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Toshiba Semiconductor and Storage TCR2LN31,LF(SE

Part No.:
TCR2LN31,LF(SE
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
4-XFDFN Exposed Pad
Datasheet:
AetrixTCR2LN31,LF(SE.pdf
Description:
LDO REG VOUT=3.1V I=200MA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,400

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Product details

Overview

TCR2LN31,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a fixed-output 3.1 V CMOS low dropout (LDO) voltage regulator with ultra-low quiescent current (2 μA max), 200 mA output capability, and integrated on/off control input - designed for power management in space-constrained portable electronics such as cellular phones and wearables.

For engineers reviewing the TCR2LN31,LF(SE) datasheet, TCR2LN31,LF(SE) pinout, TCR2LN31,LF(SE) application, or TCR2LN31,LF(SE) equivalent, key selection criteria include dropout voltage at 150 mA (200 mV typ. for 3.1 V output), ±1.0% output accuracy (≥1.8 V), auto-discharge function, SDFN4 package footprint (0.8 mm × 0.8 mm), and compatibility with 0.1 μF ceramic input/output capacitors.

Technical Context

The TCR2LN31,LF(SE) implements a CMOS-based LDO architecture with internal P-channel MOSFET pass device, enabling low dropout operation and minimal bias current draw across −40°C to +85°C ambient range. Its CONTROL pin supports active-high enable logic with 1.0–5.5 V ON threshold and 0–0.4 V OFF threshold, and includes internal pull-down to GND.

It integrates overcurrent protection and an auto-discharge path (20 Ω typical) that actively discharges the output capacitor when disabled. The regulator maintains stable regulation using only 0.1 μF ceramic capacitors on both input and output, eliminating need for bulk electrolytics or high-ESR components.

Key Specifications

Parameter Value and Actual Design Meaning
Output Voltage Fixed 3.1 V ±1.0% (ensures precise rail generation for 3.3 V–tolerant logic and RF subsystems)
Max Output Current 200 mA (supports moderate-power microcontrollers, sensors, and Bluetooth modules)
Dropout Voltage 200 mV (typ.) at IOUT = 150 mA (enables operation down to VIN = 3.3 V while maintaining regulation)
Quiescent Current 2 μA (max) at IOUT = 0 mA (extends battery life in always-on or sleep-mode applications)
Input Voltage Range 1.5 V to 5.5 V (compatible with single-cell Li-ion, Li-poly, or 3.3 V/5 V system rails)
Package SDFN4 (0.8 mm × 0.8 mm × 0.38 mm, 4-pin, bottom thermal pad; enables <1 mm² board area usage)
Auto-Discharge Enabled via internal 20 Ω discharge path (prevents residual output voltage during shutdown, critical for sequencing)

Pinout & Package

SDFN4 package: ultra-small 4-pin plastic mold package (0.8 mm × 0.8 mm × 0.38 mm) with exposed thermal pad (to be connected to GND). Weight: 0.6 mg (typ.).

Pin/Terminal Circuit Role Design Meaning
VIN Input supply connection Accepts 1.5–5.5 V input; requires 0.1 μF ceramic decoupling close to pin
VOUT Regulated output Delivers stable 3.1 V ±1.0%; supports 0.1 μF ceramic output capacitor with ESR <10 Ω
GND Ground reference and thermal pad connection Common return path; exposed pad must be soldered to PCB GND plane for thermal and electrical performance
CONTROL Enable/disable control input Active-high logic: ≥1.0 V enables regulator; ≤0.4 V disables it and activates auto-discharge

Key Features

Feature Design Value
Ultra-low quiescent current 2 μA max at zero load ensures >10-year battery life in coin-cell-powered IoT sensors
Low dropout with CMOS pass device 200 mV dropout at 150 mA allows efficient use of aging or low-voltage batteries
Auto-discharge function 20 Ω internal discharge path eliminates hold-up voltage within microseconds after disable
Minimal external components Stable with 0.1 μF ceramic capacitors on VIN and VOUT-no ESR requirements or compensation networks
High output accuracy ±1.0% tolerance over temperature (−40°C to +85°C) ensures reliable logic-level compliance

Applications

Wearable Health Sensors Bluetooth LE Modules

Use Scenario: Continuous ECG/PPG monitoring in wrist-worn devices powered by CR2032 or thin Li-poly cells.

