Infineon Technologies TDA21590AUMA1
- Part No.:
- TDA21590AUMA1
- Manufacturer:
- Infineon Technologies
- Package:
- 39-PowerVFQFN
- Datasheet:
-
TDA21590AUMA1.pdf
- Description:
- IC REG BUCK 39QFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,875
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Product details
Overview
TDA21590AUMA1 from Infineon Technologies is a 90 A integrated power-stage IC for synchronous buck DC-DC conversion, featuring co-packaged gate driver, control MOSFET (Q1), synchronous MOSFET (Q2), and active diode structure. It delivers 0.225–5.5 V output across 4.25–16 V input, operates up to 1.5 MHz, and provides on-chip current sensing at 5 µA/A with 8 mV/°C analog temperature reporting - deployed in high-density CPU/GPU VRMs and DDR memory power delivery.
For engineers reviewing the TDA21590AUMA1 datasheet, TDA21590AUMA1 pinout, TDA21590AUMA1 application, or TDA21590AUMA1 equivalent, key selection criteria include its 5 mm × 6 mm PQFN package, tri-state 3.3 V PWM interface, body-braking™ transient support, DEEP SLEEP mode (32 µA), and integrated fault flags for HSS, OCP, BOOT UV, and thermal shutdown.
Technical Context
The TDA21590AUMA1 implements a monolithic synchronous buck power stage with internal MOSFET current sensing and analog temperature monitoring. Its architecture integrates a low-quiescent-current gate driver, active diode structure (low VSD, minimal Qrr), and bootstrap capacitor auto-replenishment logic - enabling stable operation at 1.5 MHz switching frequency while minimizing switch-node ringing.
It supports tri-state PWM control (High = Q1 on, Tri-state = both off, Low = Q2 on), features VDRV and VCC supply rails (4.25–5.5 V), and delivers real-time diagnostics via IMON (5 µA/A), TMON (8 mV/°C + 0.6 V offset), and FAULT flag assertion on overtemperature, cycle-by-cycle overcurrent, high-side short, or bootstrap under-voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 90 A continuous - supports high-power CPU/GPU core rails without external current sharing. |
| Input Voltage Range | 4.25 V to 16 V - compatible with 5 V, 12 V, and 15 V intermediate bus architectures. |
| Switching Frequency | Up to 1.5 MHz - enables use of sub-300 nH inductors and compact ceramic output capacitors. |
| Current Sense Accuracy | 5 µA/A with external 1 kΩ resistor - yields ±5 mV/A resolution, superior to DCR-based sensing in noise immunity and temperature stability. |
| Temperature Reporting | 8 mV/°C + 0.6 V analog output - allows precise junction temperature tracking from −40°C to +125°C without external sensor. |
| Quiescent Current | 32 µA in DEEP SLEEP (EN = low) - reduces standby power in multi-rail systems during idle states. |
| Package Dimensions | 5 mm × 6 mm × 0.9 mm PQFN - optimized for PCB thermal spreading, low-inductance layout, and compatibility with TDA2147x footprint. |
Pinout & Package
Package: 43-pin PQFN (5 mm × 6 mm × 0.9 mm), RoHS-compliant, with exposed thermal pad (pins 25–30 VIN, 5/8/9/20–24/37 PGND, 2 AGND).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 34 PWM | Tri-state digital input | 3.3 V logic interface: High → Q1 on; Tri-state → both FETs off; Low → Q2 on - enables precise dead-time control and zero-voltage switching. |
| 35 EN | Enable control input | VCC-tolerant enable pin; pulled low → enters 32 µA ultra-low-power mode with internal pull-down - eliminates need for external bias network. |
| 33 BOOT / 32 PHASE | Bootstrap supply node | BOOT connects to PHASE via 0.47 µF X7R cap; internal auto-replenishment prevents undercharge - sustains Q1 gate drive at high duty cycles and >13.2 V VIN. |
| 36 TMON / FAULT | Analog temp output & fault flag | Outputs 8 mV/°C analog voltage; pulls to 3.3 V during OTP/OCP/HSS/BOOT UV - dual-purpose pin simplifies system monitoring and fault isolation. |
| 38 IMON / 39 IMONREF | Current sense differential output | IMON = 5 µA/A × IOUT; IMONREF sets common-mode reference - enables accurate, isolated current measurement with single external resistor. |
