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Toshiba Semiconductor and Storage TCR3DM28,LF(SE

Part No.:
TCR3DM28,LF(SE
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
4-UDFN Exposed Pad
Datasheet:
AetrixTCR3DM28,LF(SE.pdf
Description:
LDO REG IOUT: 300MA VIN: 6V VOUT
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:22,290

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Product details

Overview

TCR3DM28,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a 2.8 V fixed-output, 300 mA CMOS low-dropout regulator with inrush current protection, auto-discharge, and on/off control input. It delivers 210 mV typical dropout at full load, 38 μVrms output noise, and ±80 mV load transient response with 1.0 μF ceramic capacitors-designed for power management in space-constrained portable electronics.

For engineers reviewing the TCR3DM28,LF(SE) datasheet, TCR3DM28,LF(SE) pinout, TCR3DM28,LF(SE) application, or TCR3DM28,LF(SE) equivalent, key selection criteria include dropout voltage at 300 mA, inrush current suppression behavior, thermal shutdown threshold, control logic compatibility (1.0–5.5 V ON range), and DFN4E package layout constraints for high-density PCBs.

Technical Context

The TCR3DM28,LF(SE) employs a CMOS pass transistor architecture enabling ultra-low quiescent current (68 μA typ. at 2.8 V output) and stable regulation under fast load transients. Its integrated inrush current protection circuit limits input surge during power-up without external components, while the auto-discharge function actively discharges the output capacitor when disabled via the CONTROL pin.

It operates across –40°C to +85°C with over-current and over-temperature protection, and achieves 70 dB ripple rejection at 1 kHz. The device requires only 1.0 μF ceramic input and output capacitors, leveraging internal compensation optimized for low-ESR ceramics (recommended ESR < 10 Ω).

Key Specifications

ParameterValue and Actual Design Meaning
Output voltageFixed 2.8 V ±1.0% accuracy ensures stable core/bias rail for 2.8 V logic or analog subsystems
Max output current300 mA continuous supports moderate-power RF modules, sensors, or MCU peripherals
Dropout voltage210 mV typ. at 300 mA enables operation down to VIN = 3.01 V, critical for single-cell Li-ion or Li-poly systems
Output noise38 μVrms typ. (10 Hz–100 kHz) minimizes interference in noise-sensitive analog signal chains
Load transient response±80 mV peak deviation (1 mA ↔ 300 mA step, 1.0 μF COUT) maintains system stability during burst-mode operation
Ripple rejection70 dB typ. at 1 kHz suppresses switching noise from upstream DC/DC converters
Quiescent current68 μA typ. at 2.8 V output extends battery life in always-on sensor nodes or standby circuits
Control logicCONTROL pin accepts 0–0.4 V (OFF) or 1.0–5.5 V (ON); internal pull-down eliminates need for external resistor

Pinout & Package

TCR3DM28,LF(SE) is housed in an ultra-small DFN4E package (1.0 mm × 1.0 mm × 0.58 mm, 1.3 mg), with exposed thermal pad (center electrode) recommended to be connected to GND for optimal thermal performance.

Pin/TerminalCircuit RoleDesign Meaning
VINInput power supplyAccepts 1.75–5.5 V; requires 1.0 μF ceramic decoupling close to pin
VOUTRegulated outputDelivers stable 2.8 V; connects to 1.0 μF ceramic capacitor and load
GNDGround referenceCommon return for input/output/control; ties to PCB ground plane and center thermal pad
CONTROLEnable/disable inputActive-high logic: ≥1.0 V enables regulator; ≤0.4 V disables with auto-discharge active

Key Features

FeatureDesign Value
Inrush current protectionPrevents input voltage sag and system brown-out during cold start without external circuitry
Auto-discharge functionActively pulls VOUT to GND within milliseconds of CONTROL deactivation, eliminating residual voltage hold-up
Ultra-low noise regulation38 μVrms output noise enables direct powering of ADC references, RF synthesizers, or precision op-amps
Thermal and over-current protectionShuts down safely under overload or ambient >85°C; recovers automatically after fault clearance
DFN4E footprint compatibility1.0 mm × 1.0 mm outline with 0.5 mm pitch allows placement in <1.5 mm² board area-ideal for wearables and compact IoT modules

Applications

Smartphone Baseband PowerWearable Sensor Hub

Use Scenario: Supplying 2.8 V bias to cellular modem baseband ICs during burst data transmission.

IC Role / Device Role / Timing Role: Primary LDO delivering clean, low-noise 2.8 V rail with fast transient response to handle 1 mA ↔ 300 mA load steps.

Use Value: ±80 mV load transient deviation prevents digital corruption and maintains RF transmit integrity without requiring oversized output capacitance.

Use Scenario: Powering MEMS accelerometers and Bluetooth LE SoCs in fitness trackers with aggressive duty-cycling.

IC Role / Device Role / Timing Role: Enable-controlled power source that auto-discharges VOUT during sleep mode to eliminate leakage paths.

Use Value: 0.1 μA standby current and auto-discharge reduce quiescent power loss, extending battery life beyond 7 days per charge.

Medical Patch MonitorIndustrial Wireless Node

Use Scenario: Regulating 2.8 V for ultra-low-noise analog front-end (AFE) in disposable ECG patches.

IC Role / Device Role / Timing Role: Low-noise, low-drift voltage source for precision instrumentation amplifiers and 16-bit ADCs.

Use Value: 38 μVrms output noise and 75 ppm/°C temperature coefficient ensure sub-LSB measurement stability across body-temperature range.

Use Scenario: Providing regulated 2.8 V to LoRaWAN transceivers in battery-powered environmental sensors deployed outdoors.

IC Role / Device Role / Timing Role: Robust power manager operating from wide-input primary cells (-40°C to +85°C) with inrush limiting during cold-start.

