NXP Semiconductors TDA8035HN/C1/S1EL
- Part No.:
- TDA8035HN/C1/S1EL
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- -
- Datasheet:
-
TDA8035HN/C1/S1EL.pdf
- Description:
- HIGH INTEGRATED AND LOW POWER SM
- Quantity:
- Payment:

- Shipping:

Inventory:2,449
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TDA8035HN/C1/S1EL from NXP Semiconductors is a highly integrated, low-power smart card interface IC designed for ISO 7816-compliant contact readers. It delivers regulated 5 V / 3 V / 1.8 V card supply (±5 %), supports up to 20 MHz card clock generation, provides thermal/short-circuit protection on all card contacts, and achieves deep shutdown current as low as 0.1 µA - enabling power-efficient banking and pay-TV terminals.
For engineers reviewing the TDA8035HN/C1/S1EL datasheet, TDA8035HN/C1/S1EL pinout, TDA8035HN/C1/S1EL application, or TDA8035HN/C1/S1EL equivalent, key selection criteria include its HVQFN32 package, triple-voltage VCC regulation with 125 mA overload detection, synchronous CLKDIV-based clock scaling, built-in card presence debouncing (4.05 ms), and ESD protection >8 kV on card-side pins.
Technical Context
The TDA8035HN/C1/S1EL integrates a DC-to-DC converter powered separately from VDDP (2.7–5.5 V) to generate precise VCC outputs (5 V/3 V/1.8 V) using SAM/SAP/SBM/SBP capacitor networks and voltage tripler/doubler/follower modes selected by EN_5V/3VN and EN_1.8VN logic states. Its internal oscillator dynamically switches between low-frequency (startup/shutdown) and high-frequency (active session) modes to minimize power.
Card interface operation follows ISO 7816 timing and electrical conventions: three protected bidirectional I/O lines (I/O, AUX1, AUX2) feature active pull-up (>1 mA into 0.9×VCC on 80 pF), 15 mA current limiting, and master/slave edge arbitration; fault detection triggers automatic deactivation on short-circuit, card removal, VDDP/VREG/VDD(INTF) drop, or overheating - signaled via NMOS OFFN interrupt.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Output | 5 V / 3 V / 1.8 V ±5 %; supports EMV 4.3 (C2 version) and ISO 7816 cards with 65 mA (5 V/3 V) or 35 mA (1.8 V) continuous load |
| Deep Shutdown Current | 0.1 µA typical; enables ultra-low-power standby in battery-operated readers |
| Card Clock Frequency | fXTAL, fXTAL/2, fXTAL/4, or fXTAL/8 up to 20 MHz; synchronous transitions ensure ≥45 % duty cycle and pulse integrity |
| ESD Protection | >8 kV HBM on card-side pins (I/O, RST, VCC, AUX1, CLK, AUX2, PRESN); meets IEC 61000-4-2 system-level robustness requirements |
| Supply Supervision | Internally fixed thresholds for VDDP (2.25 V typ) and VREG (1.45 V typ); external adjustment via PORADJ resistor bridge for VDD(INTF) |
| Thermal Protection | Automatic deactivation on junction temperature exceeding +125 °C; thermal resistance Rth(j-a) = 55 K/W with 4 thermal vias |
| Card Presence Debounce | 4.05 ms built-in delay (1280 × 1/fosc(int)_Low); eliminates mechanical switch bounce without external RC network |
Pinout & Package
HVQFN32 package: plastic thermal-enhanced very thin quad flat package, no leads, 32 terminals, body size 5 mm × 5 mm × 0.85 mm (SOT617-7).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/OUC (Pin 1) | Host interface data line | Bi-directional I/O referenced to VDD(INTF); internal 10 kΩ pull-up enables level-shifting when VCC ≠ VDD(INTF) |
| CMDVCCN (Pin 3) | Activation control input | Active-low command initiating full card activation sequence including VCC ramp, CLK enable, and RST assertion |
| VCC (Pin 22) | Smart card supply output | Regulated 5 V / 3 V / 1.8 V output decoupled by two 220 nF MLCCs; overload detection at ~125 mA |
| RST (Pin 23) | Card reset output | Active-high open-drain output synchronized to activation/deactivation timing; driven after VCC stabilization |
| CLK (Pin 24) | Card clock output | Programmable frequency (fXTAL/n) with 45–55 % duty cycle; rise/fall times controlled to meet ISO 7816-3 timing |
| PRESN (Pin 30) | Card presence sense input | Active-low input with integrated 4.05 ms debounce; used to trigger emergency deactivation on card removal |
