My Inquiry
My Account
Toshiba Semiconductor and Storage TCR2LN21,LF(SE
- Part No.:
- TCR2LN21,LF(SE
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
TCR2LN21,LF(SE.pdf
- Description:
- LDO REG VOUT=2.1V I=200MA
- Quantity:
- Payment:
- Shipping:
Inventory:8,525
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TCR2LN21,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a 2.1 V fixed-output, 200 mA CMOS low dropout (LDO) regulator with ultra-low quiescent current (2 μA max), on/off control input, and auto-discharge function-designed for power management in space-constrained portable electronics such as cellular phones and wearables.
For engineers reviewing the TCR2LN21,LF(SE) datasheet, TCR2LN21,LF(SE) pinout, TCR2LN21,LF(SE) application, or TCR2LN21,LF(SE) equivalent, this device offers verified 2.1 V output accuracy (±1.0 %), 300 mV typical dropout at 150 mA, SDFN4 ultra-small package (0.8 mm × 0.8 mm × 0.38 mm), and compatibility with 0.1 μF ceramic input/output capacitors-key selection criteria for battery-powered, high-density PCB designs.
Technical Context
The TCR2LN21,LF(SE) implements a CMOS-based LDO architecture with integrated overcurrent protection and an active pull-down circuit on the CONTROL pin to ensure reliable shutdown. Its internal reference and error amplifier deliver stable regulation across −40 °C to +85 °C ambient temperature.
It operates with input voltages from 1.5 V to 5.5 V, supports ON/OFF control via a logic-level compatible CONTROL pin (VCT(ON) = 1.0–5.5 V), and features auto-discharge through a 20 Ω internal discharge path when disabled-enabling rapid output voltage decay for system-level power sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 2.1 V ±1.0 % (ensures precise rail generation for 2.1 V–sensitive logic or RF ICs) |
| Max Output Current | 200 mA (supports moderate-power microcontrollers, sensors, or Bluetooth SoCs) |
| Quiescent Current | 2 μA max at IOUT = 0 mA (extends battery life in always-on or sleep-mode applications) |
| Dropout Voltage | 300 mV typ. at 150 mA (enables regulation down to VIN = 2.4 V for 2.1 V output) |
| Package | SDFN4 (0.8 mm × 0.8 mm × 0.38 mm, 4-pin, bottom thermal pad; enables <1 mm² board footprint) |
| Capacitor Support | 0.1 μF ceramic input/output (reduces BOM count and saves space vs. larger tantalum/aluminum caps) |
| Control Interface | Active-high CONTROL pin with 0.4 V max VCT(OFF); internal 0.1 μA pull-down ensures default OFF state |
Pinout & Package
TCR2LN21,LF(SE) is housed in the SDFN4 plastic mold package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg typical weight), featuring a thermally enhanced center electrode that must be connected to GND or left open per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input Power Supply | Accepts 1.5–5.5 V DC; requires local 0.1 μF ceramic decoupling capacitor |
| CONTROL | Enable/Disable Control Input | Logic-high (≥1.0 V) enables regulation; logic-low (≤0.4 V) disables output and activates auto-discharge |
| GND | Ground Reference | Common return path for VIN, VOUT, and CONTROL; center pad must be connected to GND plane for thermal performance |
| VOUT | Regulated Output | Delivers stable 2.1 V ±1.0 %; requires 0.1 μF ceramic capacitor placed adjacent to pin |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low quiescent current | 2 μA max at zero load-critical for multi-year battery operation in IoT endpoints |
| Low dropout at full load | 300 mV typ. @ 150 mA enables efficient use of single-cell Li-ion or coin-cell sources |
| Auto-discharge function | 20 Ω internal discharge path clears VOUT within microseconds after disable-prevents back-powering or latch-up |
| High output accuracy | ±1.0 % tolerance for 2.1 V output ensures compliance with tight supply rails of modern MCUs and RF transceivers |
| Small-footprint packaging | SDFN4 package allows placement under connectors or near BGA devices-ideal for stacked PCB architectures |
Applications
| Wearable Sensor Node | Bluetooth LE Module Power |
|---|---|
|
Use Scenario: Compact wearable health monitor with optical heart-rate sensor and ARM Cortex-M0+ MCU operating from a 3.0 V coin cell. IC Role / Device Role / Timing Role: Primary 2.1 V LDO supplying sensor analog front-end and MCU core logic. Use Value: Ultra-low 2 μA quiescent current extends battery life beyond 12 months; SDFN4 footprint fits beneath OLED display flex cable. |
Use Scenario: Low-energy Bluetooth module in smart home remote requiring fast wake/sleep transitions and clean 2.1 V supply for radio section. IC Role / Device Role / Timing Role: Controlled power rail enabling rapid enable/disable synchronized with BLE advertising intervals. Use Value: Auto-discharge clears VOUT in <10 μs upon disable-eliminating leakage paths and ensuring deterministic radio reset timing. |
| Portable Medical Diagnostic Device | Miniature GPS Tracker |
|
Use Scenario: Handheld point-of-care glucose meter powered by two AAA batteries (3.0 V nominal) with strict EMC and size constraints. IC Role / Device Role / Timing Role: Precision 2.1 V regulator for ADC reference and op-amp signal conditioning circuitry. Use Value: ±1.0 % output accuracy maintains measurement linearity; 0.1 μF ceramic cap support avoids ESR-related noise coupling into sensitive analog stages. |
Use Scenario: Asset tracker using u-blox M8 chip and GSM modem, mounted in confined enclosure with limited thermal mass. IC Role / Device Role / Timing Role: Secondary 2.1 V rail for GNSS baseband processor during cold-start acquisition phase. Use Value: 300 mV dropout allows operation down to 2.4 V input-maximizing usable battery voltage range before brownout; SDFN4 thermal pad improves heat dissipation under pulsed 150 mA loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R1190J211B-TR-FE | 2.1 V fixed, 150 mA max, 250 mV dropout @ 100 mA, SOT-23-5 package (2.9 mm × 2.8 mm) | Larger footprint and lower current rating; no auto-discharge function | Select if board space permits larger package and auto-discharge is not required for system sequencing |
| MCP1711T-2102E/MB | 2.1 V fixed, 250 mA max, 220 mV dropout @ 150 mA, SOT-23-5 package; 1.6 μA quiescent current | Same pinout as R1190 but lacks CONTROL pin-requires external enable circuitry | Choose when lowest possible quiescent current is critical and external enable control is acceptable |
Compared with R1190J211B-TR-FE and MCP1711T-2102E/MB, the TCR2LN21,LF(SE) uniquely combines 200 mA capability, integrated CONTROL pin with auto-discharge, and sub-1 mm² SDFN4 packaging-making it optimal for ultra-compact, battery-sensitive systems requiring deterministic power sequencing without added components.
