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Toshiba Semiconductor and Storage TCR3DM32,LF(SE

Part No.:
TCR3DM32,LF(SE
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
4-UDFN Exposed Pad
Datasheet:
AetrixTCR3DM32,LF(SE.pdf
Description:
LDO REG IOUT: 300MA VIN: 6V VOUT
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,560

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Product details

Overview

TCR3DM32,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a 3.2 V fixed-output CMOS low-dropout regulator delivering up to 300 mA with 180–230 mV typical dropout (3.2 V output), 38 μVrms output noise, and inrush current protection - used for powering RF transceivers and baseband ICs in compact mobile devices.

For engineers reviewing the TCR3DM32,LF(SE) datasheet, TCR3DM32,LF(SE) pinout, TCR3DM32,LF(SE) application, or TCR3DM32,LF(SE) equivalent, key selection criteria include ultra-small DFN4E package compatibility, auto-discharge functionality during shutdown, ±80 mV load transient response with 1.0 μF ceramic output capacitor, and guaranteed 1.0% output voltage accuracy at 3.2 V.

Technical Context

The TCR3DM32,LF(SE) integrates a CMOS pass transistor with internal inrush current limiting and an active auto-discharge circuit tied to the CONTROL pin. Its control logic accepts 0–0.4 V for OFF and 1.0–5.5 V for ON states, enabling precise power sequencing in multi-rail systems.

Designed for high-density portable applications, it operates across –40°C to +85°C with thermal shutdown and overcurrent protection, and achieves 70 dB ripple rejection at 1 kHz while supporting ceramic input/output capacitors as small as 1.0 μF each.

Key Specifications

ParameterValue and Actual Design Meaning
Output voltageFixed 3.2 V ±1.0% - ensures stable supply for 3.3 V-tolerant I/O domains without external feedback.
Dropout voltage180–230 mV (typ.) at 300 mA - enables regulation from 3.38 V input, critical for Li-ion battery discharge tail-end operation.
Output noise38 μVrms (10 Hz–100 kHz) - minimizes phase noise in RF front-end biasing and ADC reference paths.
Load transient response±80 mV (IOUT = 1 mA ⇔ 300 mA, COUT = 1.0 μF) - maintains signal integrity during burst-mode processor wake-up events.
Ripple rejection70 dB (1 kHz) - suppresses switching noise from upstream DC/DC converters feeding the LDO input.
Quiescent current68 μA (typ., VOUT = 2.5 V) - extends battery life in always-on sensor subsystems.
Standby current0.1–1.0 μA (VCT = 0 V) - supports ultra-low-power deep-sleep modes in wearable SoCs.

Pinout & Package

TCR3DM32,LF(SE) uses the ultra-compact DFN4E package (1.0 mm × 1.0 mm × 0.58 mm, 1.3 mg), with exposed center thermal pad that must be connected to GND for optimal thermal performance and EMI suppression.

Pin/TerminalCircuit RoleDesign Meaning
VINInput power supplyAccepts 1.75–5.5 V; requires 1.0 μF ceramic decoupling close to pin to stabilize input impedance.
VOUTRegulated outputDelivers 3.2 V ±1.0%; connects directly to load with 1.0 μF ceramic capacitor to ground for transient stability.
GNDGround referenceCommon return path for VIN, VOUT, and CONTROL; center thermal pad must be soldered to GND plane.
CONTROLEnable/disable inputActive-high logic: 0–0.4 V = OFF (auto-discharge enabled), 1.0–5.5 V = ON; internal pull-down ensures default OFF state.

Key Features

FeatureDesign Value
Inrush current protectionPrevents input voltage sag and system reset during cold-start power-up of downstream capacitance.
Auto-discharge functionActively discharges VOUT to GND within milliseconds after CONTROL goes low, eliminating residual voltage hold-up.
Ultra-small DFN4E footprint1.0 mm × 1.0 mm area saves >60% board space vs. SOT-23 packages - essential for sub-10 mm² camera modules.
Ceramic capacitor supportEnables use of 1.0 μF X5R/X7R MLCCs on both input and output - eliminates bulkier tantalum or aluminum electrolytics.
Pull-down on CONTROL pinGuarantees safe power-down state during MCU boot or reset, preventing unintended regulator activation.

Applications

Smartphone Baseband PowerWearable Sensor Hub

Use Scenario: Supplying 3.2 V to LTE/5G baseband processors during rapid duty-cycled transmission bursts.

IC Role / Device Role / Timing Role: Primary low-noise post-regulator for RFIC analog supply rails, synchronized to modem sleep/wake signals via CONTROL pin.

Use Value: ±80 mV transient response and 38 μVrms noise ensure EVM compliance under 100 mA step-load changes without external LC filtering.

Use Scenario: Powering ultra-low-power environmental sensors (accelerometer, gyroscope, barometer) in hearables with intermittent BLE advertising.

IC Role / Device Role / Timing Role: Always-on LDO with auto-discharge, enabling <1 μA system standby current when host MCU is asleep.

Use Value: 0.1 μA standby current and 1.0% output accuracy maintain sensor calibration integrity across temperature and battery aging.

IoT Edge Node PMIC CoreCompact Camera Module Bias

Use Scenario: Providing clean 3.2 V bias to microcontroller cores and secure elements in battery-powered industrial gateways.

IC Role / Device Role / Timing Role: Secondary regulated rail derived from buck converter output, controlled by system PMIC sequencer via CONTROL pin.

Use Value: 70 dB ripple rejection isolates MCU clock domains from switch-mode noise, reducing jitter-induced timing errors.

Use Scenario: Delivering stable 3.2 V to CMOS image sensor analog front-end and ISP core in smartphone front cameras.

