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Toshiba Semiconductor and Storage TCR2EN35,LF(SE
- Part No.:
- TCR2EN35,LF(SE
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TCR2EN35,LF(SE.pdf
- Description:
- LDO REG VOUT=3.5V IOUT=200MA
- Quantity:
- Payment:
- Shipping:
Inventory:7,500
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Product details
Overview
TCR2EN35,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a 3.5 V fixed-output CMOS low dropout regulator in an ultra-small SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm), delivering up to 200 mA with 160 mV typical dropout at 150 mA, ±1.0% output accuracy, and 35 µVrms output noise - designed for power management in space-constrained portable electronics such as cellular phone baseband ICs.
For engineers reviewing the TCR2EN35,LF(SE) datasheet, TCR2EN35,LF(SE) pinout, TCR2EN35,LF(SE) application, or TCR2EN35,LF(SE) equivalent, key selection criteria include its 130–180 mV dropout range for 3.0–3.6 V outputs, Auto-discharge function, on/off control interface, and compatibility with 0.1 µF input / 1.0 µF ceramic output capacitors in high-density PCB layouts.
Technical Context
The TCR2EN35,LF(SE) integrates a CMOS pass transistor with internal voltage reference, error amplifier, and overcurrent protection circuitry. Its on/off control input accepts 0–0.4 V (OFF) and 1.0–5.5 V (ON) logic levels, enabling precise system-level power sequencing.
It operates across −40°C to +85°C ambient temperature, supports input voltages from 1.5 V to 5.5 V, and maintains stable regulation with ceramic capacitors having ESR < 10 Ω - eliminating need for tantalum or aluminum electrolytic types.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.5 V ±1.0% (guaranteed accuracy for stable core/logic rail generation) |
| Max Output Current | 200 mA (supports moderate-power RF transceivers or sensor interfaces) |
| Dropout Voltage | 130–180 mV (typ.) at 3.0–3.6 V output, 150 mA load (enables operation from single-cell Li-ion or 3.3 V rails) |
| Quiescent Current | 35 µA (typ.) at zero load (extends battery life in always-on standby modes) |
| Output Noise | 35 µVrms (typ., 10 Hz–100 kHz, 2.5 V ref; scaled performance confirmed for 3.5 V via family characterization) |
| Load Transient Response | ±55 mV (typ., 1 mA ↔ 150 mA step, 1.0 µF COUT; ensures stable supply during burst-mode processor activity) |
| Ripple Rejection | 73 dB (typ., 1 kHz, 2.5 V ref; validated for 3.5 V via consistent architecture and test conditions) |
Pinout & Package
TCR2EN35,LF(SE) uses the SDFN4E ultra-small plastic mold package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg weight), with exposed thermal pad connected to GND for enhanced thermal performance. Pin 1 = VOUT, Pin 2 = CONTROL, Pin 3 = GND, Pin 4 = VIN. Center electrode must be connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VOUT | Regulated output terminal | Delivers stable 3.5 V to load; requires 1.0 µF ceramic capacitor placed adjacent to pin for stability |
| CONTROL | Enable/disable logic input | Active-high control: 0–0.4 V = OFF (standby current ≤1.0 µA), 1.0–5.5 V = ON; internal pull-down ensures default OFF state |
| GND | Ground reference and thermal path | Common return for all circuits; center electrode connection required for thermal dissipation and noise immunity |
| VIN | Unregulated input supply | Accepts 1.5–5.5 V; requires 0.1 µF ceramic capacitor near pin to suppress high-frequency noise |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Internally discharges VOUT capacitor when CONTROL = LOW, preventing residual voltage hold-up in power-down sequences |
| Low-noise CMOS architecture | 35 µVrms output noise enables clean supply for RF front-ends and precision ADCs without external filtering |
| Fast load transient response | ±55 mV deviation under 1 mA ↔ 150 mA load steps ensures minimal voltage sag during CPU wake-up or radio transmission bursts |
| Overcurrent protection | Current-limiting circuit prevents damage during short-circuit or overload; recovery is automatic upon fault removal |
| Ceramic capacitor compatibility | Stable operation with 0.1 µF CIN and 1.0 µF COUT eliminates need for larger, less reliable electrolytic types |
Applications
| Smartphone Baseband Power | Wearable Sensor Hub |
|---|---|
|
Use Scenario: Powering application processors and memory in compact smartphone mainboards where board area is constrained. IC Role / Device Role / Timing Role: Primary 3.5 V LDO supplying core logic voltage to baseband ICs with fast dynamic load demands. Use Value: Ultra-small SDFN4E footprint saves >0.5 mm² vs. standard SOT-23 packages; 35 µVrms noise avoids interference with RF receivers. |
Use Scenario: Regulating power for multi-sensor fusion modules (accelerometer, gyroscope, HRM) in wrist-worn wearables. IC Role / Device Role / Timing Role: Low-quiescent-current (35 µA) LDO enabling multi-day battery life while supporting rapid wake-from-sleep transitions. Use Value: Auto-discharge function clears residual charge during sleep mode, eliminating unintended wake events caused by floating VOUT. |
| IoT Edge Node MCU | Bluetooth LE Audio Module |
|
Use Scenario: Providing clean 3.5 V supply to ARM Cortex-M microcontrollers in battery-powered industrial IoT nodes. IC Role / Device Role / Timing Role: Main system regulator with on/off control synchronized to wireless transmission duty cycles. Use Value: 130–180 mV dropout allows efficient use of partially discharged Li-ion cells (down to ~3.65 V), extending operational runtime. |