Availability
TCR2LN21,LF(SE) is available at Aetrix Electronics and suitable for portable medical diagnostics, wearable sensor nodes, Bluetooth LE modules, and miniature GPS trackers requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.
Supply support for TCR2LN21,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures high-reliability semiconductor solutions, with expertise in power management, logic, memory, and discrete devices for consumer, industrial, and automotive markets.
The TCR2LN series was developed specifically for ultra-low-power, space-constrained portable electronics-emphasizing minimal quiescent current, small-footprint packaging, and robust performance across wide temperature and load ranges.
FAQ
What is the output voltage tolerance of the TCR2LN21,LF(SE) over temperature?
The TCR2LN21,LF(SE) guarantees ±1.0 % output voltage accuracy for 2.1 V output across the full operating temperature range of −40 °C to +85 °C. This specification is confirmed in the Electrical Characteristics table under "Output voltage" (VOUT) test condition for VOUT ≥ 1.8 V, with no additional derating required within the specified junction temperature limit of 150 °C.
Does the TCR2LN21,LF(SE) require external components for stable operation?
No external compensation is needed-the TCR2LN21,LF(SE) is internally compensated and fully stable with only 0.1 μF ceramic capacitors on both VIN and VOUT pins. Toshiba explicitly validates this configuration in the Application Note and Electrical Characteristics sections, confirming stability across all output voltages and load conditions up to 200 mA.
How does the auto-discharge function operate in the TCR2LN21,LF(SE)?
When the CONTROL pin is driven low (≤0.4 V), the TCR2LN21,LF(SE) disables regulation and activates an internal 20 Ω discharge path between VOUT and GND. This rapidly discharges the output capacitor-typically clearing VOUT to <100 mV within microseconds-preventing back-powering of upstream circuitry and supporting clean system-level power sequencing.
What is the maximum allowable input voltage for the TCR2LN21,LF(SE)?
The absolute maximum input voltage for the TCR2LN21,LF(SE) is 6.0 V, as defined in the Absolute Maximum Ratings table. However, for reliable continuous operation, the recommended maximum VIN is 5.5 V at TJ = 25 °C, with derating applied at higher junction temperatures to maintain power dissipation within the 300 mW board-mounted limit.
Can the TCR2LN21,LF(SE) be used with input voltages below its output voltage?
No-the TCR2LN21,LF(SE) is a linear regulator and cannot boost voltage. It requires VIN ≥ VOUT + VDO. For a 2.1 V output, minimum functional VIN is approximately 2.4 V (2.1 V + 300 mV typical dropout). Operation below this threshold results in unregulated output and potential instability; the device will not regulate until VIN exceeds the dropout threshold.
TCR2LN21,LF(SE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TCR2LN
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.54V @ 150mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 2 µA
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-SDFN (0.8x0.8)
TCR2LN21,LF(SE FAQ
1.How can I place an order for TCR2LN21,LF(SE through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR2LN21,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR2LN21,LF(SE reliable?
The price and inventory of TCR2LN21,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2LN21,LF(SE is usually 5 days.
3.What payment methods are accepted for TCR2LN21,LF(SE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2LN21,LF(SE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR2LN21,LF(SE?
TCR2LN21,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR2LN21,LF(SE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR2LN21,LF(SE?
For technical support, including TCR2LN21,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2LN21,LF(SE requirements.
6.How does Aetrix verify that TCR2LN21,LF(SE is sourced from the original manufacturer or authorized distributors?
All TCR2LN21,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2LN21,LF(SE meets industry standards.
7.What is the process for return or replacement of TCR2LN21,LF(SE?
All TCR2LN21,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR2LN21,LF(SE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR2LN21,LF(SE part is unused and in its original packaging.
Return procedure for TCR2LN21,LF(SE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TCR2LN21,LF(SE Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
