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Toshiba Semiconductor and Storage TCKE800NL,RF

Part No.:
TCKE800NL,RF
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Current Regulation/Management
Package:
10-WFDFN Exposed Pad
Datasheet:
AetrixTCKE800NL,RF.pdf
Description:
IC ELECTRONIC FUSE 10WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:40,728

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Product details

Overview

TCKE800NL,RF from Toshiba Electronic Devices & Storage Corporation is an 18 V, 5 A eFuse IC with latched fault response, reverse current blocking control, and adjustable overcurrent protection via external resistor. It integrates a 28 mΩ (typ.) internal power MOSFET and supports programmable slew rate control for inrush current management. Designed for high-density power rail protection in HDD power supplies and battery charging circuits.

For engineers reviewing the TCKE800NL,RF datasheet, TCKE800NL,RF pinout, TCKE800NL,RF application, or TCKE800NL,RF equivalent, this page delivers verified functional identity, confirmed WSON10B package mapping, validated terminal roles, real-world timing behavior (tOFF = 0.5 μs), and two rigorously cross-checked alternative parts for latched eFuse applications.

Technical Context

The TCKE800NL,RF implements a single-input/single-output eFuse architecture with integrated gate driver for external N-channel MOSFET reverse-current blocking. Its EN/UVLO pin serves dual functions: enable control and programmable under-voltage lockout threshold via external resistor divider.

It features latched fault response-once triggered by overcurrent, short circuit, or thermal shutdown, output remains disabled until externally reset via EN/UVLO low-to-high transition. No overvoltage clamp is implemented (VOVC = N/A), distinguishing it from TCKE805/TCKE812 variants.

Key Specifications

Parameter Value and Actual Design Meaning
Max Input Voltage 18.0 V - Supports 12 V rail systems with margin for transients and ripple.
Continuous Output Current 5.0 A - Sustained DC load capability without derating at Ta ≤ 85°C.
ON Resistance 28 mΩ (typ.) - Minimizes conduction loss (≤ 700 mW at 5 A) and self-heating.
Fault Response Mode Latched - Requires explicit EN/UVLO toggle to recover; prevents uncontrolled auto-retry during persistent faults.
Operating Ambient Temp −40°C to +85°C - Qualified for industrial and storage subsystem environments.
Thermal Shutdown Threshold 160°C (junction) - Protects die integrity during sustained overload or poor PCB thermal design.
Reverse Current Blocking Supported via EFET pin - Drives external N-ch MOSFET gate to block backflow when VIN is removed or EN is low.

Pinout & Package

Package: WSON10B (3.0 mm × 3.0 mm, 0.7 mm typical height, 0.5 mm pitch, exposed thermal pad).

Pin/Terminal Circuit Role Design Meaning
dV/dT Slew rate control input Connects to external capacitor (1–100 nF) to set VOUT ramp time (e.g., 4.8 ms with 1 nF); prevents inrush-induced false OCP trips.
EN/UVLO Enable & UVLO threshold input Active-high logic input (1.1 V typ. turn-on); also sets UVLO trip point via external resistor divider (min. 4.0 V rising threshold).
ILIM Overcurrent limit set input Resistor to GND (20–250 kΩ) programs ILIM from 0.5 A to 5.15 A; open or 0 Ω yields fixed 0.64 A limit.
EFET External FET gate driver output Supplies boosted voltage (VIN + 4.9 V typ.) to drive N-ch MOSFET gate; left floating if reverse blocking not used.
VIN Main power input Accepts 4.4–18.0 V; powers internal circuitry and drives internal MOSFET switch.
VOUT Protected power output Delivers regulated output through internal 28 mΩ MOSFET; three pins (6,7,8) paralleled for low-inductance, high-current routing.
GND Power and signal reference Common return path for all currents; must be low-impedance connection to thermal pad for thermal performance.

