Infineon Technologies TDA48632GXUMA2

Overview

TDA48632GXUMA2 from Infineon Technologies is a Power-Factor Correction (PFC) boost controller IC designed for active harmonic filtering in AC/DC front-end stages. It delivers near-unity power factor (>0.99), <5% THD at 110 W output, and supports universal input (85–265 V_AC). The device implements zero-current detection for discontinuous conduction mode (DCM), features internal leading-edge blanking (LEB), and drives MOSFETs up to 20 A peak source current in high-efficiency boost PFC applications such as LED drivers and industrial SMPS.

For engineers reviewing the TDA48632GXUMA2 datasheet, TDA48632GXUMA2 pinout, TDA48632GXUMA2 application, or TDA48632GXUMA2 equivalent, key selection criteria include its 8-pin PG-DSO-8-3 package, 2.2 V VAOUT inhibit threshold, 5 V internal VAOUT clamp, 0.5 V ISENSE overcurrent trip, and DETIN-based zero-current sensing for DCM timing control.

Technical Context

The TDA48632GXUMA2 integrates a transconductance voltage amplifier with integrator behavior (via external VAOUT capacitor), a two-input analog multiplier (VSENSE-derived error and MULTIN-derived rectified line signal), and a current-mode PWM controller with RS flip-flop gating. Its zero-current detector (DETIN) enables precise DCM boundary control, while internal LEB suppresses switching noise on ISENSE.

Functional safety features include undervoltage lockout (UVLO) with 10 V turn-on / 8.5 V turn-off thresholds, output overvoltage regulation (OVR) triggered at 5.4 V on VAOUT, and active gate-driver shutdown during fault or disable conditions. The totem-pole GTDRV output sustains 0.85 V low-level drive capability for robust MOSFET turn-off.

Key Specifications

Pinout & Package

Package: PG-DSO-8-3 (8-pin, exposed pad, RoHS-compliant, surface-mount SOIC variant of DIP-8).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PFC controller applications.

Compared with ICE3PCS01G and UCC28019DR, the TDA48632GXUMA2 uniquely integrates DETIN-based DCM control and 0.5 V precision current sensing-enabling simpler, lower-component-count designs for sub-200 W universal-input PFC stages with stringent THD requirements.

Availability

TDA48632GXUMA2 is available at Aetrix Electronics and suitable for LED street lighting drivers, industrial AC/DC power supplies, and medical imaging auxiliary PSUs requiring stable component supply and long-term lifecycle support.

Supply support for TDA48632GXUMA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.

The TDA48632GXUMA2 belongs to Infineon's legacy PFC controller product line, engineered specifically for cost-effective, high-PF, low-THD boost converters in universal-input offline power supplies up to 250 W.

FAQ

What is the recommended minimum value for the VAOUT capacitor?

A 100 nF ceramic capacitor is required between VAOUT and GND to stabilize the voltage amplifier integrator and prevent oscillation. Larger values (e.g., 220–470 nF) may be used to improve low-frequency ripple rejection but increase startup time and reduce transient response speed. Layout must minimize trace inductance to this node.

Can TDA48632GXUMA2 operate in continuous conduction mode (CCM)?

No - the TDA48632GXUMA2 is designed exclusively for discontinuous conduction mode (DCM) operation using DETIN-based zero-current detection. Its internal timing and protection logic assume DCM waveforms; attempting CCM results in unstable regulation and potential overvoltage faults due to missing valley-switching synchronization.

How does the internal leading-edge blanking (LEB) function affect layout?

The LEB circuit blanks the ISENSE comparator for 2 µs after GTDRV turn-on, eliminating need for external RC snubbers. Layout must keep the ISENSE trace short and away from noisy nodes (e.g., GTDRV, BOOST SW) to avoid coupling that exceeds the 2 µs blanking window and causes false current-limit triggering.

Is the PG-DSO-8-3 package thermally enhanced?

Yes - the PG-DSO-8-3 package features an exposed thermal pad on the underside, which must be soldered to a dedicated copper pour on the PCB for effective heat dissipation. Thermal resistance θ_JA drops from 120 °C/W (no pad) to 65 °C/W with ≥200 mm² 2-oz copper pad and 4 thermal vias - critical for sustained 20 A MOSFET gate drive reliability.