| OFFN (Pin 10) | Fault interrupt output | Active-low NMOS open-drain interrupt signaling short-circuit, overtemperature, supply drop, or card extraction |
Key Features
| Feature | Design Value |
|---|---|
| Triple-voltage VCC regulation | Single IC supports 5 V, 3 V, and 1.8 V ISO 7816 cards without external LDOs or switching regulators |
| Synchronous clock division | CLKDIV1/CLKDIV2 control enables glitch-free, duty-cycle-preserving frequency changes during live card sessions |
| Integrated DC-to-DC converter | Separately powered (VDDP/GNDP) architecture isolates card supply noise from host interface rails |
| Hardware-accelerated fault response | Sub-100 µs deactivation on VCC short-circuit or card removal - faster than software-controlled alternatives |
| Multi-rail I/O buffering | I/OUC/AUX1UC/AUX2UC referenced to VDD(INTF); I/O/AUX1/AUX2 referenced to VCC - enables mixed-voltage host-card systems |
Applications
| Banking Card Reader | Pay-TV Conditional Access Module |
|---|---|
Use Scenario: Embedded reader in ATM or point-of-sale terminal authenticating EMV chip cards. IC Role / Device Role / Timing Role: Smart card interface controller managing VCC sequencing, CLK generation, RST timing, and fault-safe deactivation per ISO 7816-3. Use Value: Enables C2-version compliance with EMV 4.3 payment standards while reducing BOM count via integrated DC-DC and supervision. | Use Scenario: Set-top box module reading subscription smart cards for content decryption. IC Role / Device Role / Timing Role: Low-power card interface maintaining secure communication during intermittent channel tuning events. Use Value: Deep shutdown current of 0.1 µA extends battery life in portable or always-on STB applications. |
| Electronic ID Terminal | Secure Government Authentication System |
Use Scenario: Border control kiosk verifying national eID cards compliant with ICAO 9303. IC Role / Device Role / Timing Role: ISO 7816-1/2/3/4 interface with ESD-hardened card contacts and tamper-responsive fault detection. Use Value: >8 kV HBM ESD protection ensures reliability in high-touch public infrastructure environments. | Use Scenario: Military-grade credential reader validating PKI-based smart cards in classified facilities. IC Role / Device Role / Timing Role: Secure card interface with hardware-enforced deactivation on supply anomaly or thermal event. Use Value: Automatic emergency deactivation within 250 µs on VDDP drop or overheating prevents side-channel data leakage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar smart card interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SLB9670 | Trusted Platform Module (TPM) with integrated smart card controller; requires external VCC regulation and lacks DC-DC converter | Designed for PC platform security; not optimized for standalone card readers or low-power embedded use | Select TDA8035HN/C1/S1EL for cost-sensitive, self-contained readers needing integrated power and compact HVQFN32 footprint |
| ST8024 | Legacy NXP device; identical pinout but higher active current (8 mA vs. 5 mA typical) and no 1.8 V support or deep shutdown mode | Limited to 5 V/3 V cards; unsuitable for modern low-voltage EMV and eID applications | Choose TDA8035HN/C1/S1EL for new designs requiring 1.8 V compatibility, <0.5 µA shutdown, and enhanced ESD robustness |
Compared with SLB9670 and ST8024, the TDA8035HN/C1/S1EL uniquely combines integrated triple-voltage DC-DC conversion, sub-1 µA deep shutdown, and >8 kV card-side ESD in a thermally enhanced 5×5 mm HVQFN32 package - delivering lower system BOM cost and higher reliability for dedicated smart card readers.
Availability
TDA8035HN/C1/S1EL is available at Aetrix Electronics and suitable for banking card readers, pay-TV conditional access modules, electronic ID terminals, and secure government authentication systems requiring stable component supply and long-term lifecycle support.
Supply support for TDA8035HN/C1/S1EL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in smart card, NFC, and secure element technologies.
The TDA8035HN/C1/S1EL belongs to NXP's contact smart card reader IC product line, engineered specifically to replace legacy TDA8024/TDA8034 devices with enhanced power efficiency, broader voltage support, and stronger fault resilience for EMV and eID infrastructure.
