Toshiba Semiconductor and Storage TCR3DM32,LF(SE
- Part No.:
- TCR3DM32,LF(SE
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-UDFN Exposed Pad
- Datasheet:
-
TCR3DM32,LF(SE.pdf
- Description:
- LDO REG IOUT: 300MA VIN: 6V VOUT
- Quantity:
- Payment:

- Shipping:

Inventory:9,560
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TCR3DM32,LF(SE) from Toshiba Electronic Devices & Storage Corporation is a 3.2 V fixed-output CMOS low-dropout regulator delivering up to 300 mA with 180–230 mV typical dropout (3.2 V output), 38 μVrms output noise, and inrush current protection - used for powering RF transceivers and baseband ICs in compact mobile devices.
For engineers reviewing the TCR3DM32,LF(SE) datasheet, TCR3DM32,LF(SE) pinout, TCR3DM32,LF(SE) application, or TCR3DM32,LF(SE) equivalent, key selection criteria include ultra-small DFN4E package compatibility, auto-discharge functionality during shutdown, ±80 mV load transient response with 1.0 μF ceramic output capacitor, and guaranteed 1.0% output voltage accuracy at 3.2 V.
Technical Context
The TCR3DM32,LF(SE) integrates a CMOS pass transistor with internal inrush current limiting and an active auto-discharge circuit tied to the CONTROL pin. Its control logic accepts 0–0.4 V for OFF and 1.0–5.5 V for ON states, enabling precise power sequencing in multi-rail systems.
Designed for high-density portable applications, it operates across –40°C to +85°C with thermal shutdown and overcurrent protection, and achieves 70 dB ripple rejection at 1 kHz while supporting ceramic input/output capacitors as small as 1.0 μF each.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output voltage | Fixed 3.2 V ±1.0% - ensures stable supply for 3.3 V-tolerant I/O domains without external feedback. |
| Dropout voltage | 180–230 mV (typ.) at 300 mA - enables regulation from 3.38 V input, critical for Li-ion battery discharge tail-end operation. |
| Output noise | 38 μVrms (10 Hz–100 kHz) - minimizes phase noise in RF front-end biasing and ADC reference paths. |
| Load transient response | ±80 mV (IOUT = 1 mA ⇔ 300 mA, COUT = 1.0 μF) - maintains signal integrity during burst-mode processor wake-up events. |
| Ripple rejection | 70 dB (1 kHz) - suppresses switching noise from upstream DC/DC converters feeding the LDO input. |
| Quiescent current | 68 μA (typ., VOUT = 2.5 V) - extends battery life in always-on sensor subsystems. |
| Standby current | 0.1–1.0 μA (VCT = 0 V) - supports ultra-low-power deep-sleep modes in wearable SoCs. |
Pinout & Package
TCR3DM32,LF(SE) uses the ultra-compact DFN4E package (1.0 mm × 1.0 mm × 0.58 mm, 1.3 mg), with exposed center thermal pad that must be connected to GND for optimal thermal performance and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input power supply | Accepts 1.75–5.5 V; requires 1.0 μF ceramic decoupling close to pin to stabilize input impedance. |
| VOUT | Regulated output | Delivers 3.2 V ±1.0%; connects directly to load with 1.0 μF ceramic capacitor to ground for transient stability. |
| GND | Ground reference | Common return path for VIN, VOUT, and CONTROL; center thermal pad must be soldered to GND plane. |
| CONTROL | Enable/disable input | Active-high logic: 0–0.4 V = OFF (auto-discharge enabled), 1.0–5.5 V = ON; internal pull-down ensures default OFF state. |
Key Features
| Feature | Design Value |
|---|---|
| Inrush current protection | Prevents input voltage sag and system reset during cold-start power-up of downstream capacitance. |
| Auto-discharge function | Actively discharges VOUT to GND within milliseconds after CONTROL goes low, eliminating residual voltage hold-up. |
| Ultra-small DFN4E footprint | 1.0 mm × 1.0 mm area saves >60% board space vs. SOT-23 packages - essential for sub-10 mm² camera modules. |
| Ceramic capacitor support | Enables use of 1.0 μF X5R/X7R MLCCs on both input and output - eliminates bulkier tantalum or aluminum electrolytics. |
| Pull-down on CONTROL pin | Guarantees safe power-down state during MCU boot or reset, preventing unintended regulator activation. |
Applications
| Smartphone Baseband Power | Wearable Sensor Hub |
|---|---|
Use Scenario: Supplying 3.2 V to LTE/5G baseband processors during rapid duty-cycled transmission bursts. IC Role / Device Role / Timing Role: Primary low-noise post-regulator for RFIC analog supply rails, synchronized to modem sleep/wake signals via CONTROL pin. Use Value: ±80 mV transient response and 38 μVrms noise ensure EVM compliance under 100 mA step-load changes without external LC filtering. | Use Scenario: Powering ultra-low-power environmental sensors (accelerometer, gyroscope, barometer) in hearables with intermittent BLE advertising. IC Role / Device Role / Timing Role: Always-on LDO with auto-discharge, enabling <1 μA system standby current when host MCU is asleep. Use Value: 0.1 μA standby current and 1.0% output accuracy maintain sensor calibration integrity across temperature and battery aging. |
| IoT Edge Node PMIC Core | Compact Camera Module Bias |
Use Scenario: Providing clean 3.2 V bias to microcontroller cores and secure elements in battery-powered industrial gateways. IC Role / Device Role / Timing Role: Secondary regulated rail derived from buck converter output, controlled by system PMIC sequencer via CONTROL pin. Use Value: 70 dB ripple rejection isolates MCU clock domains from switch-mode noise, reducing jitter-induced timing errors. | Use Scenario: Delivering stable 3.2 V to CMOS image sensor analog front-end and ISP core in smartphone front cameras. IC Role / Device Role / Timing Role: Dedicated low-noise LDO placed adjacent to sensor die, with CONTROL pin tied to camera driver enable signal. Use Value: 180–230 mV dropout allows direct regulation from shared 3.8 V battery rail, eliminating need for intermediate 3.6 V stage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-noise, ultra-small LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6210B322MR-G | Same 3.2 V output, 300 mA rating, but uses SOT-25 package (2.9 mm × 2.8 mm) and lacks inrush current protection. | Less suitable for space-constrained designs requiring <1 mm² footprint; no auto-discharge function limits fast power cycling. | Choose if board layout allows larger package and inrush control is handled externally. |
| Rohm BD3572EFJ-ME2 | 3.2 V output, 300 mA, DFN1006 package (1.0 mm × 0.6 mm), but only 200 mV dropout at 100 mA - degrades to 320 mV at 300 mA. | Better size fit than XC6210, but higher dropout reduces usable input voltage range in battery-powered systems. | Prefer when minimal height (<0.4 mm) is critical and full 300 mA load is infrequent. |
Compared with XC6210B322MR-G and BD3572EFJ-ME2, TCR3DM32,LF(SE) uniquely combines DFN4E's 1.0 mm² footprint, guaranteed 180–230 mV dropout at full 300 mA, and integrated inrush/auto-discharge - making it optimal for high-transient, space-limited mobile power rails where reliability and sequencing control are mandatory.