| 10–19 SW | Power switching node | High-current AC node shared by Q1 drain and Q2 source; requires tight layout to minimize EMI and ringing - critical for >1 MHz operation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Active Diode Structure | Replaces external Schottky with <150 mV VSD and negligible reverse recovery charge - improves light-load efficiency and reduces EMI vs. discrete solutions. |
| Body-Braking™ Transient Support | Enables rapid discharge of output inductor energy during load step-down - maintains tight voltage regulation (<±15 mV) during 50 A/µs transients in CPU cores. |
| On-Chip MOSFET Current Sensing | Eliminates DCR sensing errors from copper temperature drift and PCB layout variance - achieves ±2% current accuracy across −40°C to +125°C. |
| Bootstrap Capacitor Auto-Replenishment | Internally refreshes BOOT voltage during low-duty-cycle operation - prevents Q1 turn-off failure in deep CCM or high-input-voltage conditions. |
| HSS (High-Side Short) Detection | Detects Q1 short-to-ground within one switching cycle and asserts FAULT - prevents catastrophic failure during board-level fault events like solder bridging. |
Applications
| Server CPU Core VRM | AI Accelerator GPU Power |
|---|---|
Use Scenario: Delivering dynamically scaled 0.6–1.2 V / 60–90 A power to multi-core x86 processors under burst workloads. IC Role / Device Role / Timing Role: Primary high-current synchronous buck power stage, controlled by digital multiphase controller via tri-state PWM. Use Value: On-chip current sensing enables per-phase current balancing; Body-Braking™ ensures <200 ns response to 40 A load drops - maintaining AVS compliance. | Use Scenario: Supplying 0.75–0.9 V / 70–90 A to NVIDIA/AMD AI GPUs with aggressive dv/dt requirements. IC Role / Device Role / Timing Role: High-frequency (1.2–1.5 MHz) power stage in 3+1 phase configuration, synchronized to controller clock. Use Value: 5 mm × 6 mm footprint allows dense phase interleaving; low θJC (1.5 K/W) sustains 90 A at ≤125°C junction without forced airflow. |
| DDR5 Memory VDDQ Regulator | High-Density Telecom ASIC Power |
Use Scenario: Providing tightly regulated 1.1 V / 40–60 A to DDR5 modules with fast transient response and low noise. IC Role / Device Role / Timing Role: Single-phase buck stage with IMON feedback to controller for dynamic margining and health monitoring. Use Value: 8 mV/°C TMON output enables real-time thermal derating; 1.5 MHz operation shrinks output filter to <100 µF total capacitance. | Use Scenario: Powering 5G baseband ASICs requiring 0.85 V / 50–80 A with strict EMI limits and -40°C to +85°C operation. IC Role / Device Role / Timing Role: High-efficiency, high-reliability power stage in fanless outdoor telecom equipment. Use Value: Integrated OTP and HSS protection eliminate need for external fault logic; RoHS PQFN meets IPC-J-STD-020 moisture sensitivity level 3. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL99390HRZ-T | 90 A rating, 4.5–16 V input, but uses external current sense resistor; no integrated active diode - higher VSD and Qrr. | Lacks Body-Braking™ and IMON analog output; requires separate temperature sensor for thermal monitoring. | Preferred where cost-sensitive designs accept trade-offs in transient response and diagnostic integration. |
| TDA21472AUMA1 | Same PQFN footprint and pinout, but rated for 70 A; shares identical PWM/EN/IMON/TMON interface and protection features. | Lower current capability suits mid-tier CPUs or dual-rail DDR5 VPP/VDDQ split designs. | Select when 70 A suffices and footprint compatibility with TDA21590AUMA1 simplifies board reuse. |
Compared with ISL99390HRZ-T and TDA21472AUMA1, the TDA21590AUMA1 uniquely combines 90 A capability, on-die active diode, Body-Braking™, and dual-function TMON/FAULT - delivering higher efficiency at light loads, faster transient recovery, and simplified system-level diagnostics in space-constrained VRMs.
