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Toshiba Semiconductor and Storage TCK301G,LF
- Part No.:
- TCK301G,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 9-UFBGA, WLCSP
- Datasheet:
-
TCK301G,LF.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:1 9WCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,603
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Product details
Overview
TCK301G,LF from Toshiba is a 28 V single-input/single-output load switch IC with over-voltage protection (OVLO = 6.6 V), reverse current blocking, and thermal shutdown. It delivers 3 A DC output current with 73 mΩ typical ON resistance at 4.5 V input and operates across −40°C to +85°C. Designed for battery charge management in space-constrained portable electronics.
For engineers reviewing the TCK301G,LF datasheet, TCK301G,LF pinout, TCK301G,LF application, or TCK301G,LF equivalent, this page provides verified functional specifications, WCSP9 package layout, FLAG signal behavior, OVLO/UVLO thresholds, and validated alternative options for power rail control in high-density mobile designs.
Technical Context
The TCK301G,LF integrates an N-channel MOSFET main switch with slew-rate-controlled gate drive, enabling inrush current reduction and stable VOUT ramp-up (tr = 2 ms). Its dual-stage protection includes programmable OVLO (6.6 V typ.) and UVLO (2.9 V typ.), both with hysteresis, plus thermal shutdown triggered at 150°C junction temperature.
Control logic uses active-low CE and active-high VCT pins with internal 530 kΩ pull-up on VCT and pull-down on CE. The open-drain FLAG pin asserts high-impedance during OVLO/UVLO violation or thermal shutdown, and drives low only when VIN is within valid range and CE is asserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Input Voltage | 28 V - supports wide-range industrial and USB PD-compatible rails without external clamping |
| DC Output Current | 3.0 A - sustains continuous load in battery charging and system power rail switching |
| ON Resistance | 73 mΩ (typ.) at VIN = 4.5 V, IOUT = −1.0 A - minimizes conduction loss and self-heating at 1 A |
| OVLO Threshold | 6.6 V (typ.), rising; 6.25 V (min) - protects downstream circuitry from overvoltage transients in 5 V systems |
| UVLO Threshold | 2.9 V (typ.), rising; 2.3 V (min) - prevents erratic operation during brown-out or weak battery conditions |
| FLAG Function | Open-drain output active only when VIN ∈ [2.9 V, 6.6 V] and CE = low - enables system-level fault detection without additional logic |
| Package Thermal Rating | PD = 1.65 W on 4-layer FR4 (40 mm × 40 mm) - defines maximum continuous power under standard PCB layout |
Pinout & Package
Supplied in ultra-compact WCSP9 package (1.5 mm × 1.5 mm, 0.5 mm pitch, 0.5 mm height), optimized for high-density portable PCBs with minimal footprint and thermal mass.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | FLAG | Open-drain status indicator - high-Z during OVLO/UVLO/thermal shutdown; pulled low only when valid VIN and CE active |
| A2 | VCT | Active-high switch control - internally pulled up to VOP; accepts control voltage ≥1.6 V regardless of VIN level |
| A3 | CE | Active-low chip enable - internally pulled down; requires <0.3 V to activate switch |
| B1, C1 | VIN | Main power input - feeds OVLO/UVLO comparators and supplies charge pump; dual-bump configuration lowers impedance |
| B2, C2 | GND | Power ground reference - dual-bump layout reduces ground loop inductance for stable switching |
| B3, C3 | VOUT | Switched output - features reverse current blocking when switch is off; connects directly to load |
Key Features
| Feature | Design Value |
|---|---|
| Reverse current blocking | Active in SW OFF state - prevents backflow from VOUT to VIN, eliminating need for external diode in battery backup paths |
| Inrush current reduction | Slew-rate controlled turn-on (tr = 2 ms) - limits peak surge current into capacitive loads, avoiding supply droop or reset events |
| Thermal shutdown | Auto-recovery at Tj < 150°C - halts conduction before silicon damage, with no latch-up; resumes after cooldown |
| Internal biasing | 530 kΩ pull-up on VCT, 530 kΩ pull-down on CE - eliminates external resistors for basic enable/disable control |
| Startup hold time | 15 ms internal delay - ensures charge pump stabilizes before VOUT ramps, preventing premature flag assertion |
Applications
| Smartphone Battery Charging | USB-C Power Delivery Rail Switching |
|---|---|
Use Scenario: Isolating battery charger IC from system rail during fast-charge sequencing to prevent cross-regulation and thermal conflict. IC Role / Device Role / Timing Role: Load switch controlling power path between charger output and PMIC input, with OVLO guarding against adapter overvoltage. Use Value: 73 mΩ RON minimizes voltage drop at 3 A, preserving charging efficiency; reverse blocking avoids discharge through charger when off. | Use Scenario: Enabling/disabling VBUS power delivery to peripheral ports based on negotiation status and cable detection. IC Role / Device Role / Timing Role: Single-pole power gate managing 5–20 V VBUS routing, coordinated with USB PD controller via CE/VCT signals. Use Value: 28 V rating supports full USB PD 3.0 range; FLAG confirms valid input before enabling downstream converters. |
| Wearable Device Power Sequencing | Industrial Sensor Node Power Gating |
Use Scenario: Staggering power-up of RF transceiver, MCU, and analog front-end to limit inrush and avoid brown-out on coin-cell or small Li-ion sources. IC Role / Device Role / Timing Role: Low-quiescent-current (130 μA ON, 75 μA OFF) rail switch enabling precise timing-controlled power domain activation. Use Value: 15 ms startup hold ensures stable VOUT before firmware initiates next stage; UVLO prevents operation below battery cutoff. | Use Scenario: Disconnecting sensor subsystem during sleep mode to reduce system standby current in battery-powered IoT nodes. IC Role / Device Role / Timing Role: High-reliability load switch with thermal shutdown, deployed in unventilated enclosures exposed to ambient temperatures up to 85°C. Use Value: 1.65 W thermal rating on standard FR4 allows 3 A operation without heatsink; reverse blocking preserves sensor bias during deep sleep. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS22916BLYFPR | Lower max VIN (5.5 V), no OVLO/UVLO, 34 mΩ RON at 3.3 V | Targeted at low-voltage logic rails only; lacks overvoltage protection and thermal shutdown | Select when operating strictly ≤5.5 V and external OVLO/thermal monitoring is already implemented |
| NIS5132MN3T1G | Higher RON (120 mΩ), no FLAG, no UVLO, 20 V max VIN | Designed for cost-sensitive consumer power gating; lacks diagnostic signaling and wide-VIN capability | Choose where board space permits larger SOIC-8 and OVLO/FLAG are non-critical |
Compared with TCK301G,LF, the TPS22916BLYFPR offers lower conduction loss but cannot replace it in 6–28 V systems requiring autonomous overvoltage protection. The NIS5132MN3T1G provides simpler control but lacks the integrated safety functions essential for battery-connected applications.
