My Inquiry
My Account
Toshiba Semiconductor and Storage TCR2EN10,LF(SE
- Part No.:
- TCR2EN10,LF(SE
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TCR2EN10,LF(SE.pdf
- Description:
- IC REG LINEAR 1V 200MA 4SDFN
- Quantity:
- Payment:
- Shipping:
Inventory:10,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TCR2EN10,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a 1.0 V fixed-output CMOS low-dropout linear regulator in ultra-small SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm), delivering up to 200 mA with 490 mV typical dropout at 150 mA load, ±18 mV output voltage accuracy, and 18 µVrms output noise. It serves as a primary power supply for low-voltage logic rails in space-constrained portable electronics.
For engineers reviewing the TCR2EN10,LF(SE) datasheet, TCR2EN10,LF(SE) pinout, TCR2EN10,LF(SE) application, or TCR2EN10,LF(SE) equivalent, key selection criteria include its 1.0 V fixed output, ultra-low quiescent current (35 µA typ.), Auto-discharge function, on/off control interface, and compatibility with 0.1 µF input / 1.0 µF ceramic output capacitors.
Technical Context
The TCR2EN10,LF(SE) integrates a CMOS pass transistor with internal reference and error amplifier to regulate output voltage under varying load and line conditions. Its control input accepts TTL/CMOS-compatible logic levels (ON threshold ≥1.0 V, OFF threshold ≤0.4 V) and enables fast turn-on/turn-off response with integrated pull-down to GND.
Designed for high-density PCB layouts, it operates across −40°C to +85°C ambient temperature with thermal shutdown protection and overcurrent limiting. The device maintains stability with minimal external components-only two ceramic capacitors-and achieves 73 dB ripple rejection at 1 kHz for noise-sensitive analog and RF subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.0 V ±18 mV (±1.8%); ensures stable core voltage for 1.0 V logic families and low-power microcontrollers. |
| Max Output Current | 200 mA continuous; supports multiple low-power peripherals (e.g., sensors, BLE radios, display drivers) from single rail. |
| Dropout Voltage | 490 mV typ. at 150 mA; enables operation from 1.49 V input, critical for single-cell Li-ion or coin-cell battery systems. |
| Quiescent Current | 35 µA typ. at zero load; extends battery life in always-on monitoring applications like wearables and IoT endpoints. |
| Output Noise | 18 µVrms (10 Hz–100 kHz); minimizes jitter and interference in precision ADCs, audio codecs, and RF front-ends. |
| Ripple Rejection | 73 dB typ. at 1 kHz; suppresses switching noise from upstream DC/DC converters feeding mixed-signal SoCs. |
| Load Transient Response | ±55 mV max deviation (1 mA ↔ 150 mA step, 1.0 µF COUT); maintains regulation during burst-mode processor activity without external compensation. |
Pinout & Package
TCR2EN10,LF(SE) uses the ultra-compact SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg weight) with wettable flank terminals for automated optical inspection. Pin 1 (VOUT) and Pin 4 (VIN) are diagonally opposite; Pin 2 (CONTROL) and Pin 3 (GND) occupy the remaining corners. The center thermal pad must be connected to GND for thermal performance and EMI reduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VOUT (Pin 1) | Regulated output terminal | Delivers stable 1.0 V to load; requires 1.0 µF ceramic capacitor placed within 2 mm for transient stability. |
| CONTROL (Pin 2) | Enable/disable logic input | Active-high control: ≥1.0 V = ON, ≤0.4 V = OFF; internal pull-down ensures default OFF state at power-up. |
| GND (Pin 3) | Ground reference and thermal path | Common return for VIN, VOUT, and CONTROL; center pad must be soldered to GND plane for thermal dissipation and noise immunity. |
| VIN (Pin 4) | Input supply terminal | Accepts 1.5–5.5 V input; requires 0.1 µF ceramic capacitor placed adjacent to pin to suppress high-frequency noise. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Internally discharges VOUT via controlled sink when CONTROL = LOW, preventing residual voltage hold-up in power-gated domains. |
| Ultra-small footprint | SDFN4/SDFN4E package (0.64 mm² area) enables placement beneath BGA packages or in <1.0 mm board gaps for foldable/wearable form factors. |
| Ceramic capacitor compatibility | Stable with 0.1 µF input and 1.0 µF output ceramics (ESR <10 Ω), eliminating need for larger, less reliable tantalum or aluminum electrolytics. |
| Low-noise regulation | 18 µVrms output noise at 1.0 V output enables direct powering of RF synthesizers and high-resolution SAR ADCs without additional LDO filtering. |
| Overcurrent protection | Current-limiting circuit folds back output current above ~250 mA to prevent thermal runaway during short-circuit or overload events. |
Applications
| Smart Wearable Sensors | BLE Wireless Modules |
|---|---|
Use Scenario: Powering MEMS accelerometers, gyroscopes, and environmental sensors in wrist-worn fitness trackers with intermittent wake-up cycles. IC Role / Device Role / Timing Role: Primary 1.0 V supply for sensor signal chain and digital interface; regulated by TCR2EN10,LF(SE) during active measurement bursts. Use Value: 35 µA quiescent current extends battery life beyond 6 months on CR2032; ±18 mV output accuracy ensures consistent ADC reference scaling across temperature. | Use Scenario: Supplying 1.0 V core voltage to Bluetooth Low Energy SoCs (e.g., Nordic nRF52833) during advertising and connection intervals. IC Role / Device Role / Timing Role: Dedicated LDO for RF transceiver and ARM Cortex-M4 core; enabled only during radio activity via CONTROL pin. Use Value: 490 mV dropout allows operation down to 1.49 V input, enabling full utilization of single-cell LiPo discharge curve (3.0–1.5 V); ±55 mV load transient response prevents packet loss during TX/RX transitions. |
| Portable Medical Monitors | Compact Industrial Controllers |