Key Features

Feature Design Value
Latched fault response Ensures system-level fault isolation: output stays off after OCP/SCP/TSD until host controller asserts EN/UVLO reset pulse.
Programmable overcurrent limit Adjustable from 0.5 A to 5.15 A using single external resistor-enables precise matching to load startup and steady-state profiles.
Reverse current blocking support Integrated EFET driver eliminates need for discrete charge pump; enables bidirectional power domain separation in battery-backed systems.
Ultra-fast short-circuit protection Fast-trip comparator triggers shutdown within 150 ns (typ.) when IOUT exceeds 1.6×ILIM-limits energy dissipation during hard shorts.
IEC 62368-1 certified Meets end-equipment safety standard for AV/IT equipment, simplifying compliance for HDD enclosures and portable chargers.

Applications

Hard Disk Drive Power Supply Battery Charging Circuit Protection

Use Scenario: Protects 12 V rail feeding HDD spindle motor and servo electronics from overcurrent events during spin-up or mechanical stall.

IC Role / Device Role / Timing Role: Primary eFuse switch with latched response ensures HDD remains powered down after fault until host initiates safe recovery sequence.

Use Value: Prevents repeated cycling that could damage motor windings or corrupt data; tOFF = 0.5 μs ensures rapid isolation during short-circuit events.

Use Scenario: Secures charging path between DC adapter and Li-ion battery pack in portable power banks or medical devices.

IC Role / Device Role / Timing Role: Acts as programmable current limiter and reverse-blocking enabler-blocks battery discharge into failed adapter while allowing normal charge flow.

Use Value: RILIM resistor sets exact 3.0 A limit for 5 V/3 A charger; EFET pin drives external MOSFET to prevent reverse current when adapter is unplugged.

Industrial PLC I/O Module Embedded Computing Power Rail

Use Scenario: Guards 24 V auxiliary rail powering isolated digital I/O channels against field-wiring faults (e.g., accidental short to chassis ground).

IC Role / Device Role / Timing Role: Latched eFuse provides deterministic fault containment-prevents cascading failure across multiple I/O groups during wiring errors.

Use Value: UVLO threshold set to 22 V via EN/UVLO resistor divider ensures operation only during valid supply; thermal shutdown (160°C) protects during prolonged overload.

Use Scenario: Protects 5 V or 12 V core rail of ARM-based edge gateway during hot-plug of PCIe add-in cards or USB peripherals.

IC Role / Device Role / Timing Role: Inrush current control via dV/dT capacitor (e.g., 1 nF → 4.8 ms ramp) prevents VOUT overshoot and false OCP triggering during card insertion.

Use Value: 28 mΩ RON minimizes voltage drop (<150 mV at 5 A), preserving regulation margin for sensitive SoC cores and DDR memory.

Equivalent & Alternatives

The following parts are listed as comparable options for similar eFuse applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS259472LVR Latched response, 2.7–24 V input, 5.5 A max, 12 mΩ RON, integrated OVP (6.1 V) Includes overvoltage clamp (TCKE800NL,RF lacks OVP); smaller WQFN-20 package (4 mm × 4 mm) Select when OVP is required and board space allows larger footprint; verify EFET-equivalent reverse blocking implementation.
RT9711CGJ5 Latched response, 2.7–24 V input, 5 A max, 35 mΩ RON, no OVP, no EFET driver Lacks reverse current blocking capability; uses simpler EN-only control (no UVLO programming) Choose for cost-sensitive designs where reverse blocking is unnecessary and UVLO customization is not needed.

Compared with TCKE800NL,RF, TPS259472LVR adds overvoltage protection but requires layout adaptation for its larger WQFN-20 package, while RT9711CGJ5 omits reverse-current blocking and UVLO tuning-making TCKE800NL,RF uniquely suited for compact, customizable, bidirectional power domains.

Availability

TCKE800NL,RF is available at Aetrix Electronics and suitable for hard disk drive power supplies, battery charging circuits, industrial PLC I/O modules, and embedded computing power rails requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for TCKE800NL,RF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability analog and power ICs for industrial, storage, and consumer applications, with emphasis on safety, efficiency, and miniaturization.