Use Value: Inrush current protection prevents voltage collapse on aging alkaline cells, ensuring reliable boot-up even at end-of-life battery voltage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Torex XC6219B282MR-G2.8 V fixed, 300 mA, 250 mV dropout (typ.), no inrush protection, no auto-dischargeLacks inrush suppression and active discharge-requires external circuitry for cold-start reliability and fast shutdownSelect when board space permits discrete inrush control and discharge FET, or when cost sensitivity outweighs feature integration
Rohm BD3572EFJ-ME22.8 V fixed, 300 mA, 220 mV dropout (typ.), includes thermal shutdown but no inrush or auto-dischargeHigher quiescent current (120 μA) and no auto-discharge limit suitability for ultra-low-power wake-on-event designsPrefer where thermal robustness is prioritized over startup/shutdown sequencing, and output hold-up is acceptable

Compared with TCR3DM28,LF(SE), the XC6219B282MR-G offers identical output and current rating but lacks integrated inrush and discharge functions-increasing BOM count and layout complexity. The BD3572EFJ-ME2 provides similar thermal protection but higher quiescent draw and no discharge capability, making TCR3DM28,LF(SE) superior for battery-constrained, fast-cycle applications requiring clean power sequencing.

Availability

TCR3DM28,LF(SE) is available at Aetrix Electronics and suitable for smartphone baseband power, wearable sensor hubs, medical patch monitors, industrial wireless nodes, and portable instrumentation requiring stable component supply with tight parametric consistency and long-term lifecycle support.

Supply support for TCR3DM28,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power efficiency and miniaturization.

The TCR3DM series targets portable and space-constrained applications needing ultra-small-footprint, low-noise, feature-integrated LDOs-specifically addressing challenges in battery-powered devices requiring inrush control, fast shutdown, and minimal external components.

FAQ

What is the maximum input voltage rating for TCR3DM28,LF(SE)?

The absolute maximum input voltage for TCR3DM28,LF(SE) is 6.0 V. However, the recommended operating input voltage range is 1.75 V to 5.5 V under normal conditions. Exceeding 5.5 V may trigger overvoltage stress not covered by standard reliability testing, and operation above 6.0 V risks permanent damage. Always maintain VIN within specification to ensure TCR3DM28,LF(SE) meets its rated dropout, noise, and thermal performance.

Does TCR3DM28,LF(SE) require external components for stability?

No, TCR3DM28,LF(SE) is internally compensated and stable with only 1.0 μF ceramic capacitors on both VIN and VOUT pins. Toshiba specifies ESR < 10 Ω for optimal phase margin and transient response. No external resistors, capacitors, or feedback networks are needed-making TCR3DM28,LF(SE) a true plug-and-play solution for compact layouts where board area is constrained.

How does the inrush current protection circuit operate in TCR3DM28,LF(SE)?

The inrush current protection circuit in TCR3DM28,LF(SE) limits peak input current during initial power-up by controlling the gate drive slew rate of the internal CMOS pass transistor. This prevents large input voltage droop and avoids triggering upstream supply undervoltage lockout-critical when powered from weak sources like coin cells or aging batteries. The function is fully integrated and requires no external configuration or enable timing.

What is the thermal shutdown threshold for TCR3DM28,LF(SE)?

TCR3DM28,LF(SE) activates thermal shutdown at a junction temperature of approximately 150°C, as defined in its Absolute Maximum Ratings. Once triggered, the device halts regulation and enters safe-off state until junction temperature falls below the hysteresis threshold (~20°C below trip point). This protection is internal and automatic-no external monitoring or intervention is required to safeguard TCR3DM28,LF(SE) under sustained overload or poor heatsinking conditions.

Can TCR3DM28,LF(SE) be used with ceramic capacitors having ESR below 1 Ω?

Yes, TCR3DM28,LF(SE) is specifically designed for low-ESR ceramic capacitors, including those with ESR well below 1 Ω. Toshiba recommends ESR < 10 Ω, and typical X5R/X7R 1.0 μF ceramics (ESR ≈ 0.03–0.1 Ω) are fully compatible. Using ultra-low-ESR types does not compromise stability-TCR3DM28,LF(SE)'s internal compensation accounts for this range, ensuring robust phase margin and maintaining its specified ±80 mV load transient response.

TCR3DM28,LF(SE Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
4-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
1
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
2.8V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.25V @ 300mA
Current - Output:
300mA
Current - Quiescent (Iq):
-
Current - Supply (Max):
-
PSRR:
-
Control Features:
Enable
Protection Features:
Over Current, Over Temperature
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-DFN (1x1)

TCR3DM28,LF(SE FAQ

1.How can I place an order for TCR3DM28,LF(SE through Aetrix?

Please submit a Request for Quotation (RFQ) for TCR3DM28,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCR3DM28,LF(SE reliable?

The price and inventory of TCR3DM28,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR3DM28,LF(SE is usually 5 days.

3.What payment methods are accepted for TCR3DM28,LF(SE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR3DM28,LF(SE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCR3DM28,LF(SE?

TCR3DM28,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCR3DM28,LF(SE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCR3DM28,LF(SE?

For technical support, including TCR3DM28,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR3DM28,LF(SE requirements.

6.How does Aetrix verify that TCR3DM28,LF(SE is sourced from the original manufacturer or authorized distributors?

All TCR3DM28,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR3DM28,LF(SE meets industry standards.

7.What is the process for return or replacement of TCR3DM28,LF(SE?

All TCR3DM28,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR3DM28,LF(SE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCR3DM28,LF(SE part is unused and in its original packaging.

Return procedure for TCR3DM28,LF(SE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TCR3DM28,LF(SE Tags

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