Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Toshiba Semiconductor and Storage TCR2LN32,LSF(SE

Part No.:
TCR2LN32,LSF(SE
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
4-XFDFN Exposed Pad
Datasheet:
AetrixTCR2LN32,LSF(SE.pdf
Description:
LDO REG VOUT=3.2V I=200MA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,880

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TCR2LN32,LSF(SE) from Toshiba Electronic Devices & Storage Corporation is a fixed-output 3.2 V, 200 mA CMOS low dropout regulator in ultra-small SDFN4 package, featuring 2 μA max quiescent current, 200 mV typical dropout at 150 mA, ±1.0% output accuracy, overcurrent protection, and auto-discharge functionality-designed for space-constrained portable electronics such as cellular phones and wearables.

For engineers reviewing the TCR2LN32,LSF(SE) datasheet, TCR2LN32,LSF(SE) pinout, TCR2LN32,LSF(SE) application, or TCR2LN32,LSF(SE) equivalent, key selection criteria include ultra-low IQ, ceramic capacitor compatibility (0.1 μF input/output), on/off control interface, thermal performance under 85°C ambient, and SDFN4 footprint constraints for high-density PCB layouts.

Technical Context

The TCR2LN32,LSF(SE) employs a CMOS-based LDO architecture with integrated P-channel pass transistor, enabling low dropout voltage and minimal quiescent current across −40°C to +85°C operating range. Its CONTROL pin supports active-high enable logic (VCT(ON) = 1.0–5.5 V) and includes internal pull-down to GND.

It delivers stable 3.2 V output with ±1.0% accuracy (1.8 V ≤ VOUT), line regulation ≤15 mV, load regulation ≤30 mV, and temperature coefficient of 75 ppm/°C. The device uses no external compensation and supports ceramic capacitors down to 0.1 μF on both input and output.

Key Specifications

ParameterValue and Actual Design Meaning
Output VoltageFixed 3.2 V ±1.0% - ensures precise rail generation for 3.3 V-tolerant logic without external feedback.
Max Output Current200 mA - sufficient for powering microcontrollers, sensors, or RF modules in compact battery-powered systems.
Quiescent Current2.0 μA max at IOUT = 0 mA - enables multi-year battery life in always-on IoT endpoints.
Dropout Voltage200 mV typ. at 150 mA - allows operation from 3.4 V input when regulating 3.2 V, maximizing battery utilization.
Input Voltage Range1.5 V to 5.5 V - compatible with single-cell Li-ion (3.0–4.2 V), LiFePO4, or dual-cell alkaline supplies.
PackageSDFN4 (0.8 mm × 0.8 mm × 0.38 mm) - smallest footprint in its class, enabling placement beneath BGA packages or in <1 mm² board area.
Auto-DischargeIntegrated RSD = 20 Ω - actively discharges output capacitor when disabled, preventing residual voltage hold-up in power sequencing.

Pinout & Package

TCR2LN32,LSF(SE) is housed in the ultra-compact SDFN4 plastic mold package (0.8 mm × 0.8 mm × 0.38 mm, 0.6 mg typical weight), with exposed center pad recommended for GND connection to enhance thermal dissipation and EMI performance.

Pin/TerminalCircuit RoleDesign Meaning
VINInput Power SupplyAccepts 1.5–5.5 V; requires 0.1 μF ceramic decoupling placed adjacent to pin.
CONTROLEnable/Disable Control InputActive-high logic: ≥1.0 V enables regulator; ≤0.4 V disables with auto-discharge activation.
GNDGround ReferenceCommon return path for VIN, VOUT, and CONTROL; center pad must be connected to GND plane for thermal stability.
VOUTRegulated OutputDelivers stable 3.2 V ±1.0%; supports 0.1 μF ceramic output capacitor with ESR < 10 Ω.

Key Features

FeatureDesign Value
Ultra-low quiescent current2.0 μA max at zero load - extends shelf life and runtime in battery-backed real-time clocks and sensor nodes.
Ceramic capacitor support0.1 μF CIN/COUT - eliminates need for larger tantalum or aluminum electrolytics, reducing board area and cost.
On-chip auto-dischargeRSD = 20 Ω - eliminates external discharge FET and resistor, simplifying power-down sequencing in multi-rail systems.
High output accuracy±1.0% over 1.8–3.6 V range - meets tight tolerance requirements for ADC references and precision analog circuitry.
Overcurrent protectionCurrent-limiting foldback - prevents thermal runaway during short-circuit events without latch-up or shutdown.