Use Scenario: Providing clean 1.0 V bias to analog front-end amplifiers and 16-bit sigma-delta ADCs in handheld ECG/SpO₂ devices. IC Role / Device Role / Timing Role: Low-noise post-regulator after buck converter; decouples digital switching noise from sensitive analog acquisition paths. Use Value: 18 µVrms output noise meets IEC 60601-2-27 ECG common-mode rejection requirements; Auto-discharge clears residual charge before patient electrode reconnection. | Use Scenario: Powering FPGA configuration memory and I/O banks in DIN-rail mounted edge controllers with limited board area. IC Role / Device Role / Timing Role: Secondary LDO generating 1.0 V for FPGA I/O banks requiring tight voltage tolerance and fast transient recovery. Use Value: SDFN4E package fits within 0.8 mm clearance constraints beside FPGA BGA; 73 dB ripple rejection isolates FPGA I/O from 5 V system rail noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-dropout regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B102MR-G | Same 1.0 V output, 200 mA rating, and SOT-25 package; higher 600 mV dropout at 150 mA; no Auto-discharge function. | Lacks active discharge, requiring external circuitry for rapid VOUT decay in power-gated systems. | Select when board space permits SOT-25 and Auto-discharge is unnecessary; verify thermal derating at 85°C ambient. |
| Rohm BD09CUL | 1.0 V output, 150 mA max, DFN1006-4 package (1.0 mm × 0.6 mm); 350 mV dropout at 100 mA; includes thermal shutdown but no CONTROL pin. | Fixed ON operation only-no enable control-limiting use in duty-cycled applications. | Choose for cost-sensitive, always-on 1.0 V rails where enable functionality is redundant and smaller footprint is secondary to price. |
Compared with TCR2EN10,LF(SE), the XC6210B102MR-G trades lower dropout for missing Auto-discharge, while the BD09CUL sacrifices 50 mA drive capability and enable control for marginally smaller size-making TCR2EN10,LF(SE) optimal for space-constrained, battery-powered systems requiring precise sequencing and ultra-low standby current.
Availability
TCR2EN10,LF(SE) is available at Aetrix Electronics and suitable for portable medical monitors, BLE wireless modules, smart wearable sensors, and compact industrial controllers requiring stable component supply across extended production lifecycles.
Supply support for TCR2EN10,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with expertise in power management, logic, and analog ICs.
The TCR2EN series targets ultra-compact, low-power portable electronics-specifically engineered to replace larger LDOs in battery-powered devices where board area, quiescent current, and fast transient response are critical design constraints.
FAQ
What is the maximum input voltage rating for TCR2EN10,LF(SE)?
The absolute maximum input voltage for TCR2EN10,LF(SE) is 6.0 V. However, the recommended operating range is 1.5 V to 5.5 V per electrical characteristics testing conditions. Exceeding 5.5 V may degrade long-term reliability even if within absolute maximum ratings, especially at elevated temperatures.
Does TCR2EN10,LF(SE) require an external resistor on the CONTROL pin?
No, TCR2EN10,LF(SE) includes an internal pull-down resistor between CONTROL and GND, ensuring a defined LOW state at power-up. An external resistor is unnecessary unless specific timing or noise immunity requirements dictate a stronger pull-down-consult Toshiba's Application Note for layout guidance.
Can TCR2EN10,LF(SE) be used with a 0.47 µF output capacitor instead of 1.0 µF?
While the datasheet specifies 1.0 µF for guaranteed ±55 mV load transient response, TCR2EN10,LF(SE) remains stable with 0.47 µF ceramic capacitors (ESR <10 Ω). However, transient deviation may increase beyond ±55 mV, and phase margin should be verified in final layout using actual board parasitics.
What is the thermal resistance (θJA) of TCR2EN10,LF(SE) in its SDFN4 package?
Toshiba does not publish θJA for TCR2EN10,LF(SE) as a standalone value. Thermal performance depends entirely on PCB layout: the standard test board (FR4, 40 mm × 40 mm, 50% copper coverage both sides) yields 300 mW power dissipation rating. For accurate junction temperature estimation, use the measured board temperature rise and actual power dissipation (PD = (VIN − 1.0 V) × IOUT).
Is TCR2EN10,LF(SE) RoHS compliant and lead-free?
Yes, TCR2EN10,LF(SE) is RoHS compliant and lead-free. The "LF" in the part number explicitly denotes lead-free plating, and the device meets EU RoHS Directive 2011/65/EU requirements. Full compliance documentation, including substance declarations, is available through Toshiba's official product page or authorized distributors.
TCR2EN10,LF(SE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.75V @ 150mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SDFN (0.8x0.8)
TCR2EN10,LF(SE FAQ
1.How can I place an order for TCR2EN10,LF(SE through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR2EN10,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR2EN10,LF(SE reliable?
The price and inventory of TCR2EN10,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2EN10,LF(SE is usually 5 days.
3.What payment methods are accepted for TCR2EN10,LF(SE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2EN10,LF(SE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR2EN10,LF(SE?
TCR2EN10,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR2EN10,LF(SE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR2EN10,LF(SE?
For technical support, including TCR2EN10,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2EN10,LF(SE requirements.
6.How does Aetrix verify that TCR2EN10,LF(SE is sourced from the original manufacturer or authorized distributors?
All TCR2EN10,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2EN10,LF(SE meets industry standards.
7.What is the process for return or replacement of TCR2EN10,LF(SE?
All TCR2EN10,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR2EN10,LF(SE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR2EN10,LF(SE part is unused and in its original packaging.
Return procedure for TCR2EN10,LF(SE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TCR2EN10,LF(SE Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