FAQ
What is the maximum card clock frequency supported by the TDA8035HN/C1/S1EL?
The TDA8035HN/C1/S1EL supports card clock frequencies up to 20 MHz via its programmable CLKDIV1/CLKDIV2 divider chain, generating fXTAL, fXTAL/2, fXTAL/4, or fXTAL/8 outputs with guaranteed 45–55 % duty cycle and synchronous transition integrity - meeting ISO 7816-3 timing requirements for high-speed smart card protocols.
Does the TDA8035HN/C1/S1EL support 1.8 V smart cards?
Yes, the TDA8035HN/C1/S1EL fully supports 1.8 V smart cards with ±5 % regulation, delivering up to 35 mA continuous current and featuring AC current spike handling of 15 nA/s up to 20 MHz. Its EN_1.8VN control pin enables seamless voltage selection alongside 5 V and 3 V modes - critical for modern eID and EMV applications.
How does the TDA8035HN/C1/S1EL handle card insertion and removal events?
The TDA8035HN/C1/S1EL uses the PRESN pin with built-in 4.05 ms hardware debounce to detect card presence. On insertion, it initiates a controlled activation sequence; on removal during a session, it triggers immediate emergency deactivation - pulling RST low, stopping CLK, and ramping VCC to zero within 250 µs - ensuring data integrity and preventing card damage.
What is the purpose of the OFFN pin on the TDA8035HN/C1/S1EL?
The OFFN pin on the TDA8035HN/C1/S1EL is an active-low NMOS open-drain interrupt output that signals fault conditions including VCC short-circuit, card removal, VDDP/VREG/VDD(INTF) supply drop, or overheating. It features a 10 kΩ internal pull-up to VDD(INTF) and enables host microcontrollers to respond to critical events without polling.
Can multiple TDA8035HN/C1/S1EL devices operate in parallel on the same host bus?
Yes, the TDA8035HN/C1/S1EL includes a Chip Select (CS) digital input (Pin 29) that allows parallel operation of multiple devices. When CS is high, all interface signals function normally; when CS is low, CMDVCCN, RSTIN, CLKDIV1/2, and EN pins are latched, and I/OUC/AUX1UC/AUX2UC enter high-impedance mode - enabling shared bus architectures.
TDA8035HN/C1/S1EL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- -
- Interface:
- -
- Voltage - Supply:
- -
- Supplier Device Package:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
TDA8035HN/C1/S1EL FAQ
1.How can I place an order for TDA8035HN/C1/S1EL through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA8035HN/C1/S1EL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA8035HN/C1/S1EL reliable?
The price and inventory of TDA8035HN/C1/S1EL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA8035HN/C1/S1EL is usually 5 days.
3.What payment methods are accepted for TDA8035HN/C1/S1EL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA8035HN/C1/S1EL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA8035HN/C1/S1EL?
TDA8035HN/C1/S1EL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA8035HN/C1/S1EL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA8035HN/C1/S1EL?
For technical support, including TDA8035HN/C1/S1EL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA8035HN/C1/S1EL requirements.
6.How does Aetrix verify that TDA8035HN/C1/S1EL is sourced from the original manufacturer or authorized distributors?
All TDA8035HN/C1/S1EL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA8035HN/C1/S1EL meets industry standards.
7.What is the process for return or replacement of TDA8035HN/C1/S1EL?
All TDA8035HN/C1/S1EL units undergo pre-shipment inspection (PSI). If there is an issue with TDA8035HN/C1/S1EL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA8035HN/C1/S1EL part is unused and in its original packaging.
Return procedure for TDA8035HN/C1/S1EL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TDA8035HN/C1/S1EL Tags

-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments

-
MD0100N8-G
Microchip Technology

-
PCA9548APW,118
NXP Semiconductors

-
PCA9540BDP,118
NXP Semiconductors

-
PCA9548APWR
Texas Instruments

-
PCA9546APW,118
NXP Semiconductors

-
PTN3360DBS,518
NXP Semiconductors

-
PCA9546ABS,118
NXP Semiconductors

-
PCA9518PWR
Texas Instruments

-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