Use Scenario: Powering Bluetooth LE audio codecs and DACs in true wireless stereo (TWS) earbuds with strict EMI limits. IC Role / Device Role / Timing Role: Low-noise, fast-transient LDO decoupling sensitive analog audio paths from digital switching noise. Use Value: 73 dB ripple rejection at 1 kHz suppresses switching noise from DC-DC converters feeding the same PCB domain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-dropout regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP2112K-3.5TRG1 | Higher quiescent current (60 µA typ.), no Auto-discharge, SOT-23-5 package (2.9 mm × 1.6 mm) | Larger footprint; lacks controlled discharge for deep-sleep systems | Choose if cost sensitivity outweighs size/noise requirements and Auto-discharge is unnecessary |
| MCP1703T-3502E/MB | Higher dropout (300 mV typ. @ 250 mA), 6 µVrms noise, SOT-23-5 package | Better noise performance but lower efficiency at light loads due to higher IQ (2.5 µA) | Prefer for ultra-low-noise analog sections where dropout margin permits; not suitable for tight input-headroom designs |
Compared with TCR2EN35,LF(SE), AP2112K-3.5TRG1 trades size and smart features for lower unit cost, while MCP1703T-3502E/MB prioritizes noise suppression over dropout and footprint - making TCR2EN35,LF(SE) optimal for space-constrained, battery-sensitive, fast-transient applications requiring integrated control and discharge.
Availability
TCR2EN35,LF(SE) is available at Aetrix Electronics and suitable for smartphone baseband power, wearable sensor hubs, and IoT edge node MCU applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for TCR2EN35,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with expertise in power management, logic, and memory technologies.
The TCR2EN series targets portable electronics requiring ultra-compact, low-noise, low-IQ LDOs - specifically engineered for high-density mobile and wearable platforms where board space and battery life are critical constraints.
FAQ
What is the guaranteed output voltage accuracy of TCR2EN35,LF(SE) across temperature and load?
The TCR2EN35,LF(SE) guarantees ±1.0% output voltage accuracy for 3.5 V output at 50 mA load and 25°C junction temperature. Over the full operating range (−40°C to +85°C ambient, 1–150 mA load), accuracy remains within ±1.0% for VOUT ≥ 1.8 V per Toshiba's Electrical Characteristics table - confirmed for TCR2EN35,LF(SE) via family-wide specification alignment and marking code NY (3.5 V).
Does TCR2EN35,LF(SE) require external components for stable operation?
Yes - TCR2EN35,LF(SE) requires a 0.1 µF ceramic capacitor at VIN and a 1.0 µF ceramic capacitor at VOUT, both placed as close as possible to their respective pins. These values are specified in Toshiba's Electrical Characteristics and Application Note sections and are mandatory for stability, transient response, and noise performance.
What is the maximum input voltage rating for TCR2EN35,LF(SE)?
The absolute maximum input voltage for TCR2EN35,LF(SE) is 6.0 V, as defined in the Absolute Maximum Ratings table. However, the recommended operating input voltage range is 1.5 V to 5.5 V - exceeding 5.5 V risks violating safe operating area limits even if below 6.0 V absolute max.
How does the Auto-discharge function operate in TCR2EN35,LF(SE)?
When the CONTROL pin is driven LOW (≤0.4 V), TCR2EN35,LF(SE) activates an internal discharge switch between VOUT and GND, actively pulling down the output capacitor voltage. This ensures rapid, controlled discharge of VOUT during shutdown - preventing residual voltage that could cause latch-up or false wake events in downstream circuitry.
Is TCR2EN35,LF(SE) compatible with lead-free reflow soldering processes?
Yes - TCR2EN35,LF(SE) is qualified for lead-free reflow soldering per JEDEC J-STD-020, with a peak reflow temperature of 260°C. The "LF" in the part number explicitly denotes lead-free termination, and the SDFN4E package meets RoHS Directive 2011/65/EU requirements as confirmed by Toshiba's compliance documentation.
TCR2EN35,LF(SE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.5V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.18V @ 150mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SDFN (0.8x0.8)
TCR2EN35,LF(SE FAQ
1.How can I place an order for TCR2EN35,LF(SE through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR2EN35,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR2EN35,LF(SE reliable?
The price and inventory of TCR2EN35,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2EN35,LF(SE is usually 5 days.
3.What payment methods are accepted for TCR2EN35,LF(SE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2EN35,LF(SE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR2EN35,LF(SE?
TCR2EN35,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR2EN35,LF(SE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR2EN35,LF(SE?
For technical support, including TCR2EN35,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2EN35,LF(SE requirements.
6.How does Aetrix verify that TCR2EN35,LF(SE is sourced from the original manufacturer or authorized distributors?
All TCR2EN35,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2EN35,LF(SE meets industry standards.
7.What is the process for return or replacement of TCR2EN35,LF(SE?
All TCR2EN35,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR2EN35,LF(SE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR2EN35,LF(SE part is unused and in its original packaging.
Return procedure for TCR2EN35,LF(SE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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