Toshiba Semiconductor and Storage TCR2EN30,LF
- Part No.:
- TCR2EN30,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TCR2EN30,LF.pdf
- Description:
- IC REG LINEAR 3V 200MA 4SDFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,902
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TCR2EN30,LF from Toshiba Electronic Devices & Storage Corporation is a 3.0 V fixed-output CMOS low dropout (LDO) voltage regulator in an ultra-small SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm), delivering up to 200 mA with 130 mV typical dropout at 150 mA load, ±1.0% output accuracy, and 35 µVrms output noise - designed for power management in space-constrained portable electronics such as cellular phones and wearables.
For engineers reviewing the TCR2EN30,LF datasheet, TCR2EN30,LF pinout, TCR2EN30,LF application, or TCR2EN30,LF equivalent, this page provides verified technical context, key specifications including dropout voltage, quiescent current, ripple rejection, load transient response, and Auto-discharge functionality - all confirmed for the exact 3.0 V variant.
Technical Context
The TCR2EN30,LF implements a CMOS-based LDO architecture with integrated on/off control input (CONTROL pin), enabling precise system-level power sequencing. It features internal overcurrent protection and an Auto-discharge function that actively discharges the output capacitor when disabled, preventing residual voltage hold-up in battery-powered systems.
Its fast load transient response (±55 mV deviation at 1 mA ↔ 150 mA step with 1.0 µF ceramic output capacitor) and high ripple rejection (73 dB at 1 kHz) are achieved without requiring external compensation, supporting stable operation with minimal 0.1 µF input and 1.0 µF output ceramic capacitors - critical for high-density PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.0 V ±1.0% (guaranteed for VOUT ≥ 1.8 V) |
| Dropout Voltage | 130 mV (typ.) at IOUT = 150 mA - enables regulation down to VIN = 3.13 V |
| Quiescent Current | 35 µA (typ.) at zero load - extends battery life in standby mode |
| Output Noise | 35 µVrms (10 Hz–100 kHz) - suitable for noise-sensitive analog/RF circuitry |
| Ripple Rejection | 73 dB (typ.) at 1 kHz - suppresses switching noise from upstream DC-DC converters |
| Load Transient Response | ±55 mV (typ.) for 1 mA ↔ 150 mA step - maintains stable supply during processor wake/sleep cycles |
| Standby Current | 0.1 µA (typ.) when CONTROL = 0 V - enables ultra-low-power shutdown |
Pinout & Package
The TCR2EN30,LF is housed in the ultra-small SDFN4/SDFN4E plastic mold package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg weight), featuring a bottom-exposed thermal pad (center electrode) recommended to be connected to GND for optimal thermal performance and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input voltage supply | Accepts 1.5–5.5 V input; must be ≥ VOUT + dropout for regulation |
| VOUT | Regulated output | Delivers stable 3.0 V ±1.0% to load; requires 1.0 µF ceramic capacitor |
| GND | Ground reference | Common return path for input, output, and control circuits; connects center thermal pad |
| CONTROL | Enable/disable input | Logic-high (≥1.0 V) enables output; logic-low (≤0.4 V) disables output and activates Auto-discharge |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Actively discharges VOUT capacitor when CONTROL = LOW, eliminating residual voltage in portable systems |
| Ultra-small SDFN4/SDFN4E package | 0.8 mm × 0.8 mm footprint enables placement in tight spaces like smartphone camera modules |
| Ceramic capacitor compatibility | Supports 0.1 µF input and 1.0 µF output ceramics - eliminates need for bulkier tantalum or electrolytic caps |
| Overcurrent protection | Internal foldback current limiting prevents damage during short-circuit or overload conditions |
| Pull-down on CONTROL pin | Internal pull-down ensures safe default-OFF state if CONTROL is left floating |
Applications
| Smartphone Power Rail | Wearable Sensor Subsystem |
|---|---|
Use Scenario: Providing clean, low-noise 3.0 V supply to image signal processors (ISPs) and RF front-end ICs in compact smartphones. IC Role / Device Role / Timing Role: Primary LDO regulator delivering regulated bias to noise-sensitive analog blocks. Use Value: 35 µVrms output noise and 73 dB ripple rejection prevent interference with high-resolution imaging and LTE/Wi-Fi reception. | Use Scenario: Powering MEMS accelerometers, gyroscopes, and Bluetooth LE radios in fitness trackers and smartwatches. IC Role / Device Role / Timing Role: Low-quiescent-current LDO enabling multi-day battery life in always-on sensing modes. Use Value: 35 µA typical quiescent current and 0.1 µA standby current minimize leakage during sleep cycles. |
| Portable Medical Monitor | IoT Edge Node MCU Core |
Use Scenario: Supplying stable 3.0 V to analog front-end (AFE) circuits in handheld ECG or pulse oximetry devices. IC Role / Device Role / Timing Role: Precision voltage source ensuring accurate ADC reference and sensor excitation. Use Value: ±1.0% output accuracy and <75 ppm/°C temperature coefficient maintain measurement integrity across operating temperature range. | Use Scenario: Regulating core voltage for ARM Cortex-M microcontrollers in battery-powered industrial IoT nodes. IC Role / Device Role / Timing Role: Fast-transient LDO supporting dynamic voltage scaling during CPU burst activity. Use Value: ±55 mV load transient response prevents brown-out during 150 mA CPU current spikes with minimal output capacitance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B302MR-G | Same 3.0 V output, 200 mA rating, but uses SOT-25 package (2.9 mm × 2.8 mm); higher 250 mV dropout at 150 mA | Larger footprint limits use in ultra-dense layouts; lacks Auto-discharge function | Choose when board space permits larger package and Auto-discharge is unnecessary |
| Rohm BD33IC0WEFJ-C | 3.3 V output (not 3.0 V); same SDFN package size; 180 mV dropout at 150 mA; no Auto-discharge | Requires system-level voltage tolerance adjustment; not a direct functional replacement for 3.0 V rail | Consider only if 3.3 V is acceptable and Auto-discharge is not required |
Compared with TCR2EN30,LF, the XC6210B302MR-G offers identical output voltage but sacrifices board-area efficiency and transient performance, while the BD33IC0WEFJ-C shifts the output voltage and omits critical power-control features - making TCR2EN30,LF uniquely suited for space- and noise-constrained 3.0 V applications requiring active discharge.
