Toshiba Semiconductor and Storage TCK22975G,LF

Overview

TCK22975G,LF from Toshiba Electronic Devices & Storage Corporation is a 2 A, 25 mΩ load switch IC with active-low control, slew rate control, and reverse current blocking-designed for power sequencing in portable electronics operating from 1.1 V to 5.5 V input. It features 666 μs output rise time, built-in reverse current blocking at VIN = 0 V, and no output auto-discharge function.

For engineers reviewing the TCK22975G,LF datasheet, TCK22975G,LF pinout, TCK22975G,LF application, or TCK22975G,LF equivalent, key selection criteria include its active-low control logic, absence of pull-down resistor on Control pin, WCSP6E ultra-small package (0.8 mm × 1.2 mm), and verified 2 A DC output capability with 25 mΩ R_ON at 5.0 V.

Technical Context

The TCK22975G,LF integrates a p-channel MOSFET pass switch with slew rate control driver and reverse current blocking circuitry activated when VIN = 0 V. Its active-low control interface requires external biasing-no internal pull-down resistor-distinguishing it from TCK2297xG variants with pull-down.

It operates across 1.1–5.5 V input range with quiescent current as low as 0.07 μA (OFF state) and supports up to 2 A continuous DC load. Rise time is fixed at 666 μs (VIN = 5.0 V, RL = 5 Ω, CL = 1.0 μF), enabling controlled inrush current management without external RC networks.

Key Specifications

Pinout & Package

Package: WCSP6E (0.8 mm × 1.2 mm, thickness 0.55 mm), ultra-compact wafer-level chip-scale package with 0.4 mm pitch - optimized for high-density mobile PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Compared with TCK22972G,LF, the TCK22975G,LF removes the internal pull-down-requiring explicit control biasing but eliminating weak leakage paths. Against TPS22916CLYR, it trades adjustable slew rate for zero-component simplicity and lower OFF-state IQ (0.07 μA vs. 0.5 μA).

Availability

TCK22975G,LF is available at Aetrix Electronics and suitable for smartphone power sequencing, wearable sensor enable, USB-C peripheral isolation, and industrial IoT wake control requiring stable component supply, full lifecycle traceability, and RoHS-compliant packaging.

Supply support for TCK22975G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive applications-with emphasis on power management, motor control, and analog signal conditioning.

The TCK2297xG series targets ultra-compact, low-quiescent-power load switching in battery-powered portable devices-prioritizing minimal footprint, precise inrush control, and robust reverse-blocking protection.

FAQ

What is the control logic polarity of the TCK22975G,LF?

The TCK22975G,LF uses active-low control logic: the internal p-channel MOSFET turns ON when the Control pin voltage is below 0.4 V (V_IL), and turns OFF when above 1.0 V (V_IH). Unlike other TCK2297xG variants, the TCK22975G,LF has no internal pull-down resistor-so the Control pin must be actively driven high or low. This ensures deterministic behavior in systems where floating pins could cause unintended power-up sequences.

Does the TCK22975G,LF provide output auto-discharge functionality?

No, the TCK22975G,LF does not include output auto-discharge. Per Toshiba's function table, this feature is explicitly marked "N/A" for the TCK22975G,LF-unlike TCK2292xG variants which integrate an n-channel discharge FET. As a result, the VOUT node remains floating after shutdown, preserving charge on downstream capacitors. This behavior is intentional for applications requiring fast wake-up or retention of bias conditions across power cycles.

What is the maximum continuous output current rating for the TCK22975G,LF?

The TCK22975G,LF is rated for 2.0 A DC continuous output current under specified thermal conditions (mounted on FR4 board per Toshiba's derating curve). Absolute maximum rating permits 3.0 A pulsed (100 μs, 2% duty cycle). Real-world sustained current depends on ambient temperature, PCB copper area, and VIN–VOUT differential; at 85°C ambient and 5.0 V input, derated capacity is ~1.4 A based on 800 mW power dissipation limit.

How does reverse current blocking work in the TCK22975G,LF?

The TCK22975G,LF provides reverse current blocking only when VIN = 0 V-i.e., the input rail is fully disconnected or grounded. In this state, an internal circuit prevents current flow from VOUT back into VIN, protecting upstream sources like batteries or dead PMIC rails. This function is independent of switch state (ON/OFF) and does not activate during normal operation with VIN > 0 V. It is not a bidirectional blocking device.

What package type and dimensions does the TCK22975G,LF use?

The TCK22975G,LF is housed in the WCSP6E wafer-level chip-scale package: 0.8 mm × 1.2 mm footprint, 0.55 mm height, and 0.4 mm pin pitch. It contains six terminals arranged in a 2×3 grid (A1/B1/VOUT, C1/GND, A2/B2/VIN, C2/Control). Land pattern dimensions and solder mask recommendations are provided in Toshiba's Package Dimension document (Rev. 2026-04-15), and weight is 1 mg typical.