NXP Semiconductors TDA8002CG/C1,518

Overview

TDA8002CG/C1,518 from NXP Semiconductors (formerly Philips) is a dedicated ISO 7816-compliant IC card interface IC designed to sit between smart cards and microcontrollers in secure transaction systems. It provides regulated 3 V or 5 V card supply (±5%), integrated step-up converter, thermal/short-circuit protection, automatic activation/deactivation sequences, and clock generation up to 12 MHz for synchronous/asynchronous memory and smart cards - deployed in banking terminals and GSM SIM readers.

For engineers reviewing the TDA8002CG/C1,518 datasheet, TDA8002CG/C1,518 pinout, TDA8002CG/C1,518 application, or TDA8002CG/C1,518 equivalent, key selection criteria include its LQFP32 package with 32-pin I/O mapping, dual-supply operation (3.0–6.5 V), 150 µA low-power sleep current, 55 mA max card supply current, and EMV/GSM11.11 compliance for payment and identification hardware design.

Technical Context

The TDA8002CG/C1,518 implements a fully autonomous ISO 7816-3 physical layer controller with three protected half-duplex buffered I/O lines (I/O, AUX1, AUX2), on-chip voltage doubler (S1/S2/VUP), and programmable clock circuitry supporting internal RC oscillator (2.5 MHz typ), external crystal (2–24 MHz), or STROBE input (≤10 MHz). Its sequencer executes deterministic activation (<220 µs) and deactivation (50–100 µs) sequences with built-in timing control for RST, CLK, and VCC ramping.

It integrates analog and digital supply domains (VDDA/VDDD), separate AGND/DGND1/DGND2 grounds, open-drain ALARM (active-HIGH reset pulse) and OFF (active-LOW fault interrupt), chip select (CS) for multi-device parallel operation, and mode-controlled sleep entry/exit with 16 kHz CLKOUT during low-power state. All card-side I/O pins feature >6 kV ESD protection.

Key Specifications

Pinout & Package

LQFP32 package (SOT401-1), 5 × 5 × 1.4 mm body, 0.5 mm pitch, exposed pad (not electrically connected).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar IC card interface applications.

Compared with ST8002C and SLB9670, the TDA8002CG/C1,518 delivers optimized cost, minimal external component count (no external regulator or crystal load caps needed), and proven field reliability in high-volume banking/GSM deployments - making it ideal for resource-constrained, standards-certified reader designs.

Availability

TDA8002CG/C1,518 is available at Aetrix Electronics and suitable for banking terminals, GSM SIM readers, and secure ID access systems requiring stable component supply, long-term lifecycle support, and full EMV/GSM11.11 compliance documentation.

Supply support for TDA8002CG/C1,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in secure connectivity solutions, formed from the semiconductor division of Philips and later acquired by Qualcomm before re-spinning as an independent entity in 2016.

The TDA8002CG/C1,518 belongs to NXP's legacy smart card interface product line, engineered specifically for ISO 7816-3 physical layer compliance in payment, telecom, and identity infrastructure - emphasizing low power, robust protection, and deterministic timing.

FAQ

What is the maximum card supply current supported by the TDA8002CG/C1,518?

The TDA8002CG/C1,518 supports up to 55 mA continuous card supply current (ICC(O)) at either 3 V or 5 V output. Under short-circuit conditions, it limits current to 200 mA before triggering thermal shutdown - ensuring safe operation during card faults or misinsertion events. This rating aligns with ISO 7816-3 Class A/B power requirements.

Does the TDA8002CG/C1,518 support both 3 V and 5 V smart cards in the same design?

Yes, the TDA8002CG/C1,518 supports both 3 V and 5 V smart cards via the CV/TV pin: applying HIGH selects 5 V ±5% output, while LOW selects 3 V ±5%. The voltage supervisor and step-up converter automatically adapt, and the activation sequence ensures correct VCC ramp timing regardless of selected voltage - enabling single-hardware reader designs for mixed-card environments.

How does the TDA8002CG/C1,518 handle card presence detection and fault interrupts?

The TDA8002CG/C1,518 uses the PRES pin (active-LOW) to detect mechanical card insertion. For faults, it asserts the open-drain OFF pin LOW on short-circuit, overheating (>135 °C), VDD drop, or card removal during transaction. The OFF signal remains active until CMDVCC is pulsed HIGH post-deactivation - providing unambiguous, hardware-driven fault signaling without MCU polling overhead.

Can the TDA8002CG/C1,518 operate with an external clock source instead of a crystal?

Yes, the TDA8002CG/C1,518 accepts an external clock up to 10 MHz on the STROBE pin when CLKSEL is set HIGH. This bypasses the internal oscillator and enables synchronous operation with system clocks or precision timing sources - useful in designs where crystal layout is impractical or where clock synchronization with host MCU is required.

What are the thermal characteristics and power dissipation limits of the TDA8002CG/C1,518?

The TDA8002CG/C1,518 in LQFP32 (SOT401-1) has a thermal resistance R_th(j-a) of 91 K/W in free air and a maximum continuous power dissipation of 0.46 W at −25 to +85 °C ambient. Junction temperature must not exceed 150 °C; thermal shutdown activates at 135 °C. These values ensure reliable operation in compact, fanless reader enclosures without forced cooling.