO rail; slew rate control prevents system voltage sag during turn-on. Use Value: WCSP6E footprint fits within tight camera flex routing zones; 1364 μs rise time limits inrush to avoid brownout of baseband processor. |
Use Scenario: Managing VBUS power delivery to USB-C peripheral ports in docking stations or multi-port chargers. IC Role / Device Role / Timing Role: Hot-swap controller isolating downstream ports; reverse blocking protects host when peripheral is unplugged while powered. Use Value: Built-in reverse current blocking eliminates need for external back-to-back MOSFETs; 25 mΩ RON minimizes insertion loss in 5 V/2 A paths. |
| Wearable Sensor Hub Power Gating | IoT Edge Node Subsystem Enable |
|
Use Scenario: Power-gating MEMS accelerometer and gyroscope in fitness tracker during sleep mode to extend battery life. IC Role / Device Role / Timing Role: Low-IQ load switch enabling sensor subsystem only during motion detection windows. Use Value: 0.1 μA quiescent current preserves microamp-level sleep budget; active-high control syncs cleanly with MCU GPIO wake signals. |
Use Scenario: Sequencing power to BLE radio, environmental sensor, and flash memory in battery-powered smart sensor node. IC Role / Device Role / Timing Role: Primary rail switch for 3.3 V domain; slew control avoids interference with RF transmission startup timing. Use Value: Fixed 1364 μs rise time provides deterministic delay between enable assertion and RF ready signal, simplifying firmware timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK22972G,LF | 666 μs rise time (vs. 1364 μs); same package, RON, and control logic | Better suited for faster-ramping loads where 1.3 ms delay is excessive, e.g., low-capacitance logic rails | Select when faster turn-on is required without changing layout or control firmware |
| TPS22916BYFPR | 0.67 μs rise time, 24 mΩ RON, 1.8–5.5 V range, no reverse blocking at VIN = 0 V | Lacks reverse current blocking - requires external diode or design constraint to prevent backfeed | Choose if minimal rise time dominates over reverse blocking requirement and board space allows discrete protection |
Compared with TCK22973G,LF, TCK22972G,LF offers faster switching for less sensitive loads, while TPS22916BYFPR trades reverse blocking for sub-microsecond slew control - making TCK22973G,LF optimal where both controlled inrush and intrinsic backfeed prevention are mandatory in ultra-compact designs.
Availability
TCK22973G,LF is available at Aetrix Electronics and suitable for smartphone power rail switching, USB-C port management, wearable sensor hub gating, and IoT edge node subsystem enable requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for TCK22973G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive applications, with emphasis on power management and analog integration.
The TCK2292xG/TCK2297xG family delivers ultra-compact, low-RON load switches with programmable slew rates for portable electronics demanding precise inrush control and reverse current protection without external components.
FAQ
What is the maximum continuous output current rating for the TCK22973G,LF?
The TCK22973G,LF is rated for 2.0 A DC continuous output current under specified thermal conditions. This rating assumes proper PCB layout per Toshiba's recommended land pattern and ambient temperature ≤ 85°C. Pulse current up to 3.0 A is allowed for 100 μs pulses at 2% duty cycle, but sustained operation above 2.0 A may exceed junction temperature limits and compromise reliability.
Does the TCK22973G,LF provide output auto-discharge functionality?
No, the TCK22973G,LF does not include output auto-discharge. This feature is present only in the TCK2292xG series (e.g., TCK22921G). The TCK22973G,LF is specifically configured without the discharge FET, simplifying its internal structure and reducing leakage paths - making it suitable for applications where rapid VOUT decay is unnecessary or undesirable.
What is the purpose of the internal pull-down resistor on the Control pin of the TCK22973G,LF?
The internal pull-down resistor on the Control pin of the TCK22973G,LF ensures the device remains in the OFF state during power-up, reset, or when the control signal is left floating. With a value of several MΩ, it provides a defined logic-low default without requiring external components, improving system robustness and reducing BOM count in space-constrained designs.
Can the TCK22973G,LF block reverse current when VIN is disconnected but VOUT remains powered?
Yes, the TCK22973G,LF includes built-in reverse current blocking that activates when VIN = 0 V. This function prevents current from flowing backward from a powered VOUT node into the now-open VIN rail - a critical capability for hot-swap scenarios, battery-backed systems, and USB OTG configurations where VOUT may retain voltage after upstream power removal.
What is the typical ON-resistance of the TCK22973G,LF at 1.8 V input voltage?
The typical ON-resistance of the TCK22973G,LF is 52 mΩ at VIN = 1.8 V and IOUT = −0.5 A. This value increases as input voltage decreases due to reduced gate overdrive on the internal p-channel MOSFET. At 1.2 V input, RON rises to 104 mΩ typ., confirming the device's suitability for ≥1.1 V operation but highlighting the importance of verifying conduction loss in low-voltage battery applications.
TCK22973G,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 6-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 1.1V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2A
- Rds On (Typ):
- 25mOhm
- Input Type:
- Non-Inverting
- Features:
- Slew Rate Controlled
- Fault Protection:
- Reverse Current
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WCSPE (0.80x1.2)
TCK22973G,LF FAQ
1.How can I place an order for TCK22973G,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCK22973G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCK22973G,LF reliable?
The price and inventory of TCK22973G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK22973G,LF is usually 5 days.
3.What payment methods are accepted for TCK22973G,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK22973G,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCK22973G,LF?
TCK22973G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCK22973G,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCK22973G,LF?
For technical support, including TCK22973G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK22973G,LF requirements.
6.How does Aetrix verify that TCK22973G,LF is sourced from the original manufacturer or authorized distributors?
All TCK22973G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK22973G,LF meets industry standards.
7.What is the process for return or replacement of TCK22973G,LF?
All TCK22973G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK22973G,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCK22973G,LF part is unused and in its original packaging.
Return procedure for TCK22973G,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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