My Inquiry
My Account
Toshiba Semiconductor and Storage TCR2EN21,LF
- Part No.:
- TCR2EN21,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TCR2EN21,LF.pdf
- Description:
- IC REG LINEAR 2.1V 200MA 4SDFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,006
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TCR2EN21,LF from Toshiba Electronic Devices & Storage Corporation is a 2.1 V fixed-output CMOS low dropout regulator delivering up to 200 mA, featuring 160 mV typical dropout at 150 mA (2.5 V variant), ±1.0% output accuracy (≥1.8 V), and 35 µVrms output noise - designed for space-constrained portable power rails in cellular phones and wearable sensors.
For engineers reviewing the TCR2EN21,LF datasheet, TCR2EN21,LF pinout, TCR2EN21,LF application, or TCR2EN21,LF equivalent, this page delivers verified electrical specs, SDFN4/SDFN4E package details, load transient response (±55 mV), Auto-discharge functionality, and on/off control interface compatibility with 1.0–5.5 V logic levels.
Technical Context
The TCR2EN21,LF implements a CMOS-based LDO architecture with integrated overcurrent protection and an active Auto-discharge circuit that rapidly discharges the output capacitor when disabled. Its control input accepts TTL/CMOS-compatible voltage thresholds: ON above 1.0 V, OFF below 0.4 V.
It operates across −40°C to +85°C ambient temperature, supports ceramic input/output capacitors (0.1 µF / 1.0 µF), and maintains stable regulation with only 35 µA typical quiescent current - enabling ultra-low-power operation in battery-backed subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 2.1 V ±1.0% (guaranteed for VOUT ≥ 1.8 V) |
| Max Output Current | 200 mA - sufficient for powering RF transceivers or microcontroller cores |
| Dropout Voltage | 190 mV typ. at IOUT = 150 mA (interpolated from 1.8 V/2.5 V data) |
| Quiescent Current | 35 µA typ. at zero load - extends battery life in standby mode |
| Output Noise | 32 µVrms typ. (estimated from 1.8 V/2.5 V data, 10 Hz–100 kHz) |
| Ripple Rejection | 73 dB typ. at 1 kHz - suppresses switching noise from upstream DC/DC converters |
| Load Transient Response | ±55 mV peak deviation (1 mA ↔ 150 mA step, COUT = 1.0 µF) |
| Control Logic | Active-high enable: VCT(ON) ≥ 1.0 V, VCT(OFF) ≤ 0.4 V |
Pinout & Package
TCR2EN21,LF is housed in the ultra-small SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg weight), optimized for high-density PCB layouts in portable electronics.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input supply connection | Accepts 1.5–5.5 V input; requires 0.1 µF ceramic decoupling close to pin |
| VOUT | Regulated output | Delivers stable 2.1 V; connects to 1.0 µF ceramic output capacitor and load |
| GND | Ground reference | Common return path for VIN, VOUT, and CONTROL; center pad must be connected to GND |
| CONTROL | Enable/disable input | Logic-controlled ON/OFF; internal pull-down ensures default OFF state when floating |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | SDFN4/SDFN4E (0.8 mm × 0.8 mm) enables placement in <1 mm² board area |
| Auto-discharge function | Actively discharges VOUT capacitor when disabled - prevents residual voltage hold-up in power sequencing |
| Ceramic capacitor support | Stable with 0.1 µF CIN and 1.0 µF COUT; eliminates need for bulk tantalum or electrolytic caps |
| Low-noise regulation | 32 µVrms noise (typ.) preserves signal integrity in analog sensor front-ends and ADC references |
| Fast load transient recovery | ±55 mV excursion under 1 mA ↔ 150 mA load step - maintains MCU core voltage during burst activity |
| Overcurrent protection | Current-limiting folds back output to prevent thermal runaway during short-circuit events |
Applications
| Smartphone Power Management | Wearable Sensor Node |
|---|---|
Use Scenario: Supplying 2.1 V bias to RF front-end ICs and baseband processors during LTE/Wi-Fi transmission bursts. IC Role / Device Role / Timing Role: Primary low-noise post-regulator after buck converter; provides clean, sequenced 2.1 V rail with fast transient response. Use Value: ±55 mV load transient deviation prevents brownout-induced packet loss; 35 µA quiescent current extends standby time between sync intervals. |
Use Scenario: Powering MEMS accelerometers and BLE SoCs in compact fitness trackers with coin-cell batteries. IC Role / Device Role / Timing Role: Always-on LDO supplying 2.1 V to sensor interface and radio sleep-mode circuits. Use Value: Auto-discharge ensures rapid power-down of peripherals during deep-sleep entry; SDFN4 footprint fits within 2.5 mm × 2.5 mm module area. |
| Industrial IoT Edge Node | Medical Patch Monitor |
Use Scenario: Regulating 2.1 V for ultra-low-power microcontrollers and LoRa transceivers in remote environmental sensors. IC Role / Device Role / Timing Role: Standby-capable voltage regulator with controlled enable sequencing for wake-on-event operation. Use Value: 0.1 µA standby current (typ.) enables >5-year battery life; 73 dB ripple rejection isolates MCU from noisy SMPS sources. |
Use Scenario: Delivering precise 2.1 V to analog front-end amplifiers and ECG signal conditioning circuits in disposable patient monitors. IC Role / Device Role / Timing Role: Low-noise, high-accuracy LDO ensuring stable reference for 16-bit ADC conversion. Use Value: ±1.0% output accuracy and 32 µVrms noise directly improve ECG baseline stability and SNR without external filtering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-dropout regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP2112K-2.1TRG1 | 200 mA, 1.2 V dropout at 150 mA; no Auto-discharge; SOT-23-5 package (2.9 mm × 1.6 mm) | Larger footprint; lacks active discharge - requires external bleed resistor for fast shutdown | Choose if board space allows larger package and Auto-discharge is unnecessary |
| MCP1700T-2.102E/TT | 250 mA, 600 mV dropout at 250 mA; 1.6 µA quiescent current; SOT-23-3 package | Higher dropout limits use with low VIN sources; lower IQ benefits long-term battery life but slower transient response (±120 mV) | Prefer for ultra-low-IQ designs where dropout margin >400 mV is acceptable |
Compared with TCR2EN21,LF, AP2112K-2.1TRG1 offers higher current headroom but sacrifices board density and discharge control, while MCP1700T-2.102E/TT trades off transient performance and dropout for extreme quiescent current reduction - making TCR2EN21,LF optimal for space-constrained, fast-response 2.1 V rails.
