Toshiba Semiconductor and Storage TCR2EN36,LF(SE
- Part No.:
- TCR2EN36,LF(SE
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TCR2EN36,LF(SE.pdf
- Description:
- LDO REG VOUT=3.6V IOUT=200MA
- Quantity:
- Payment:

- Shipping:

Inventory:10,000
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Product details
Overview
TCR2EN36,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a 3.6 V fixed-output CMOS low dropout (LDO) voltage regulator in an ultra-small SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm), delivering up to 200 mA with 130 mV typical dropout at 3.0–3.6 V output, ±1.0% output accuracy, and 35 µVrms output noise - designed for power management in space-constrained portable electronics such as cellular phones and wearables.
For engineers reviewing the TCR2EN36,LF(SE) datasheet, TCR2EN36,LF(SE) pinout, TCR2EN36,LF(SE) application, or TCR2EN36,LF(SE) equivalent, key selection criteria include its 130 mV dropout at 3.6 V/150 mA, 35 µVrms noise performance, Auto-discharge function, on/off control interface, and compatibility with 0.1 µF input / 1.0 µF ceramic output capacitors.
Technical Context
The TCR2EN36,LF(SE) implements a CMOS-based LDO architecture with integrated overcurrent protection and an active Auto-discharge circuit that rapidly discharges the output capacitor when disabled via the CONTROL pin. Its internal reference and error amplifier enable high DC accuracy (±1.0% for VOUT ≥ 1.8 V) and tight load regulation (±30 mV across 1–150 mA).
It operates with a quiescent current of only 35 µA (typ.) in active mode and drops to 0.1 µA (typ.) in standby, supporting battery-sensitive applications. The device achieves 73 dB ripple rejection at 1 kHz and maintains stable operation with ceramic capacitors due to optimized phase compensation - no ESR requirements beyond <10 Ω.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.6 V with ±1.0% accuracy (ensures stable core/logic rail for 3.3 V–3.6 V systems) |
| Max Output Current | 200 mA (supports moderate-power RF modules, sensors, or MCU peripherals) |
| Dropout Voltage | 130 mV (typ.) at 3.6 V/150 mA (enables operation down to VIN = 3.73 V, extending battery runtime) |
| Quiescent Current | 35 µA (typ.) at zero load (minimizes standby power loss in always-on subsystems) |
| Output Noise | 35 µVrms (typ., 10 Hz–100 kHz, 2.5 V ref; scaled per output - confirms low-noise suitability for analog/RF supply rails) |
| Ripple Rejection | 73 dB (typ., 1 kHz) - suppresses switching noise from upstream DC-DC converters |
| Load Transient Response | ±55 mV (typ., 1 mA ↔ 150 mA step, COUT = 1.0 µF) - maintains regulation during burst-mode processor activity |
| Control Interface | Active-high ON/OFF (VCT(ON) ≥ 1.0 V; VCT(OFF) ≤ 0.4 V) with internal pull-down - simplifies host MCU GPIO control |
Pinout & Package
TCR2EN36,LF(SE) uses the ultra-compact SDFN4/SDFN4E package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg weight), featuring a bottom-exposed thermal pad (to be connected to GND for optimal thermal performance). Pin assignment is verified per Toshiba's top-view diagram and electrical specifications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input power supply | Accepts 1.5–5.5 V input; requires 0.1 µF ceramic decoupling close to pin |
| VOUT | Regulated output | Delivers stable 3.6 V ±1.0%; connects to 1.0 µF ceramic output capacitor |
| GND | Ground reference | Common return for input/output/control; center thermal pad must connect to GND plane |
| CONTROL | Enable/disable input | Active-high logic control (1.0–5.5 V ON range); internal pull-down ensures default OFF state |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | SDFN4/SDFN4E (0.8 mm × 0.8 mm) enables high-density PCB layouts in smartphones and hearables |
| Auto-discharge function | Actively discharges VOUT when CONTROL = LOW - prevents residual voltage from interfering with system reset sequencing |
| Ceramic capacitor support | Stable with 0.1 µF CIN and 1.0 µF COUT (ESR < 10 Ω) - eliminates need for bulkier tantalum or aluminum electrolytics |
| Low-noise regulation | 35 µVrms noise (2.5 V ref) - suitable for powering ADC references, RF transceivers, and precision analog circuits |
| Fast transient recovery | ±55 mV deviation under 1→150 mA load step - maintains system stability during CPU wake-up or sensor activation |
| Overcurrent protection | Current-limiting foldback prevents thermal runaway during short-circuit or overload conditions |
Applications
| Smartphone Power Rails | Wearable Sensor Subsystem |
|---|---|
Use Scenario: Supplying 3.6 V to Bluetooth LE radio and motion sensor cluster in compact wearable form factor. IC Role / Device Role / Timing Role: Primary LDO regulator providing clean, low-noise bias for RF front-end and MEMS accelerometer/gyro. Use Value: Ultra-small SDFN4 package saves board area; 35 µVrms noise minimizes RF desense; Auto-discharge ensures clean power-down during sleep mode. | Use Scenario: Powering always-on environmental sensor hub (temperature/humidity/pressure) in fitness tracker. IC Role / Device Role / Timing Role: Low-quiescent-current LDO enabling multi-week battery life while maintaining precise 3.6 V rail. Use Value: 35 µA IQ extends battery life; ±1.0% accuracy ensures consistent sensor calibration; fast load response handles intermittent data bursts. |
| Portable Medical Monitor | IoT Edge Node MCU Core |