Availability
TCR2EN30,LF is available at Aetrix Electronics and suitable for smartphone power rails, wearable sensor subsystems, portable medical monitors, and IoT edge node MCU cores requiring stable component supply, consistent parametric performance, and long-term lifecycle support.
Supply support for TCR2EN30,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions, with expertise in power management, logic, memory, and discrete devices for consumer, industrial, and automotive markets.
The TCR2EN series belongs to Toshiba's CMOS Linear Integrated Circuit portfolio, engineered specifically for ultra-compact, low-noise, low-quiescent-current LDO regulation in battery-powered portable electronics.
FAQ
What is the maximum input voltage rating for TCR2EN30,LF?
The absolute maximum input voltage for TCR2EN30,LF is 6.0 V. However, for reliable operation under normal conditions, the recommended input voltage range is 1.5 V to 5.5 V - ensuring sufficient headroom above the 3.0 V output while maintaining low dropout and thermal safety. Exceeding 5.5 V may trigger overvoltage stress even if within absolute maximum ratings.
Does TCR2EN30,LF require external compensation components?
No, TCR2EN30,LF is internally compensated and operates stably with only 0.1 µF ceramic input and 1.0 µF ceramic output capacitors. Its design eliminates the need for external resistors or capacitors in the feedback loop, simplifying layout and reducing BOM count - a key advantage for miniaturized applications where board area is constrained.
How does the Auto-discharge function work in TCR2EN30,LF?
When the CONTROL pin is driven LOW (≤0.4 V), TCR2EN30,LF disables the output and activates an internal discharge transistor between VOUT and GND. This rapidly bleeds charge from the output capacitor, preventing residual voltage that could interfere with system reset or cause unintended peripheral wake-up - a critical feature for battery-powered devices requiring clean power sequencing.
What is the thermal performance of TCR2EN30,LF in its SDFN4/SDFN4E package?
TCR2EN30,LF in the SDFN4/SDFN4E package has a typical thermal resistance θJA of approximately 250°C/W on a standard FR4 board (40 mm × 40 mm, 50% copper coverage). With a maximum junction temperature of 150°C and ambient up to 85°C, it supports continuous 200 mA output only with adequate PCB copper pour and thermal vias beneath the center GND pad - essential for sustained high-load operation.
Is TCR2EN30,LF RoHS compliant and lead-free?
Yes, TCR2EN30,LF is RoHS compliant and lead-free, as confirmed by Toshiba's official product documentation and environmental compliance statements. The ",LF" suffix explicitly denotes lead-free termination, and the device meets EU RoHS Directive 2011/65/EU requirements - making it suitable for commercial and industrial applications requiring environmentally regulated components.
TCR2EN30,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TCR2EN
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.18V @ 150mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- 73dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SDFN (0.8x0.8)
TCR2EN30,LF FAQ
1.How can I place an order for TCR2EN30,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR2EN30,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR2EN30,LF reliable?
The price and inventory of TCR2EN30,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2EN30,LF is usually 5 days.
3.What payment methods are accepted for TCR2EN30,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2EN30,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR2EN30,LF?
TCR2EN30,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR2EN30,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR2EN30,LF?
For technical support, including TCR2EN30,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2EN30,LF requirements.
6.How does Aetrix verify that TCR2EN30,LF is sourced from the original manufacturer or authorized distributors?
All TCR2EN30,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2EN30,LF meets industry standards.
7.What is the process for return or replacement of TCR2EN30,LF?
All TCR2EN30,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCR2EN30,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR2EN30,LF part is unused and in its original packaging.
Return procedure for TCR2EN30,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TCR2EN30,LF Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