Applications

Smart WearablesIoT Sensor Nodes

Use Scenario: Powering ultra-compact fitness trackers with optical heart-rate sensors and BLE SoCs.

IC Role / Device Role / Timing Role: Primary 3.2 V supply for MCU, sensor interface, and radio transceiver; provides clean, low-noise voltage with fast load transient response.

Use Value: Enables >2-week battery life using CR2032 via 2 μA quiescent current and efficient 200 mV dropout at partial load.

Use Scenario: Battery-powered environmental monitoring node with temperature/humidity/pressure sensors and LoRaWAN radio.

IC Role / Device Role / Timing Role: Always-on LDO supplying 3.2 V to ultra-low-power microcontroller and analog front-end during sleep and wake cycles.

Use Value: Auto-discharge ensures rapid VOUT collapse during deep-sleep mode, eliminating leakage paths that degrade multi-year battery longevity.

Portable Medical DevicesCompact Consumer Electronics

Use Scenario: Single-use glucose meters or pulse oximeters powered by coin-cell batteries.

IC Role / Device Role / Timing Role: Regulates 3.2 V for precision analog signal chain (op-amps, ADCs) and display driver ICs.

Use Value: ±1.0% output accuracy and 75 ppm/°C TCVO maintain measurement integrity across clinical temperature ranges (0–40°C).

Use Scenario: Wireless earbud charging case with embedded battery fuel gauge and LED status indicators.

IC Role / Device Role / Timing Role: Secondary LDO generating 3.2 V for fuel gauge IC and status LEDs from shared 3.7 V Li-ion cell.

Use Value: SDFN4 footprint (0.8 mm × 0.8 mm) fits within tight mechanical constraints between battery and PCB edge, enabling slimmer industrial design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Torex XC6219B322MR-GSame 3.2 V output, 200 mA rating, but 1.0 μA typ. IQ; SOT-25 package (2.9 mm × 2.8 mm) - 9× larger footprint.Lacks auto-discharge; requires external discharge circuit for controlled power-down.Choose if lowest possible IQ is critical and board space permits larger package.
Rohm BD3985FVM-323.2 V, 200 mA, 2.5 μA max IQ; same SDFN4 package; includes thermal shutdown but no auto-discharge.Higher dropout (250 mV @ 150 mA); no integrated discharge path.Prefer when thermal robustness is prioritized over fast VOUT discharge in safety-critical shutdown sequences.

Compared with XC6219B322MR-G and BD3985FVM-32, the TCR2LN32,LSF(SE) uniquely combines SDFN4 size, 2 μA max IQ, and on-chip 20 Ω auto-discharge - making it optimal for space- and energy-constrained portable designs requiring clean, sequenced power-down.

Availability

TCR2LN32,LSF(SE) is available at Aetrix Electronics and suitable for portable medical devices, smart wearables, IoT sensor nodes, and compact consumer electronics requiring stable component supply with guaranteed long-term availability.

Supply support for TCR2LN32,LSF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and analog ICs for industrial, automotive, and consumer applications.

The TCR2LN series targets ultra-low-power portable electronics, delivering high-efficiency, miniature LDO regulators optimized for battery longevity and PCB area reduction in space-constrained designs.

FAQ

What is the maximum input voltage rating for TCR2LN32,LSF(SE)?

The TCR2LN32,LSF(SE) has an absolute maximum input voltage (VIN) rating of 6.0 V. However, its recommended operating input voltage range is 1.5 V to 5.5 V. Exceeding 5.5 V may trigger overvoltage stress even if within absolute maximum limits, and sustained operation above this range risks reliability degradation per Toshiba's derating guidelines.

Does TCR2LN32,LSF(SE) require external components for stability?

No, the TCR2LN32,LSF(SE) is internally compensated and stable with only 0.1 μF ceramic capacitors on VIN and VOUT. Toshiba specifies CIN = 0.1 μF and COUT = 0.1 μF as minimum values, with ESR < 10 Ω recommended for optimal transient response and phase margin - no additional resistors, capacitors, or feedback networks are needed.

How does the auto-discharge function operate in TCR2LN32,LSF(SE)?

