Toshiba Semiconductor and Storage TCR2DG12,LF

Overview

TCR2DG12,LF from Toshiba Electronic Devices & Storage Corporation is a fixed-output, 1.2 V ultra-low-dropout linear voltage regulator delivering 200 mA with 150 mV typical dropout at full load, 75 dB PSRR at 1 kHz, and 45 µA quiescent current - designed for noise-sensitive sensor and RF power rails in compact IoT and camera modules.

For engineers reviewing the TCR2DG12,LF datasheet, TCR2DG12,LF pinout, TCR2DG12,LF application, or TCR2DG12,LF equivalent, key selection criteria include its WCSP4 package footprint (0.42 mm²), fast load transient response (<10 µs), auto-discharge function, thermal shutdown, and guaranteed operation down to 1.35 V input across -40°C to 105°C.

Technical Context

The TCR2DG12,LF employs a CMOS-based output stage with internal P-channel MOSFET pass device, enabling ultra-low dropout and low quiescent current. Its feedback loop is optimized for stability with 1 µF ceramic output capacitance and supports fast recovery from 10–90% load steps in under 10 µs.

It integrates over-current protection with foldback current limiting, thermal shutdown at 150°C, and an active auto-discharge circuit that discharges the output capacitor when EN is pulled low - all implemented without external components.

Key Specifications

Pinout & Package

TCR2DG12,LF uses the WCSP4 (Wafer Chip Scale Package, 4-terminal) with 0.42 mm² footprint and 0.37 mm height - optimized for space-constrained camera and Bluetooth module PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with AP2210K-12W5 and MCP1700T-1202E/TT, the TCR2DG12,LF uniquely combines WCSP4 miniaturization, 45 µA IQ, EN-controlled auto-discharge, and sub-10 µs transient response - making it optimal for height- and noise-constrained wireless sensor and imaging subsystems.

Availability

TCR2DG12,LF is available at Aetrix Electronics and suitable for IoT sensor nodes, Bluetooth LE modules, camera modules, and RF front-end biasing requiring stable component supply, long-lifecycle support, and consistent wafer-level packaging.

Supply support for TCR2DG12,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for industrial, automotive, and consumer electronics, with emphasis on power efficiency, miniaturization, and system-level noise immunity.

The TCR2DG series belongs to Toshiba's ultra-compact LDO portfolio targeting space- and noise-critical power rails in wireless and imaging modules - engineered specifically for WCSP integration and fast transient performance.

FAQ

What is the minimum input voltage required for stable 1.2 V output from the TCR2DG12,LF?

The TCR2DG12,LF maintains regulated 1.2 V output with input as low as 1.35 V under full 200 mA load, thanks to its 150 mV typical dropout voltage. At lighter loads, VIN can drop further - e.g., 1.25 V suffices at 100 mA. Input below 1.35 V risks dropout and output collapse, especially at elevated temperatures.

Does the TCR2DG12,LF require an external capacitor on the VOUT pin, and what type is recommended?

Yes, the TCR2DG12,LF requires a minimum 1.0 µF ceramic output capacitor (X5R or X7R dielectric, 0402 or 0603 size) placed within 2 mm of VOUT and GND pins. This ensures stability across temperature and load, prevents oscillation, and supports its fast transient response. Tantalum or aluminum electrolytic capacitors are not recommended due to ESR and reliability concerns.

How does the auto-discharge function operate in the TCR2DG12,LF, and when is it active?

The TCR2DG12,LF activates auto-discharge automatically when the EN pin is pulled low. An internal 200 Ω switch connects VOUT to GND, discharging the output capacitor to <0.1 V within 100 µs. This prevents unintended leakage paths or latch-up in downstream circuits during standby or power-down sequences - a critical feature for secure IoT and camera module power sequencing.

What is the PSRR performance of the TCR2DG12,LF across frequency, and why does it matter for RF applications?

The TCR2DG12,LF delivers 75 dB PSRR at 1 kHz and maintains ≥40 dB up to 1 MHz. This high suppression across the switching frequency range of common DC/DC converters (e.g., 2–5 MHz) prevents ripple coupling into sensitive RF blocks like synthesizers and LNAs - directly improving EVM, receiver sensitivity, and spectral purity in Bluetooth and Wi-Fi modules using the TCR2DG12,LF.

Is the TCR2DG12,LF pin-compatible with other devices in the TCR2DG family, such as TCR2DG15,LF or TCR2DG18,LF?

Yes, all WCSP4-packaged TCR2DG variants - including TCR2DG12,LF, TCR2DG15,LF (1.5 V), and TCR2DG18,LF (1.8 V) - share identical pinout, footprint, and thermal pad layout. This allows voltage rail optimization via simple BOM change without PCB redesign, provided the input voltage margin and load requirements remain compatible across the selected output voltage.