Availability
TCR3DM32,LF(SE) is available at Aetrix Electronics and suitable for smartphone baseband power, wearable sensor hubs, IoT edge node PMIC cores, and compact camera module bias requiring stable component supply across high-volume production cycles.
Supply support for TCR3DM32,LF(SE) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on miniaturization, efficiency, and integration.
The TCR3DM series targets portable electronics power management, specifically engineered to replace legacy SOT-23 LDOs with ultra-compact DFN4E packaging, inrush control, and auto-discharge for modern battery-powered SoC subsystems.
FAQ
What is the maximum input voltage rating for TCR3DM32,LF(SE)?
The absolute maximum input voltage for TCR3DM32,LF(SE) is 6.0 V. Operation above this level risks permanent damage. The recommended operating input range is 1.75 V to 5.5 V, ensuring proper regulation across the full 300 mA load and temperature range. For battery-powered designs, this allows direct connection to single-cell Li-ion (4.2 V max) or dual-cell alkaline (3.0 V nominal) sources without pre-regulation.
Does TCR3DM32,LF(SE) require an external resistor on the CONTROL pin?
No, TCR3DM32,LF(SE) includes an internal pull-down resistor between CONTROL and GND, ensuring a defined OFF state during power-up or MCU reset. An external resistor is unnecessary unless specific logic-level translation or noise immunity is required - for example, driving CONTROL from a 1.8 V GPIO with long traces may benefit from a 10 kΩ series resistor to limit ESD current.
Can TCR3DM32,LF(SE) be used with 0402-size ceramic capacitors?
Yes, TCR3DM32,LF(SE) is fully compatible with 0402 (1005 metric) 1.0 μF X5R/X7R MLCCs on both input and output. The device's internal compensation and low ESR tolerance eliminate the need for larger case sizes. However, ensure the capacitor's DC bias derating maintains ≥0.8 μF effective capacitance at rated voltage to preserve ±80 mV transient response.
What thermal performance can be expected from TCR3DM32,LF(SE) on a standard FR4 PCB?
When mounted on a 40 mm × 40 mm FR4 board with 50% copper coverage on both sides, TCR3DM32,LF(SE) delivers 420 mW power dissipation capability. At 300 mA load and 3.2 V output with 4.0 V input (0.8 V drop), power dissipation is 240 mW - resulting in ~35°C junction-to-ambient rise, well within the –40°C to +85°C operating range without forced airflow.
How does the auto-discharge function behave during CONTROL pin deactivation?
When the CONTROL pin transitions from HIGH to LOW, TCR3DM32,LF(SE) immediately disables the pass transistor and activates an internal discharge FET between VOUT and GND. This discharges a 1.0 μF output capacitor from 3.2 V to <0.1 V in under 10 ms, preventing back-powering of upstream circuits and ensuring deterministic power-down sequencing in multi-rail systems.
TCR3DM32,LF(SE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 4-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.23V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- -
- Current - Supply (Max):
- -
- PSRR:
- -
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-DFN (1x1)
TCR3DM32,LF(SE FAQ
1.How can I place an order for TCR3DM32,LF(SE through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR3DM32,LF(SE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR3DM32,LF(SE reliable?
The price and inventory of TCR3DM32,LF(SE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR3DM32,LF(SE is usually 5 days.
3.What payment methods are accepted for TCR3DM32,LF(SE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR3DM32,LF(SE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR3DM32,LF(SE?
TCR3DM32,LF(SE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR3DM32,LF(SE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR3DM32,LF(SE?
For technical support, including TCR3DM32,LF(SE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR3DM32,LF(SE requirements.
6.How does Aetrix verify that TCR3DM32,LF(SE is sourced from the original manufacturer or authorized distributors?
All TCR3DM32,LF(SE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR3DM32,LF(SE meets industry standards.
7.What is the process for return or replacement of TCR3DM32,LF(SE?
All TCR3DM32,LF(SE units undergo pre-shipment inspection (PSI). If there is an issue with TCR3DM32,LF(SE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR3DM32,LF(SE part is unused and in its original packaging.
Return procedure for TCR3DM32,LF(SE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TCR3DM32,LF(SE Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
