Toshiba Semiconductor and Storage TCK305G,LF
- Part No.:
- TCK305G,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 9-UFBGA, WLCSP
- Datasheet:
-
TCK305G,LF.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:1 9WCSP
- Quantity:
- Payment:

- Shipping:

Inventory:1,217
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Product details
Overview
TCK305G from Toshiba is a 28 V high-input-voltage, single-input–single-output load switch IC with overvoltage protection (OVLO = 10.5 V typ.), reverse current blocking, and thermal shutdown. It delivers 3.0 A DC output current with 73 mΩ typical ON resistance at 4.5 V input and –1.0 A load, and features active-low CE/VCT control, open-drain FLAG output, and inrush current reduction-designed for battery charge management in space-constrained portable electronics.
For engineers reviewing the TCK305G datasheet, TCK305G pinout, TCK305G application, or TCK305G equivalent, key selection considerations include its WCSP9 ultra-small package (1.5 mm × 1.5 mm), dual UVLO/OVLO thresholds (2.9 V / 10.5 V), slew-rate-controlled turn-on, and guaranteed reverse current blocking in OFF state-critical for power rail sequencing and fault-protected battery systems.
Technical Context
The TCK305G integrates an N-channel MOSFET main switch with internal charge pump, enabling low RON operation across 2.3–28 V input range. Its dual-lockout circuitry independently monitors VIN against UVLO (2.9 V rising) and OVLO (10.5 V rising) thresholds to disable switching outside safe voltage windows.
Control logic combines active-low CE and VCT pins with internal 530 kΩ pull-down resistors; FLAG asserts high-impedance only when VIN is within valid range and thermal shutdown is inactive. The device implements hardware-based inrush limiting via controlled VOUT rise time (~2 ms) and blocks reverse current by fully isolating VOUT from VIN when switched off.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Input Voltage | 28 V - supports wide-range industrial and automotive-supplied rails without external regulation |
| Continuous Output Current | 3.0 A DC - enables direct powering of high-current peripherals like USB-PD sinks or charging circuits |
| ON Resistance | 73 mΩ typ. at VIN = 4.5 V, IOUT = –1.0 A - minimizes conduction loss and self-heating under load |
| Overvoltage Lockout | 10.5 V typ. rising threshold - protects downstream circuitry from transient overvoltage events |
| Under Voltage Lockout | 2.9 V typ. rising threshold - prevents erratic behavior during brown-out or battery depletion |
| Thermal Shutdown | Active at Tj ≥ 150 °C - autonomous shutdown prevents permanent damage during sustained overload |
| Reverse Current Blocking | Enabled in SW OFF state - eliminates backfeed from VOUT to VIN, critical for multi-rail isolation |
Pinout & Package
Package: WCSP9 (Wafer Chip Scale Package, 1.5 mm × 1.5 mm, 0.5 mm pitch, 3.5 mg typical weight). Ultra-compact footprint optimized for high-density mobile PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | FLAG | Open-drain status indicator: high-Z when VIN in valid range (2.9–10.5 V) and no thermal fault |
| A2 | VCT | Active-low switch control input with internal 530 kΩ pull-down - enables direct MCU GPIO drive without external resistor |
| A3 | CE | Active-low chip enable with internal 530 kΩ pull-down - provides hardware-level system power gating |
| B1, C1 | VIN | Main power input with integrated OVLO/UVLO sensing - accepts up to 28 V with ±0.3 V absolute max rating |
| B2, C2 | GND | Power ground reference for internal LDOs, charge pump, and protection circuitry |
| B3, C3 | VOUT | Switched output node - isolated from VIN during OFF state to block reverse current |
Key Features
| Feature | Design Value |
|---|---|
| Integrated inrush current reduction | VOUT rise time limited to ~2 ms - prevents supply rail collapse during hot-plug events |
| Hardware-enforced reverse current blocking | Physically isolates VOUT from VIN when OFF - eliminates need for external back-to-back FETs |
| Internal 15 ms startup hold | Delays VOUT activation until internal charge pump stabilizes - ensures reliable turn-on under varying load capacitance |
| Dual independent voltage lockouts | UVLO (2.9 V) and OVLO (10.5 V) operate independently - enables precise rail monitoring without software intervention |
| Ultra-low quiescent current | 75 μA typ. in OFF state (IQ(OFF1)) - extends battery life in always-on standby applications |
Applications
| Battery Charging Circuit | USB Power Delivery Sink |
|---|---|
Use Scenario: Isolating battery charger IC from system rail during charging termination or fault conditions. IC Role / Device Role / Timing Role: Load switch providing controlled power path enable/disable with reverse current blocking. Use Value: Prevents battery discharge into system rail when charger is disabled; eliminates need for discrete back-to-back MOSFETs. |
Use Scenario: Enabling/disabling 5–20 V power delivery paths to USB-C peripherals based on policy controller commands. IC Role / Device Role / Timing Role: High-voltage, high-current load switch with OVLO protection for PD negotiation compliance. Use Value: Withstands 28 V transients while delivering 3 A continuously; OVLO prevents damage from accidental 20 V misapplication. |
| Portable Medical Sensor Hub | Industrial IoT Edge Node |
Use Scenario: Power-gating sensor subsystems (e.g., ECG, SpO₂) to meet strict battery runtime targets in wearable devices. IC Role / Device Role / Timing Role: Low-quiescent-current load switch with precise UVLO for battery health-aware power control. Use Value: 75 μA OFF-state IQ and 2.9 V UVLO ensure clean shutdown before battery reaches critical depletion voltage. |
Use Scenario: Managing auxiliary power rails (e.g., RS-485 transceivers, isolated ADCs) in field-deployed edge gateways. IC Role / Device Role / Timing Role: Robust load switch with thermal shutdown and reverse blocking for unattended operation. Use Value: Thermal shutdown at 150 °C and reverse current blocking prevent cascading failures in sealed enclosures with limited airflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS22916BLYFPR | Lower max VIN (5.5 V), higher RON (80 mΩ), no OVLO/UVLO, smaller WCSP6 package | Targeted for low-voltage digital rails only; lacks voltage supervision for battery or industrial inputs | Select when operating strictly below 5.5 V and board space is more constrained than voltage margin. |
| RT9711CGJ5 | Higher max VIN (36 V), similar RON (75 mΩ), includes programmable soft-start but no FLAG output | Supports wider input range but omits status feedback - requires external monitoring for fault detection | Select when extended input range is required and system-level FLAG functionality can be implemented externally. |
Compared with TCK305G, the TPS22916BLYFPR trades voltage robustness for smaller size and lower cost in low-VIN applications, while the RT9711CGJ5 extends input range but removes the integrated FLAG diagnostic signal-making TCK305G optimal where compact 28 V operation with real-time status reporting is essential.