Use Scenario: Regulating 3.6 V for analog front-end and display driver in handheld pulse oximeter. IC Role / Device Role / Timing Role: Precision LDO supplying noise-sensitive analog signal chain and OLED display bias. Use Value: 73 dB ripple rejection suppresses switching noise from main PMIC; low dropout preserves battery headroom during low-VIN operation. | Use Scenario: Providing 3.6 V core voltage to ARM Cortex-M4 MCU in battery-powered industrial sensor node. IC Role / Device Role / Timing Role: System-level LDO managing active/standby states via CONTROL pin synchronized with MCU sleep modes. Use Value: Active-high CONTROL interface simplifies GPIO control; 0.1 µA standby current enables years of operation on coin cell; 130 mV dropout maximizes usable battery range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B362MR-G | Same 3.6 V output, 200 mA rating, SOT-25 package (2.9 mm × 2.8 mm) - 3.6× larger footprint than SDFN4 | Lacks Auto-discharge; higher 65 µA quiescent current; no guaranteed 35 µVrms noise spec | Choose when board space permits larger package and Auto-discharge is not required |
| Rohm BD3572EFJ-ME2 | 3.6 V, 200 mA, HTSOP-J8 package (4.0 mm × 4.0 mm); 200 mV dropout at 150 mA; 45 µVrms noise | Includes thermal shutdown but no Auto-discharge; requires minimum 1.0 µF COUT with specific ESR range | Prefer when thermal robustness is prioritized over size and discharge control |
Compared with TCR2EN36,LF(SE), the XC6210B362MR-G offers functional equivalence but sacrifices board-area efficiency and discharge control, while the BD3572EFJ-ME2 trades ultra-miniaturization for enhanced thermal protection - making TCR2EN36,LF(SE) optimal where space, noise, and controlled shutdown are critical.
Availability
TCR2EN36,LF(SE) is available at Aetrix Electronics and suitable for smartphone power management, wearable sensor subsystems, portable medical monitors, and IoT edge node MCUs requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for TCR2EN36,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions, with global R&D and manufacturing infrastructure focused on power management, logic, memory, and discrete devices.
The TCR2EN series belongs to Toshiba's CMOS Linear Integrated Circuit line, engineered specifically for ultra-compact, low-noise, low-quiescent-current LDO regulation in battery-powered portable electronics.
FAQ
What is the maximum input voltage rating for TCR2EN36,LF(SE)?
The absolute maximum input voltage for TCR2EN36,LF(SE) is 6.0 V. However, the recommended operating range is 1.5 V to 5.5 V per electrical characteristics testing conditions. Exceeding 5.5 V may compromise reliability or trigger overvoltage stress not covered by standard qualification tests.
Does TCR2EN36,LF(SE) require external components for stable operation?
Yes - TCR2EN36,LF(SE) requires a 0.1 µF ceramic capacitor at VIN and a 1.0 µF ceramic capacitor at VOUT, both placed as close as possible to their respective pins. These capacitors ensure stability, transient response, and noise suppression; no additional compensation network is needed.
How does the Auto-discharge function operate in TCR2EN36,LF(SE)?
When the CONTROL pin is driven LOW (≤0.4 V), TCR2EN36,LF(SE) disables regulation and activates an internal discharge transistor between VOUT and GND. This rapidly drains residual charge from the output capacitor, preventing unintended wake-up or latch-up in downstream circuitry during power-down sequences.
What is the dropout voltage of TCR2EN36,LF(SE) at full 200 mA load?
At 3.6 V output and 150 mA load (the highest tested condition in datasheet tables), TCR2EN36,LF(SE) exhibits 130 mV typical dropout. At 200 mA, dropout increases slightly - extrapolating from the 3.0–3.6 V curve, it remains ≤180 mV (max), ensuring reliable operation down to VIN ≈ 3.78 V.
Is TCR2EN36,LF(SE) compatible with lead-free reflow soldering processes?
Yes - TCR2EN36,LF(SE) is rated for lead-free reflow soldering per JEDEC J-STD-020. Its SDFN4/SDFN4E package supports peak reflow temperatures up to 260°C (MSL Level 1), and the "LF" in the part number explicitly denotes lead-free termination and RoHS compliance.
TCR2EN36,LF(SE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.6V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.18V @ 150mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SDFN (0.8x0.8)
TCR2EN36,LF(SE FAQ
1.How can I place an order for TCR2EN36,LF(SE through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR2EN36,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR2EN36,LF(SE reliable?
The price and inventory of TCR2EN36,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2EN36,LF(SE is usually 5 days.
3.What payment methods are accepted for TCR2EN36,LF(SE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2EN36,LF(SE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR2EN36,LF(SE?
TCR2EN36,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR2EN36,LF(SE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR2EN36,LF(SE?
For technical support, including TCR2EN36,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2EN36,LF(SE requirements.
6.How does Aetrix verify that TCR2EN36,LF(SE is sourced from the original manufacturer or authorized distributors?
All TCR2EN36,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2EN36,LF(SE meets industry standards.
7.What is the process for return or replacement of TCR2EN36,LF(SE?
All TCR2EN36,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR2EN36,LF(SE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR2EN36,LF(SE part is unused and in its original packaging.
Return procedure for TCR2EN36,LF(SE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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