IC Role / Device Role / Timing Role: Primary 3.1 V power rail generator for analog front-end and ultra-low-power MCU.

Use Value: 2 μA quiescent current extends battery runtime beyond 12 months; SDFN4 footprint enables sub-10 mm² PCB area allocation.

Use Scenario: Powering Nordic nRF52/nRF54 or TI CC26xx BLE SoCs in compact beacons and tags.

IC Role / Device Role / Timing Role: Clean, sequenced 3.1 V supply with fast enable/disable for duty-cycled radio operation.

Use Value: Auto-discharge prevents back-powering during deep-sleep mode; 200 mV dropout sustains regulation through battery discharge curve.

Smart Card Readers Industrial Wireless Sensors

Use Scenario: ISO 7816-compliant contactless smart card interface modules operating from USB or energy-harvesting sources.

IC Role / Device Role / Timing Role: Stable 3.1 V supply for secure element and NFC controller ICs requiring tight voltage tolerance.

Use Value: ±1.0% output accuracy meets ISO 7816-3 VCC tolerance; CONTROL pin enables synchronized power gating with host processor.

Use Scenario: Battery-operated LoRaWAN or NB-IoT nodes deployed in remote industrial environments (−40°C to +85°C).

IC Role / Device Role / Timing Role: Main LDO for microcontroller, transceiver, and analog sensor signal chain.

Use Value: Overcurrent protection safeguards against sensor short-circuits; wide input range accommodates supercapacitor or solar-charged storage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
Torex XC6219B312MR-G 3.1 V fixed, 200 mA, 1.5 μA IQ, SOT-25 package (2.9 mm × 2.8 mm) Larger footprint; no auto-discharge; requires 1 μF output capacitor Choose if board space permits larger package and auto-discharge is not required
Rohm BD33IC0WEFJ-M 3.3 V fixed, 200 mA, 35 μA IQ, HTSOP-J8 package (4.0 mm × 4.0 mm) Higher quiescent current; 0.2 V dropout at 150 mA; no auto-discharge Choose only if 3.3 V (not 3.1 V) rail is acceptable and thermal margin is prioritized over size/IQ

Compared with TCR2LN31,LF(SE), the XC6219B312MR-G offers lower IQ but lacks auto-discharge and occupies >14× more board area; the BD33IC0WEFJ-M provides better thermal dissipation but consumes 17× more quiescent current and cannot replace TCR2LN31,LF(SE) without circuit redesign due to voltage and functional mismatch.

Availability

TCR2LN31,LF(SE) is available at Aetrix Electronics and suitable for wearable health monitors, Bluetooth LE modules, smart card readers, and industrial wireless sensors requiring stable component supply, long-term lifecycle support, and ultra-miniature packaging.

Supply support for TCR2LN31,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures high-efficiency, miniaturized semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power management and analog ICs.

The TCR2LN series targets ultra-low-power portable electronics, delivering CMOS LDO regulators optimized for battery longevity, minimal PCB area, and seamless integration with ceramic capacitors - specifically addressing design constraints in smartphones, wearables, and IoT edge nodes.

FAQ

What is the maximum input voltage rating for TCR2LN31,LF(SE)?

The TCR2LN31,LF(SE) has an absolute maximum input voltage (VIN) rating of 6.0 V. However, its recommended operating input voltage range is 1.5 V to 5.5 V under normal conditions. Exceeding 5.5 V may trigger internal protection mechanisms or degrade reliability, especially at elevated temperatures. Always maintain VIN within the specified operating range for TCR2LN31,LF(SE) to ensure long-term stability and compliance with Toshiba's derating guidelines.

