Toshiba Semiconductor and Storage TCR3DM36,LF
- Part No.:
- TCR3DM36,LF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Package:
- 4-UDFN Exposed Pad
- Datasheet:
-
TCR3DM36,LF.pdf
- Description:
- IC REG LINEAR 3.6V 300MA 4DFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,455
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Product details
Overview
TCR3DM36,LF from Toshiba Electronic Devices & Storage Corporation is a 3.6 V fixed-output CMOS low-dropout regulator delivering up to 300 mA with 150 mV typical dropout voltage (at 300 mA), 38 μVrms output noise, and inrush current protection - deployed as a primary power rail for RF transceivers and baseband ICs in cellular handsets.
For engineers reviewing the TCR3DM36,LF datasheet, TCR3DM36,LF pinout, TCR3DM36,LF application, or TCR3DM36,LF equivalent, key selection criteria include ultra-low-noise regulation for sensitive analog circuitry, fast load transient response (±80 mV), compatibility with 1.0 μF ceramic input/output capacitors, and DFN4E package constraints for high-density portable PCB layouts.
Technical Context
The TCR3DM36,LF employs a CMOS pass transistor architecture enabling low quiescent current (78 μA typical at 4.5 V output) and stable operation with minimal external components. Its integrated inrush current protection circuit limits peak input current during power-up, while the auto-discharge function rapidly discharges the output capacitor when disabled via the CONTROL pin.
It features internal over-current and over-temperature protection, a dedicated CONTROL pin with defined ON/OFF thresholds (1.0–5.5 V for ON, 0–0.4 V for OFF), and a center thermal pad that must be connected to GND for thermal performance. The device operates across –40°C to +85°C and supports input voltages from 1.75 V to 5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output voltage | Fixed 3.6 V ±1.0% - ensures stable supply for 3.3 V–3.6 V logic and RF ICs without external feedback. |
| Max output current | 300 mA - sufficient to power multi-core baseband processors or dual-band RF front-end modules. |
| Dropout voltage | 150 mV (typ.) at 300 mA - enables regulation from 3.75 V input (e.g., single Li-ion cell under load) while maintaining 3.6 V output. |
| Output noise | 38 μVrms (10 Hz–100 kHz) - minimizes phase noise coupling into VCOs and ADC reference rails. |
| Load transient response | ±80 mV (1 mA ⇔ 300 mA, COUT = 1.0 μF) - maintains signal integrity during burst-mode transmission in LTE/5G modems. |
| Ripple rejection | 70 dB (1 kHz) - suppresses switching noise from upstream DC/DC converters feeding the LDO input. |
| Quiescent current | 78 μA (typ.) at 4.5 V output - extends battery life in always-on sensor or standby communication circuits. |
Pinout & Package
TCR3DM36,LF is housed in an ultra-small DFN4E package (1.0 mm × 1.0 mm × 0.58 mm height) with exposed thermal pad. The package weighs 1.3 mg and requires GND connection of the center pad for thermal management and electrical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input power supply | Accepts 1.75–5.5 V; requires 1.0 μF ceramic capacitor placed adjacent to pin for EMI suppression and stability. |
| VOUT | Regulated output | Delivers fixed 3.6 V; connects directly to load; 1.0 μF ceramic capacitor mandatory for transient response compliance. |
| GND | Ground reference | Common return for VIN, VOUT, and CONTROL; center thermal pad must be soldered to GND plane for thermal dissipation. |
| CONTROL | Enable/disable control | Active-high logic: ≥1.0 V enables regulator; ≤0.4 V disables it and activates auto-discharge path to VOUT. |
Key Features
| Feature | Design Value |
|---|---|
| Inrush current protection | Prevents input voltage sag and system brown-out during cold start by limiting peak input current surge. |
| Auto-discharge function | Actively pulls VOUT to GND within microseconds after CONTROL goes low - eliminates residual voltage holding up downstream logic. |
| Ultra-low-noise regulation | 38 μVrms noise floor enables direct powering of PLLs, RF synthesizers, and precision ADCs without additional filtering. |
| DFN4E footprint compatibility | 1.0 mm × 1.0 mm body with 0.5-mm pitch allows placement in <1.5 mm² board area - critical for antenna-near RF module integration. |
| Pull-down on CONTROL pin | Internal pull-down ensures default OFF state at power-up unless actively driven - prevents unintended regulator activation. |
Applications
| Cellular Transceiver Power | Wearable Sensor Hub |
|---|---|
Use Scenario: Supplying VDD_RF and VDD_SYNTH rails in LTE/5G multimode transceivers inside smartphones. IC Role / Device Role / Timing Role: Primary low-noise post-regulator converting switched DC/DC output to clean 3.6 V for RF signal chain components. Use Value: 38 μVrms noise and ±80 mV load transient response prevent EVM degradation and maintain ACLR compliance during dynamic TX bursts. | Use Scenario: Powering ultra-low-power MCU, MEMS accelerometer, and BLE radio in compact fitness trackers. IC Role / Device Role / Timing Role: Always-on LDO supplying regulated 3.6 V from coin-cell or micro-battery during sleep/wake cycles. Use Value: 78 μA quiescent current and auto-discharge reduce standby leakage, extending battery life beyond 6 months. |
| Industrial IoT Edge Node | Automotive Infotainment Display |
Use Scenario: Providing stable 3.6 V bias to RS-485 transceivers and isolated CAN controllers in remote sensor nodes. IC Role / Device Role / Timing Role: Local point-of-load regulator decoupling noisy field bus power and ensuring EMC robustness. Use Value: 70 dB ripple rejection isolates digital bus noise from analog sensing circuitry, improving measurement accuracy. | Use Scenario: Powering display driver ICs and touch controller in automotive-grade infotainment head units. IC Role / Device Role / Timing Role: Secondary LDO supporting display interface logic requiring tight voltage tolerance and fast transient recovery. Use Value: ±1.0% output accuracy and 150 mV dropout enable reliable operation across wide input range (cold-crank to load-dump conditions). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-noise, 300 mA LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCS2112A36 | Higher quiescent current (120 μA), no auto-discharge, same DFN4E package | Lacks active discharge - unsuitable where rapid VOUT decay is required for sequencing | Select when cost sensitivity outweighs need for controlled shutdown behavior |
| MCP1703T-3602E/MB | Higher dropout (330 mV @ 250 mA), larger SOT-23-5 package, no inrush protection | Requires larger board area and cannot support Li-ion minimum input voltage under full load | Choose only if legacy SOT-23 layout reuse is mandatory and noise/size are secondary |
Compared with TCR3DM36,LF, TCS2112A36 trades auto-discharge for slightly higher IQ, while MCP1703T-3602E/MB sacrifices dropout performance and package size for broader vendor availability - making TCR3DM36,LF optimal for space-constrained, noise-sensitive, and sequenced-power designs.
