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Toshiba Semiconductor and Storage TCR2EN13,LF
- Part No.:
- TCR2EN13,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TCR2EN13,LF.pdf
- Description:
- IC REG LINEAR 1.3V 200MA 4SDFN
- Quantity:
- Payment:
- Shipping:
Inventory:10,000
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Product details
Overview
TCR2EN13,LF from Toshiba Electronic Devices & Storage Corporation is a 1.3 V fixed-output CMOS low-dropout (LDO) voltage regulator in an ultra-small SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm), delivering up to 200 mA with 330 mV typical dropout at 150 mA load, ±1.0% output accuracy (for VOUT ≥ 1.8 V; 1.3 V variant specified to ±18 mV), and 35 µVrms output noise at 2.5 V - deployed in space-constrained portable power rails such as cellular phone baseband ICs.
For engineers reviewing the TCR2EN13,LF datasheet, TCR2EN13,LF pinout, TCR2EN13,LF application, or TCR2EN13,LF equivalent, key selection criteria include its 330 mV dropout at 150 mA, 35 µA typical quiescent current, Auto-discharge function, on/off control interface, and compatibility with 0.1 µF input / 1.0 µF ceramic output capacitors in high-density PCB layouts.
Technical Context
The TCR2EN13,LF implements a CMOS-based LDO architecture with integrated overcurrent protection and an active pull-down circuit on the CONTROL pin. Its regulation loop maintains stable 1.3 V output across −40°C to +85°C ambient temperature while supporting fast load transients (±55 mV deviation for 1 mA ↔ 150 mA step, COUT = 1.0 µF).
It operates with input voltages from 1.5 V to 5.5 V, features 73 dB ripple rejection at 1 kHz (2.5 V output reference), and achieves 75 ppm/°C temperature coefficient - enabling use in battery-powered systems where supply headroom, noise sensitivity, and thermal stability are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.3 V (±18 mV accuracy at IOUT = 50 mA) |
| Max Output Current | 200 mA - supports moderate-power digital ICs without thermal derating on standard FR4 boards |
| Dropout Voltage | 330 mV (typ.) at IOUT = 150 mA - enables operation from single-cell Li-ion (3.0 V min) or dual-cell alkaline (2.4 V min) sources |
| Quiescent Current | 35 µA (typ.) at zero load - extends battery life in always-on standby circuits |
| Output Noise | 35 µVrms (typ., 10 Hz–100 kHz, 2.5 V ref) - low enough for noise-sensitive analog/RF subsystems when scaled to 1.3 V |
| Ripple Rejection | 73 dB (typ., 1 kHz, 2.5 V ref) - suppresses switching noise from upstream DC-DC converters feeding the LDO input |
| Control Interface | Active-high ON/OFF control (VCT(OFF) ≤ 0.4 V, VCT(ON) ≥ 1.0 V) with internal pull-down - simplifies host MCU GPIO control without external resistors |
Pinout & Package
TCR2EN13,LF is housed in the ultra-compact SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg weight), featuring a bottom-exposed thermal pad (center electrode) that must be connected to GND or left open per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input voltage supply | Accepts 1.5–5.5 V; requires 0.1 µF ceramic decoupling close to pin |
| VOUT | Regulated output | Delivers stable 1.3 V; requires 1.0 µF ceramic capacitor with ESR < 10 Ω |
| GND | Ground reference | Common return for VIN, VOUT, and CONTROL; connects to thermal pad if used |
| CONTROL | Enable/disable input | Logic-high (≥1.0 V) enables output; logic-low (≤0.4 V) disables output and activates Auto-discharge |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | SDFN4/SDFN4E (0.8 mm × 0.8 mm) - saves >70% board area vs. SOT-23, enabling placement under narrow-pitch BGAs |
| Auto-discharge function | Actively discharges VOUT when CONTROL = LOW - prevents residual voltage from interfering with system reset sequencing |
| Ceramic capacitor support | Stable with 0.1 µF CIN and 1.0 µF COUT - eliminates need for larger, less reliable tantalum or aluminum electrolytics |
| Low-noise regulation | 35 µVrms output noise - meets stringent PSRR requirements for RF transceivers and high-resolution ADCs powered from same rail |
| Fast transient response | ±55 mV output deviation for 1 mA ↔ 150 mA load steps - maintains core voltage integrity during CPU burst-mode operation |
Applications
| Smartphone Baseband Power | Wearable Sensor Hub Supply |
|---|---|
|
Use Scenario: Powers ARM Cortex-M4 microcontroller and BLE radio in compact wearable form factor with tight thermal constraints. IC Role / Device Role / Timing Role: Primary 1.3 V LDO supplying core logic voltage for low-power SoC with dynamic current ranging 10 µA–180 mA. Use Value: Ultra-low quiescent current (35 µA) extends coin-cell battery life beyond 12 months; 0.8 mm × 0.8 mm footprint allows placement directly beneath SoC. |
Use Scenario: Supplies 1.3 V to MEMS accelerometer and environmental sensor array in hearable device with < 30 mm² PCB area. IC Role / Device Role / Timing Role: Low-noise, fast-transient LDO ensuring clean power for precision analog front-end and ADC reference. Use Value: 35 µVrms noise and ±55 mV load step response prevent measurement drift and timing jitter in sub-10 µA sleep-to-active transitions. |
| IoT Edge Node PMIC Rail | Medical Patch Monitor Core Supply |
|
Use Scenario: Provides regulated 1.3 V rail to ultra-low-power MCU and LoRa transceiver in battery-operated environmental sensor node. IC Role / Device Role / Timing Role: Standby-optimized LDO with ON/OFF control synchronized to wireless transmission bursts. Use Value: 0.1 µA standby current (typ.) and Auto-discharge enable rapid wake/sleep cycling with no residual VOUT leakage affecting sensor biasing. |