IC Role / Device Role / Timing Role: Dedicated low-noise LDO placed adjacent to sensor die, with CONTROL pin tied to camera driver enable signal.

Use Value: 180–230 mV dropout allows direct regulation from shared 3.8 V battery rail, eliminating need for intermediate 3.6 V stage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise, ultra-small LDO applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Torex XC6210B322MR-GSame 3.2 V output, 300 mA rating, but uses SOT-25 package (2.9 mm × 2.8 mm) and lacks inrush current protection.Less suitable for space-constrained designs requiring <1 mm² footprint; no auto-discharge function limits fast power cycling.Choose if board layout allows larger package and inrush control is handled externally.
Rohm BD3572EFJ-ME23.2 V output, 300 mA, DFN1006 package (1.0 mm × 0.6 mm), but only 200 mV dropout at 100 mA - degrades to 320 mV at 300 mA.Better size fit than XC6210, but higher dropout reduces usable input voltage range in battery-powered systems.Prefer when minimal height (<0.4 mm) is critical and full 300 mA load is infrequent.

Compared with XC6210B322MR-G and BD3572EFJ-ME2, TCR3DM32,LF(SE) uniquely combines DFN4E's 1.0 mm² footprint, guaranteed 180–230 mV dropout at full 300 mA, and integrated inrush/auto-discharge - making it optimal for high-transient, space-limited mobile power rails where reliability and sequencing control are mandatory.

Availability

TCR3DM32,LF(SE) is available at Aetrix Electronics and suitable for smartphone baseband power, wearable sensor hubs, IoT edge node PMIC cores, and compact camera module bias requiring stable component supply across high-volume production cycles.

Supply support for TCR3DM32,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on miniaturization, efficiency, and integration.

The TCR3DM series targets portable electronics power management, specifically engineered to replace legacy SOT-23 LDOs with ultra-compact DFN4E packaging, inrush control, and auto-discharge for modern battery-powered SoC subsystems.

FAQ

What is the maximum input voltage rating for TCR3DM32,LF(SE)?

The absolute maximum input voltage for TCR3DM32,LF(SE) is 6.0 V. Operation above this level risks permanent damage. The recommended operating input range is 1.75 V to 5.5 V, ensuring proper regulation across the full 300 mA load and temperature range. For battery-powered designs, this allows direct connection to single-cell Li-ion (4.2 V max) or dual-cell alkaline (3.0 V nominal) sources without pre-regulation.

Does TCR3DM32,LF(SE) require an external resistor on the CONTROL pin?

No, TCR3DM32,LF(SE) includes an internal pull-down resistor between CONTROL and GND, ensuring a defined OFF state during power-up or MCU reset. An external resistor is unnecessary unless specific logic-level translation or noise immunity is required - for example, driving CONTROL from a 1.8 V GPIO with long traces may benefit from a 10 kΩ series resistor to limit ESD current.

Can TCR3DM32,LF(SE) be used with 0402-size ceramic capacitors?

Yes, TCR3DM32,LF(SE) is fully compatible with 0402 (1005 metric) 1.0 μF X5R/X7R MLCCs on both input and output. The device's internal compensation and low ESR tolerance eliminate the need for larger case sizes. However, ensure the capacitor's DC bias derating maintains ≥0.8 μF effective capacitance at rated voltage to preserve ±80 mV transient response.

What thermal performance can be expected from TCR3DM32,LF(SE) on a standard FR4 PCB?

When mounted on a 40 mm × 40 mm FR4 board with 50% copper coverage on both sides, TCR3DM32,LF(SE) delivers 420 mW power dissipation capability. At 300 mA load and 3.2 V output with 4.0 V input (0.8 V drop), power dissipation is 240 mW - resulting in ~35°C junction-to-ambient rise, well within the –40°C to +85°C operating range without forced airflow.

How does the auto-discharge function behave during CONTROL pin deactivation?

When the CONTROL pin transitions from HIGH to LOW, TCR3DM32,LF(SE) immediately disables the pass transistor and activates an internal discharge FET between VOUT and GND. This discharges a 1.0 μF output capacitor from 3.2 V to <0.1 V in under 10 ms, preventing back-powering of upstream circuits and ensuring deterministic power-down sequencing in multi-rail systems.

TCR3DM32,LF(SE Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
4-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
1
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
3.2V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.23V @ 300mA
Current - Output:
300mA
Current - Quiescent (Iq):
-
Current - Supply (Max):
-
PSRR:
-
Control Features:
Enable
Protection Features:
Over Current, Over Temperature
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-DFN (1x1)

TCR3DM32,LF(SE FAQ

1.How can I place an order for TCR3DM32,LF(SE through Aetrix?

Please submit a Request for Quotation (RFQ) for TCR3DM32,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCR3DM32,LF(SE reliable?

The price and inventory of TCR3DM32,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR3DM32,LF(SE is usually 5 days.

3.What payment methods are accepted for TCR3DM32,LF(SE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR3DM32,LF(SE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCR3DM32,LF(SE?

TCR3DM32,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCR3DM32,LF(SE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCR3DM32,LF(SE?

For technical support, including TCR3DM32,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR3DM32,LF(SE requirements.

6.How does Aetrix verify that TCR3DM32,LF(SE is sourced from the original manufacturer or authorized distributors?

All TCR3DM32,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR3DM32,LF(SE meets industry standards.

7.What is the process for return or replacement of TCR3DM32,LF(SE?

All TCR3DM32,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR3DM32,LF(SE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCR3DM32,LF(SE part is unused and in its original packaging.

Return procedure for TCR3DM32,LF(SE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TCR3DM32,LF(SE Tags

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