Availability
TCK305G is available at Aetrix Electronics and suitable for battery charge management, USB-C power delivery sink control, and portable medical sensor hub power gating requiring stable component supply and long-term lifecycle support.
Supply support for TCK305G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power efficiency and miniaturization.
The TCK30 series was developed specifically for high-density portable electronics requiring robust, ultra-compact load switching with integrated voltage supervision and reverse current protection-targeting smartphone, wearables, and battery-powered IoT endpoints.
FAQ
What is the maximum continuous output current rating for the TCK305G?
The TCK305G supports 3.0 A DC continuous output current under specified thermal conditions (mounted on FR4 4-layer board). This rating assumes proper PCB copper area and ambient temperature ≤85°C. Pulse current capability reaches 4.0 A for 1 ms pulses at 1% duty cycle, as defined in Absolute Maximum Ratings.
Does the TCK305G provide reverse current blocking, and how is it implemented?
Yes, the TCK305G provides hardware-enforced reverse current blocking when the main switch is OFF. This is achieved through internal N-channel MOSFET architecture that physically isolates VOUT from VIN. Unlike passive diode-based solutions, this feature eliminates forward voltage drop and associated power loss, making it ideal for bidirectional power path integrity in battery systems.
What are the voltage thresholds for overvoltage and undervoltage lockout in the TCK305G?
The TCK305G features a typical overvoltage lockout (OVLO) threshold of 10.5 V (rising) with ±1.4 V tolerance, and a typical undervoltage lockout (UVLO) threshold of 2.9 V (rising) with ±0.6 V tolerance. Both functions operate independently and disable the main switch when VIN falls outside the 2.9–10.5 V window, ensuring safe operation across battery discharge and surge conditions.
How does the FLAG pin function in the TCK305G?
The FLAG pin on the TCK305G is an open-drain output that goes high-impedance only when VIN is within the valid UVLO–OVLO window (2.9–10.5 V), CE is asserted LOW, and thermal shutdown is inactive. Outside these conditions-including during UVLO/OVLO faults or thermal shutdown-the FLAG pin pulls low. This provides real-time hardware status feedback without requiring microcontroller polling.
What is the package type and size of the TCK305G, and what are its mounting requirements?
The TCK305G uses the WCSP9 package: a 1.5 mm × 1.5 mm wafer-level chip-scale package with 0.5 mm pitch and typical height of 0.5 mm. It requires standard reflow soldering per JEDEC J-STD-020. Mounting must follow the specified land pattern (provided in Toshiba's package drawing), and thermal performance depends on using a 4-layer FR4 board (40 mm × 40 mm) with adequate copper pour under the die for heat dissipation.
TCK305G,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package/Case:
- 9-UFBGA, WLCSP
- Series:
- TCK30
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.3V ~ 28V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 3A
- Rds On (Typ):
- 73mOhm
- Input Type:
- -
- Features:
- Slew Rate Controlled, Status Flag
- Fault Protection:
- Over Temperature, Over Voltage, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 9-WCSP (1.5x1.5)
TCK305G,LF FAQ
1.How can I place an order for TCK305G,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCK305G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCK305G,LF reliable?
The price and inventory of TCK305G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK305G,LF is usually 5 days.
3.What payment methods are accepted for TCK305G,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK305G,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCK305G,LF?
TCK305G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCK305G,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCK305G,LF?
For technical support, including TCK305G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK305G,LF requirements.
6.How does Aetrix verify that TCK305G,LF is sourced from the original manufacturer or authorized distributors?
All TCK305G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK305G,LF meets industry standards.
7.What is the process for return or replacement of TCK305G,LF?
All TCK305G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK305G,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCK305G,LF part is unused and in its original packaging.
Return procedure for TCK305G,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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