Availability
TCR3DM36,LF is available at Aetrix Electronics and suitable for cellular handset power management, wearable sensor hubs, industrial IoT edge nodes, and automotive infotainment displays requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for TCR3DM36,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs high-reliability semiconductor solutions for consumer, industrial, and automotive markets, with emphasis on power efficiency and miniaturization.
The TCR3DM series targets portable electronics requiring ultra-small, low-noise, and feature-rich LDOs - specifically engineered for high-density mobile platforms where board space, battery life, and signal integrity are critical.
FAQ
What is the maximum input voltage rating for TCR3DM36,LF?
The absolute maximum input voltage for TCR3DM36,LF is 6.0 V. However, the recommended operating input voltage range is 1.75 V to 5.5 V per electrical characteristics testing conditions. Exceeding 5.5 V may trigger overvoltage stress not covered by standard reliability qualification, and operation above 6.0 V risks permanent damage. Always ensure input transient suppression (e.g., TVS diode) is implemented if the source can exceed 5.5 V.
Does TCR3DM36,LF require an external pull-up resistor on the CONTROL pin?
No, TCR3DM36,LF does not require an external pull-up resistor on the CONTROL pin because it integrates an internal pull-down. When left unconnected, the CONTROL pin defaults to logic LOW, disabling the regulator and activating auto-discharge. To enable the device, drive the pin to ≥1.0 V using a clean digital signal - no external biasing components are needed, simplifying PCB layout and reducing BOM count.
Can TCR3DM36,LF operate with a 1.0 μF ceramic capacitor on both input and output?
Yes, TCR3DM36,LF is fully characterized and guaranteed to operate stably with 1.0 μF X5R/X7R ceramic capacitors on both VIN and VOUT. This is explicitly validated in the datasheet's Electrical Characteristics table and Application Note section. Using smaller or lower-ESR capacitors may degrade load transient response or cause instability, so adherence to the 1.0 μF minimum value is required for production compliance.
What is the thermal pad connection requirement for TCR3DM36,LF?
The center thermal pad of TCR3DM36,LF must be soldered to a GND plane on the PCB. It is not optional - the pad serves both thermal conduction (to dissipate up to 420 mW) and electrical grounding for internal circuit stability. Leaving it floating or connecting it to another net violates the Absolute Maximum Ratings and may cause thermal runaway or output regulation failure. Use at least four thermal vias under the pad connected to an inner-layer GND plane.
How does the inrush current protection circuit in TCR3DM36,LF function during startup?
The inrush current protection circuit in TCR3DM36,LF limits peak input current during initial power application by controlling the gate slew rate of the internal CMOS pass transistor. This prevents large capacitive loads on VOUT from drawing excessive current from VIN, avoiding input rail collapse and preventing false triggering of upstream overcurrent protection. The feature operates automatically - no external components or configuration are required - and is active each time the CONTROL pin transitions from OFF to ON.
TCR3DM36,LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- TCR3DM
- Package/Case:
- 4-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.6V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.2V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 65 µA
- Current - Supply (Max):
- 78 µA
- PSRR:
- 70dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-DFN (1x1)
TCR3DM36,LF FAQ
1.How can I place an order for TCR3DM36,LF through Aetrix?
Please submit a Request for Quotation (RFQ) for TCR3DM36,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TCR3DM36,LF reliable?
The price and inventory of TCR3DM36,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCR3DM36,LF is usually 5 days.
3.What payment methods are accepted for TCR3DM36,LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCR3DM36,LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TCR3DM36,LF?
TCR3DM36,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TCR3DM36,LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TCR3DM36,LF?
For technical support, including TCR3DM36,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCR3DM36,LF requirements.
6.How does Aetrix verify that TCR3DM36,LF is sourced from the original manufacturer or authorized distributors?
All TCR3DM36,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCR3DM36,LF meets industry standards.
7.What is the process for return or replacement of TCR3DM36,LF?
All TCR3DM36,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCR3DM36,LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TCR3DM36,LF part is unused and in its original packaging.
Return procedure for TCR3DM36,LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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