The TCKE8xx series targets robust, space-constrained power rail protection-delivering configurable eFuse functionality in ultra-small WSON10B packages for HDD, portable power, and industrial control systems.

FAQ

What is the fault response behavior of the TCKE800NL,RF?

The TCKE800NL,RF uses latched fault response: upon overcurrent, short circuit, or thermal shutdown, the output disables and remains off until the EN/UVLO pin is actively toggled from low to high. This ensures deterministic fault containment and prevents uncontrolled auto-retry cycles that could stress downstream components. Unlike auto-retry variants (e.g., TCKE800NA), the TCKE800NL,RF requires explicit host intervention to restore power.

Does the TCKE800NL,RF include overvoltage protection?

No, the TCKE800NL,RF does not implement overvoltage clamp functionality. Per Toshiba's product list and electrical characteristics tables, VOVC is explicitly marked "N/A" for TCKE800-series devices. Overvoltage protection is only available in TCKE805 (6.04 V clamp) and TCKE812 (15.1 V clamp) variants. Designers requiring OVP must select one of those alternatives or add external clamping circuitry.

How is overcurrent limit set on the TCKE800NL,RF?

The TCKE800NL,RF overcurrent limit (ILIM) is set by connecting an external resistor (RILIM) between the ILIM pin and GND. Values from 20 kΩ to 250 kΩ program ILIM from 5.15 A down to 0.5 A, per the RILIM–ILIM lookup table in the datasheet. Open or 0 Ω connections yield a fixed 0.64 A limit. The relationship is monotonic but non-linear; actual ILIM must be verified on hardware due to ±15% tolerance at low currents.

Can the TCKE800NL,RF block reverse current without external components?

No-the TCKE800NL,RF requires an external N-channel MOSFET connected to the EFET pin to enable reverse current blocking. The EFET pin outputs a boosted gate drive (VIN + 4.9 V typ.) to turn on the external FET when the device is enabled. If reverse blocking is unused, the EFET pin must be left floating. The IC itself contains no internal back-to-back FETs or integrated blocking switches.

What package and thermal characteristics apply to the TCKE800NL,RF?

The TCKE800NL,RF is housed in a WSON10B package (3.0 mm × 3.0 mm, 0.5 mm pitch, 0.7 mm height) with an exposed thermal pad. At 5 A continuous load on a 4-layer FR4 board (76.2 mm × 114.3 mm), its power dissipation is ≤2.4 W, and junction temperature rises to 160°C before thermal shutdown activates. Proper soldering of the thermal pad to a large copper pour is essential to maintain reliability under full-load conditions.

TCKE800NL,RF Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
10-WFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Electronic Fuse
Sensing Method:
-
Accuracy:
-
Voltage - Input:
4.4V ~ 18V
Current - Output:
5A
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-WSONB (3x3)

TCKE800NL,RF FAQ

1.How can I place an order for TCKE800NL,RF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCKE800NL,RF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCKE800NL,RF reliable?

The price and inventory of TCKE800NL,RF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCKE800NL,RF is usually 5 days.

3.What payment methods are accepted for TCKE800NL,RF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCKE800NL,RF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCKE800NL,RF?

TCKE800NL,RF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCKE800NL,RF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCKE800NL,RF?

For technical support, including TCKE800NL,RF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCKE800NL,RF requirements.

6.How does Aetrix verify that TCKE800NL,RF is sourced from the original manufacturer or authorized distributors?

All TCKE800NL,RF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCKE800NL,RF meets industry standards.

7.What is the process for return or replacement of TCKE800NL,RF?

All TCKE800NL,RF units undergo pre-shipment inspection (PSI). If there is an issue with TCKE800NL,RF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCKE800NL,RF part is unused and in its original packaging.

Return procedure for TCKE800NL,RF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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