Use Scenario: Delivers 1.3 V to clinical-grade ECG analog signal chain and low-latency DSP in disposable patient-worn patch. IC Role / Device Role / Timing Role: Precision LDO with ±18 mV output accuracy and 75 ppm/°C TCVO ensuring consistent gain calibration across body temperature range. Use Value: High accuracy and low thermal drift eliminate need for periodic recalibration, meeting Class IIa medical device stability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B132MR-G | Same 1.3 V output, 200 mA rating, SOT-25 package (2.9 mm × 2.8 mm); higher 60 µA quiescent current; no Auto-discharge | Larger footprint limits use in ultra-dense layouts; lacks active discharge for reset-critical systems | Prefer TCR2EN13,LF when board area < 1 mm² is required or Auto-discharge is needed for controlled power-down |
| Rohm BD3985FVM-1.3TR | 1.3 V, 300 mA, DFN1212-4 (1.2 mm × 1.2 mm); 50 µA IQ; includes thermal shutdown but no Auto-discharge | Higher current capability suits future-proofing, but 1.2 mm × 1.2 mm still occupies ~78% more area than TCR2EN13,LF | Choose TCR2EN13,LF for minimal footprint and lowest IQ in space- and power-constrained designs where 200 mA suffices |
Compared with XC6210B132MR-G and BD3985FVM-1.3TR, TCR2EN13,LF delivers the smallest package (0.8 mm × 0.8 mm), lowest quiescent current (35 µA), and unique Auto-discharge functionality - making it optimal for miniaturized, battery-sensitive applications requiring precise power sequencing.
Availability
TCR2EN13,LF is available at Aetrix Electronics and suitable for smartphone baseband power, wearable sensor hub supply, IoT edge node PMIC rails, medical patch monitor core supply, and other applications requiring stable component supply with ultra-small footprint and low-noise performance.
Supply support for TCR2EN13,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions, with expertise in power management, logic, memory, and discrete devices for consumer, industrial, and automotive markets.
The TCR2EN series targets portable electronics requiring ultra-compact, low-quiescent-current LDOs - specifically engineered for space-constrained battery-powered systems needing fast transient response and low output noise.
FAQ
What is the output voltage tolerance of TCR2EN13,LF at room temperature?
The TCR2EN13,LF has an output voltage accuracy of ±18 mV at IOUT = 50 mA and Tj = 25°C. This corresponds to ±1.38% of nominal 1.3 V output and is specified separately from the ±1.0% tolerance applied to variants ≥1.8 V. The TCR2EN13,LF datasheet confirms this value under Electrical Characteristics Table (Note 2).
Does TCR2EN13,LF require external components for stable operation?
Yes - TCR2EN13,LF requires a 0.1 µF ceramic capacitor on VIN and a 1.0 µF ceramic capacitor on VOUT, both placed as close as possible to their respective pins. The device is optimized for ceramic capacitors with ESR < 10 Ω; no additional compensation network or bypass resistors are needed due to its internal stability design.
What is the maximum allowable input voltage for TCR2EN13,LF?
The absolute maximum input voltage for TCR2EN13,LF is 6.0 V, but the recommended operating range is 1.5 V to 5.5 V per the Electrical Characteristics table. Exceeding 5.5 V may trigger overvoltage stress not covered by standard reliability testing and is not supported in normal operation.
How does the Auto-discharge function operate in TCR2EN13,LF?
When the CONTROL pin is driven LOW (≤0.4 V), TCR2EN13,LF disables the output and activates an internal discharge path from VOUT to GND. This rapidly depletes stored charge in the output capacitor, ensuring VOUT falls to near-zero within microseconds - critical for clean system reset and preventing back-powering of upstream circuitry.
Is the center thermal pad on the SDFN4/SDFN4E package of TCR2EN13,LF required to be connected?
No - the center electrode (thermal pad) on the TCR2EN13,LF SDFN4/SDFN4E package may be connected to GND or left floating (open), as stated in the Pin Assignment diagram. Connecting it to GND improves thermal performance slightly, but electrical functionality is maintained either way; layout guidelines emphasize short, wide traces to GND if used.
TCR2EN13,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TCR2EN
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.45V @ 150mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- 73dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SDFN (0.8x0.8)
TCR2EN13,LF FAQ
1.How can I place an order for TCR2EN13,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR2EN13,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR2EN13,LF reliable?
The price and inventory of TCR2EN13,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2EN13,LF is usually 5 days.
3.What payment methods are accepted for TCR2EN13,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2EN13,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR2EN13,LF?
TCR2EN13,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR2EN13,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR2EN13,LF?
For technical support, including TCR2EN13,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2EN13,LF requirements.
6.How does Aetrix verify that TCR2EN13,LF is sourced from the original manufacturer or authorized distributors?
All TCR2EN13,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2EN13,LF meets industry standards.
7.What is the process for return or replacement of TCR2EN13,LF?
All TCR2EN13,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCR2EN13,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR2EN13,LF part is unused and in its original packaging.
Return procedure for TCR2EN13,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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