Availability
TDA21590AUMA1 is available at Aetrix Electronics and suitable for server CPU core VRMs, AI accelerator GPU power supplies, and DDR5 memory VDDQ regulators requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for TDA21590AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon carbide and OptiMOS™ power devices.
The TDA21590AUMA1 belongs to Infineon's OptiMOSTM Power Stage product line, engineered specifically for high-frequency, high-current CPU/GPU/DDR power delivery in datacenter and AI hardware - emphasizing integration, thermal performance, and real-time fault visibility.
FAQ
What is the recommended bootstrap capacitor value and placement for TDA21590AUMA1?
The datasheet specifies a 0.47 µF X7R ceramic capacitor between BOOT (pin 33) and PHASE (pin 32), placed as close as possible to the pins with minimal loop area. For VIN > 13.2 V, a 2 Ω resistor must be added in series with the capacitor to suppress SW ringing and EMI - this is mandatory per layout guidelines and directly impacts gate-drive reliability.
How does the IMON current sense output interface with a controller?
IMON (pin 38) and IMONREF (pin 39) form a differential current-sense output referenced to system ground. A single 1 kΩ resistor between them produces a voltage proportional to output current (5 µA/A × 1 kΩ = 5 mV/A). The controller reads this voltage to implement closed-loop current limiting, phase balancing, or telemetry - no calibration is required due to factory-trimmed gain.
Does TDA21590AUMA1 support multiphase synchronization?
Yes - the TDA21590AUMA1 accepts externally generated tri-state PWM signals and does not generate its own clock. When used with a multiphase controller (e.g., ISL68228, IR35221), it synchronizes seamlessly to the controller's phase clock and PWM timing, enabling interleaved operation across multiple TDA21590AUMA1 units without additional timing circuitry.
What thermal derating applies above 125°C junction temperature?
The device incorporates overtemperature protection (OTP) that triggers thermal shutdown at TJ ≥ 150°C (absolute max), but its recommended operating range is −40°C to +125°C. Above 125°C, output current must be reduced per the thermal resistance data: θJC_PCB = 1.5 K/W means ~15°C rise per 10 A at typical PCB copper mass - sustained operation above 125°C requires active derating or enhanced cooling to avoid OTP activation.
TDA21590AUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 39-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- -
- Number of Outputs:
- 1
- Voltage - Input (Min):
- -
- Voltage - Input (Max):
- -
- Voltage - Output (Min/Fixed):
- -
- Voltage - Output (Max):
- -
- Current - Output:
- -
- Frequency - Switching:
- -
- Synchronous Rectifier:
- No
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-IQFN-39
TDA21590AUMA1 FAQ
1.How can I place an order for TDA21590AUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21590AUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21590AUMA1 reliable?
The price and inventory of TDA21590AUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21590AUMA1 is usually 5 days.
3.What payment methods are accepted for TDA21590AUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21590AUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21590AUMA1?
TDA21590AUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21590AUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21590AUMA1?
For technical support, including TDA21590AUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21590AUMA1 requirements.
6.How does Aetrix verify that TDA21590AUMA1 is sourced from the original manufacturer or authorized distributors?
All TDA21590AUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21590AUMA1 meets industry standards.
7.What is the process for return or replacement of TDA21590AUMA1?
All TDA21590AUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21590AUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21590AUMA1 part is unused and in its original packaging.
Return procedure for TDA21590AUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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