Toshiba Semiconductor and Storage TCR2LN12,LF

Overview

TCR2LN12,LF from Toshiba Electronic Devices & Storage Corporation is a fixed-output 1.2 V CMOS low dropout (LDO) voltage regulator with on/off control input, ultra-low 2 μA max quiescent current at zero load, 200 mA output capability, and 680 mV typical dropout voltage at 150 mA - designed for power management in space-constrained portable electronics.

For engineers reviewing the TCR2LN12,LF datasheet, TCR2LN12,LF pinout, TCR2LN12,LF application, or TCR2LN12,LF equivalent, this device is selected for battery-powered systems requiring high efficiency, minimal board area, stable low-voltage rail generation, and auto-discharge functionality during shutdown.

Technical Context

The TCR2LN12,LF employs a CMOS-based pass transistor architecture enabling ultra-low quiescent current and fast transient response. Its integrated on/off control input supports active-high enable logic with internal pull-down, while auto-discharge circuitry actively discharges the output capacitor when disabled.

It operates across −40°C to +85°C ambient temperature, supports ceramic input/output capacitors as small as 0.1 μF, and maintains ±1.0% output accuracy for 1.8 V ≤ VOUT - with TCR2LN12,LF's 1.2 V output specified at ±18 mV (±1.5%) over temperature per electrical characteristics table.

Key Specifications

Pinout & Package

TCR2LN12,LF is housed in the SDFN4 plastic mold package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg typical weight), featuring a bottom-exposed thermal pad that must be connected to GND or left floating per datasheet recommendation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TCR2LN12,LF, the XC6219B122MR-G offers lower quiescent current but lacks auto-discharge and occupies 9× more PCB area, while RP114K121D-TR-F achieves sub-μA IQ yet sacrifices output accuracy and discharge functionality - making TCR2LN12,LF optimal for space-limited, battery-critical designs requiring controlled shutdown behavior.

Availability

TCR2LN12,LF is available at Aetrix Electronics and suitable for wearable health monitors, Bluetooth LE sensor nodes, smart card readers, and industrial wireless transmitters requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for TCR2LN12,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and analog ICs for consumer, industrial, and automotive markets.

The TCR2LN series targets ultra-compact, battery-powered electronics - delivering high-efficiency, low-noise, and space-optimized LDO regulation for next-generation portable and IoT endpoints.

FAQ

What is the output voltage tolerance of TCR2LN12,LF over temperature?

The TCR2LN12,LF specifies output voltage tolerance of ±18 mV (±1.5%) across −40°C to +85°C ambient temperature at IOUT = 50 mA, as defined in the Electrical Characteristics table under "Output voltage" test condition for VOUT < 1.8 V. This is tighter than generic ±2% LDOs and supports precision analog subsystems.

Does TCR2LN12,LF require an external pull-down resistor on the CONTROL pin?

No - TCR2LN12,LF integrates a 0.1 μA internal pull-down current source between CONTROL and GND, ensuring reliable OFF-state default behavior without external components. This simplifies design and reduces BOM count compared to LDOs requiring external biasing.

Can TCR2LN12,LF operate with only 0.1 μF input and output capacitors?

Yes - TCR2LN12,LF is explicitly characterized and stabilized with 0.1 μF ceramic capacitors on both VIN and VOUT pins. Toshiba recommends using X5R/X7R types with ESR under 10 Ω; no additional bulk capacitance is needed, enabling minimal footprint layouts.

What is the thermal performance of TCR2LN12,LF in the SDFN4 package?

TCR2LN12,LF in SDFN4 achieves 300 mW power dissipation on a standard FR4 board (40 mm × 40 mm, 1.6 mm thick, 50% copper coverage). Its 0.38 mm profile and exposed thermal pad allow efficient heat transfer to the PCB ground plane, supporting continuous 200 mA operation at +70°C ambient with proper layout.

How does the auto-discharge function work in TCR2LN12,LF?

When the CONTROL pin is driven LOW or floats, TCR2LN12,LF activates an internal 20 Ω discharge path between VOUT and GND, rapidly draining stored charge from the output capacitor. This prevents unintended wake-up or latch-up in downstream circuits during system sleep - a key feature absent in most competing 200 mA LDOs.