Does TCR2LN31,LF(SE) require an external resistor on the CONTROL pin?

No, TCR2LN31,LF(SE) does not require an external resistor on the CONTROL pin. It features an internal pull-down connection between CONTROL and GND, ensuring default-disable behavior when left unconnected. The CONTROL pin accepts direct logic-level signals (0–0.4 V for OFF, 1.0–5.5 V for ON) and draws only 0.1 μA typical control pull-down current - making it compatible with GPIOs of ultra-low-power MCUs without additional biasing components.

Can TCR2LN31,LF(SE) operate with a 0.1 μF output capacitor only?

Yes, TCR2LN31,LF(SE) is fully stable with a 0.1 μF ceramic output capacitor (COUT), provided its ESR is below 10 Ω - a specification met by standard X5R/X7R MLCCs. This eliminates need for larger bulk capacitors or ESR-tuning networks. Stability is verified across full load (0–200 mA) and temperature (−40°C to +85°C) ranges per Toshiba's application note, confirming robust performance in high-density layouts where TCR2LN31,LF(SE) is deployed.

What is the dropout voltage of TCR2LN31,LF(SE) at 200 mA load?

The dropout voltage of TCR2LN31,LF(SE) is not characterized at 200 mA in the official datasheet; specifications are guaranteed up to 150 mA, where VDO = 200 mV (typ.) and 280 mV (max) at Tj = −40°C to +85°C. At 200 mA, VDO increases beyond rated limits - Toshiba recommends limiting continuous output current to 150 mA for guaranteed dropout performance. For 200 mA operation, verify thermal derating and voltage margin in final layout using TCR2LN31,LF(SE)'s thermal resistance and power dissipation data.

Is the thermal pad on the SDFN4 package of TCR2LN31,LF(SE) electrically connected?

Yes, the exposed thermal pad on the SDFN4 package of TCR2LN31,LF(SE) is internally connected to GND. Toshiba explicitly specifies that the center electrode (thermal pad) must be connected to GND or left open - but grounding is strongly recommended to ensure optimal thermal performance (PD = 300 mW rating) and electrical stability. Failure to solder the pad to a sufficient GND copper area reduces power handling capability and may cause thermal shutdown or parameter drift during sustained 150 mA operation.

TCR2LN31,LF(SE Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
TCR2LN
Package/Case:
4-XFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
1
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
3.1V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.28V @ 150mA
Current - Output:
200mA
Current - Quiescent (Iq):
2 µA
Current - Supply (Max):
-
PSRR:
-
Control Features:
Enable
Protection Features:
Over Current
Operating Temperature:
-40°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-SDFN (0.8x0.8)

TCR2LN31,LF(SE FAQ

1.How can I place an order for TCR2LN31,LF(SE through Aetrix?

Please submit a Request for Quotation (RFQ) for TCR2LN31,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCR2LN31,LF(SE reliable?

The price and inventory of TCR2LN31,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2LN31,LF(SE is usually 5 days.

3.What payment methods are accepted for TCR2LN31,LF(SE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2LN31,LF(SE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCR2LN31,LF(SE?

TCR2LN31,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCR2LN31,LF(SE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCR2LN31,LF(SE?

For technical support, including TCR2LN31,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2LN31,LF(SE requirements.

6.How does Aetrix verify that TCR2LN31,LF(SE is sourced from the original manufacturer or authorized distributors?

All TCR2LN31,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2LN31,LF(SE meets industry standards.

7.What is the process for return or replacement of TCR2LN31,LF(SE?

All TCR2LN31,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR2LN31,LF(SE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCR2LN31,LF(SE part is unused and in its original packaging.

Return procedure for TCR2LN31,LF(SE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TCR2LN31,LF(SE Tags

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