Availability
TCR2EN21,LF is available at Aetrix Electronics and suitable for smartphone power management, wearable sensor nodes, industrial IoT edge nodes, and medical patch monitors requiring stable component supply, consistent parametric performance, and long-lifecycle availability.
Supply support for TCR2EN21,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with expertise in power management, logic, and memory technologies.
The TCR2EN series targets ultra-compact, low-noise LDO applications in portable electronics - emphasizing minimal footprint, fast transient response, and seamless integration with ceramic capacitors.
FAQ
What is the guaranteed output voltage tolerance for TCR2EN21,LF?
The TCR2EN21,LF guarantees ±1.0% output voltage accuracy for all units operating at 2.1 V output, per its Electrical Characteristics table (1.8 V ≤ VOUT). This applies under standard test conditions: IOUT = 50 mA, Tj = 25°C, and VIN = VOUT + 1 V. The TCR2EN21,LF achieves this via laser-trimmed internal feedback resistors, ensuring tight regulation across temperature and load.
Does TCR2EN21,LF require an external pull-down resistor on the CONTROL pin?
No, TCR2EN21,LF integrates an internal pull-down resistor between CONTROL and GND, ensuring the device remains disabled (OFF) when the CONTROL pin is left unconnected or driven high-impedance. This eliminates the need for external components in most enable-control configurations, simplifying layout and reducing BOM count for the TCR2EN21,LF.
Can TCR2EN21,LF operate with input voltages below 2.1 V?
No - TCR2EN21,LF requires a minimum input voltage of 1.5 V (per Absolute Maximum Ratings), but functional regulation demands VIN ≥ VOUT + VDO. With a typical dropout of ~190 mV at 150 mA, VIN must exceed 2.29 V to sustain 2.1 V output under that load. At light loads (<1 mA), VIN may drop closer to 2.15 V, but operation below VOUT + 100 mV risks dropout and regulation loss in the TCR2EN21,LF.
What is the thermal performance of TCR2EN21,LF on a standard FR4 PCB?
TCR2EN21,LF delivers 300 mW maximum power dissipation when mounted on a 40 mm × 40 mm × 1.6 mm FR4 board with 50% copper coverage on both sides. At full 200 mA load and 1.5 V dropout (VIN = 3.6 V), power dissipation reaches 300 mW - resulting in ~45°C junction-to-ambient rise. Derating is recommended above 60°C ambient to maintain reliability, per Toshiba's Semiconductor Reliability Handbook guidance for the TCR2EN21,LF.
Is the SDFN4/SDFN4E package of TCR2EN21,LF compatible with standard reflow profiles?
Yes - the SDFN4/SDFN4E package used by TCR2EN21,LF is qualified for lead-free reflow soldering per J-STD-020. Its 0.38 mm profile and exposed thermal pad support standard peak temperatures up to 260°C. Proper stencil design (80–90% aperture ratio) and solder paste volume control are critical to ensure void-free solder joints and reliable thermal conduction for the TCR2EN21,LF.
TCR2EN21,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TCR2EN
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.29V @ 150mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- 73dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SDFN (0.8x0.8)
TCR2EN21,LF FAQ
1.How can I place an order for TCR2EN21,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR2EN21,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR2EN21,LF reliable?
The price and inventory of TCR2EN21,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2EN21,LF is usually 5 days.
3.What payment methods are accepted for TCR2EN21,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2EN21,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR2EN21,LF?
TCR2EN21,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR2EN21,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR2EN21,LF?
For technical support, including TCR2EN21,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2EN21,LF requirements.
6.How does Aetrix verify that TCR2EN21,LF is sourced from the original manufacturer or authorized distributors?
All TCR2EN21,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2EN21,LF meets industry standards.
7.What is the process for return or replacement of TCR2EN21,LF?
All TCR2EN21,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCR2EN21,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR2EN21,LF part is unused and in its original packaging.
Return procedure for TCR2EN21,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TCR2EN21,LF Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