Availability
TCK301G,LF is available at Aetrix Electronics and suitable for smartphone battery charging, USB-C power delivery rail switching, and wearable device power sequencing requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for TCK301G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions for automotive, industrial, and consumer markets, with emphasis on power management and analog integration.
The TCK30 series targets compact, high-efficiency power rail control in portable electronics, delivering integrated protection (OVLO/UVLO/thermal), reverse blocking, and diagnostic feedback in wafer-level CSP packages.
FAQ
What is the overvoltage lockout threshold for TCK301G,LF?
The TCK301G,LF has a typical overvoltage lockout (OVLO) rising threshold of 6.6 V, with a guaranteed minimum of 5.9 V and maximum of 7.3 V across −40°C to +85°C. This setting makes TCK301G,LF ideal for protecting 5 V systems from adapter overvoltage while allowing margin for ripple. The falling threshold is VOVL_RI − 0.35 V, ensuring hysteresis to prevent chatter near trip point.
Does TCK301G,LF support reverse current blocking?
Yes, TCK301G,LF actively blocks reverse current when the main switch is turned off - a key feature confirmed in its block diagram and Operation Logic Table. This function eliminates the need for an external blocking diode in battery-backed or redundant power path designs. The reverse blocking current is specified at ≤0.1 μA (typ.) and ≤10 μA (max) at 5 V, ensuring minimal leakage in off-state.
What is the purpose of the FLAG pin on TCK301G,LF?
The FLAG pin on TCK301G,LF is an open-drain status output that goes high-impedance during OVLO, UVLO, CE deassertion, or thermal shutdown - and pulls low only when VIN is within valid range (2.9 V < VIN < 6.6 V) and CE is low. This allows microcontrollers to monitor power health without polling. TCK301G,LF's FLAG behavior is explicitly defined in the PIN Description and Operation Logic Table, confirming its use as a system-level fault indicator.
What package type does TCK301G,LF use, and what are its dimensions?
TCK301G,LF uses the WCSP9 (Wafer Chip Scale Package, 9-bump) package: 1.5 mm × 1.5 mm footprint, 0.5 mm pitch, and 0.5 mm typical height. Its weight is 3.5 mg (typ.). This ultra-small package is documented in the Package Dimensions and Land Pattern sections of the official Toshiba datasheet, and is optimized for high-density portable PCBs where space and thermal mass are constrained.
How does the thermal shutdown function operate in TCK301G,LF?
TCK301G,LF incorporates thermal shutdown that activates at 150°C junction temperature, turning off the main switch and forcing FLAG to high-impedance. Recovery is automatic once junction temperature falls below the release threshold (not explicitly stated but implied by "thermal shutdown release" in Timing Chart Fig.1). This behavior is confirmed in the Block Diagram, Operation Logic Table, and Absolute Maximum Ratings (Tj = 150°C), making TCK301G,LF suitable for unventilated or thermally dense layouts.
TCK301G,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 9-UFBGA, WLCSP
- Series:
- TCK30
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 18V (Max)
- Voltage - Supply (Vcc/Vdd):
- 2.3V ~ 28V
- Current - Output (Max):
- 3A
- Rds On (Typ):
- 73mOhm
- Input Type:
- -
- Features:
- Slew Rate Controlled, Status Flag
- Fault Protection:
- Over Temperature, Over Voltage, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 9-WCSP (1.5x1.5)
TCK301G,LF FAQ
1.How can I place an order for TCK301G,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCK301G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCK301G,LF reliable?
The price and inventory of TCK301G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK301G,LF is usually 5 days.
3.What payment methods are accepted for TCK301G,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK301G,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCK301G,LF?
TCK301G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCK301G,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCK301G,LF?
For technical support, including TCK301G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK301G,LF requirements.
6.How does Aetrix verify that TCK301G,LF is sourced from the original manufacturer or authorized distributors?
All TCK301G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK301G,LF meets industry standards.
7.What is the process for return or replacement of TCK301G,LF?
All TCK301G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK301G,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCK301G,LF part is unused and in its original packaging.
Return procedure for TCK301G,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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