When the CONTROL pin is pulled low (≤0.4 V), the TCR2LN32,LSF(SE) disables regulation and activates an internal 20 Ω discharge path between VOUT and GND. This rapidly collapses the output voltage, eliminating residual charge on the output capacitor - critical for safe power sequencing and preventing back-powering of upstream circuitry during system shutdown.

What is the thermal performance of TCR2LN32,LSF(SE) on a standard PCB?

On a 40 mm × 40 mm FR4 board (1.6 mm thick, 50% copper coverage per side), the TCR2LN32,LSF(SE) has a maximum power dissipation rating of 300 mW. At 150 mA output and 200 mV dropout, power loss is 30 mW - well within thermal limits. Junction temperature remains below 150°C up to 85°C ambient, assuming proper GND pad soldering per SDFN4 layout guidelines.

Is TCR2LN32,LSF(SE) RoHS compliant and lead-free?

Yes, TCR2LN32,LSF(SE) complies with EU RoHS Directive 2011/65/EU and is lead-free. Toshiba confirms halogen-free and green material compliance per their environmental policy. Full substance declarations and test reports are available through authorized Toshiba distributors upon request.

TCR2LN32,LSF(SE Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
TCR2LN
Package/Case:
4-XFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
1
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
3.2V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.28V @ 150mA
Current - Output:
200mA
Current - Quiescent (Iq):
2 µA
Current - Supply (Max):
-
PSRR:
-
Control Features:
Enable
Protection Features:
Over Current
Operating Temperature:
-40°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-SDFN (0.8x0.8)

TCR2LN32,LSF(SE FAQ

1.How can I place an order for TCR2LN32,LSF(SE through Aetrix?

Please submit a Request for Quotation (RFQ) for TCR2LN32,LSF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCR2LN32,LSF(SE reliable?

The price and inventory of TCR2LN32,LSF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR2LN32,LSF(SE is usually 5 days.

3.What payment methods are accepted for TCR2LN32,LSF(SE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR2LN32,LSF(SE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCR2LN32,LSF(SE?

TCR2LN32,LSF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCR2LN32,LSF(SE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCR2LN32,LSF(SE?

For technical support, including TCR2LN32,LSF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR2LN32,LSF(SE requirements.

6.How does Aetrix verify that TCR2LN32,LSF(SE is sourced from the original manufacturer or authorized distributors?

All TCR2LN32,LSF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR2LN32,LSF(SE meets industry standards.

7.What is the process for return or replacement of TCR2LN32,LSF(SE?

All TCR2LN32,LSF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR2LN32,LSF(SE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCR2LN32,LSF(SE part is unused and in its original packaging.

Return procedure for TCR2LN32,LSF(SE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TCR2LN32,LSF(SE Tags

  • TCR2LN32,LSF(SE
  • TCR2LN32,LSF(SE PDF
  • TCR2LN32,LSF(SE Datasheet
  • TCR2LN32,LSF(SE Specifications
  • TCR2LN32,LSF(SE Images
  • Toshiba Semiconductor and Storage
  • Toshiba Semiconductor and Storage TCR2LN32,LSF(SE
  • Buy TCR2LN32,LSF(SE
  • TCR2LN32,LSF(SE Price
  • TCR2LN32,LSF(SE Distributor
  • TCR2LN32,LSF(SE Supplier
  • TCR2LN32,LSF(SE Wholesale
Related Products
MIC5504-1.8YM5-TR
MIC5504-1.8YM5-TR

Microchip Technology

MIC5504-3.3YM5-TR
MIC5504-3.3YM5-TR

Microchip Technology

MIC5365-3.0YC5-TR
MIC5365-3.0YC5-TR

Microchip Technology

MIC5365-1.8YC5-TR
MIC5365-1.8YC5-TR

Microchip Technology

MIC5365-2.5YC5-TR
MIC5365-2.5YC5-TR

Microchip Technology

MIC5365-3.3YC5-TR
MIC5365-3.3YC5-TR

Microchip Technology

MIC5365-3.3YD5-TR
MIC5365-3.3YD5-TR

Microchip Technology

MIC5317-3.3YM5-TR
MIC5317-3.3YM5-TR

Microchip Technology

TLV1117LV33DCYR
TLV1117LV33DCYR

Texas Instruments

MIC5317-3.3YMT-TZ
MIC5317-3.3YMT-TZ

Microchip Technology

MIC5528-3.3YMT-TR
MIC5528-3.3YMT-TR

Microchip Technology

TLV75801PDRVR
TLV75801PDRVR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER