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NXP Semiconductors TDA8035HN/C1/S1EL

Part No.:
TDA8035HN/C1/S1EL
Manufacturer:
NXP Semiconductors
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Specialized
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Datasheet:
AetrixTDA8035HN/C1/S1EL.pdf
Description:
HIGH INTEGRATED AND LOW POWER SM
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Product details

Overview

TDA8035HN/C1/S1EL from NXP Semiconductors is a highly integrated, low-power smart card interface IC designed for ISO 7816-compliant contact readers. It delivers regulated 5 V / 3 V / 1.8 V card supply (±5 %), supports up to 20 MHz card clock generation, provides thermal/short-circuit protection on all card contacts, and achieves deep shutdown current as low as 0.1 µA - enabling power-efficient banking and pay-TV terminals.

For engineers reviewing the TDA8035HN/C1/S1EL datasheet, TDA8035HN/C1/S1EL pinout, TDA8035HN/C1/S1EL application, or TDA8035HN/C1/S1EL equivalent, key selection criteria include its HVQFN32 package, triple-voltage VCC regulation with 125 mA overload detection, synchronous CLKDIV-based clock scaling, built-in card presence debouncing (4.05 ms), and ESD protection >8 kV on card-side pins.

Technical Context

The TDA8035HN/C1/S1EL integrates a DC-to-DC converter powered separately from VDDP (2.7–5.5 V) to generate precise VCC outputs (5 V/3 V/1.8 V) using SAM/SAP/SBM/SBP capacitor networks and voltage tripler/doubler/follower modes selected by EN_5V/3VN and EN_1.8VN logic states. Its internal oscillator dynamically switches between low-frequency (startup/shutdown) and high-frequency (active session) modes to minimize power.

Card interface operation follows ISO 7816 timing and electrical conventions: three protected bidirectional I/O lines (I/O, AUX1, AUX2) feature active pull-up (>1 mA into 0.9×VCC on 80 pF), 15 mA current limiting, and master/slave edge arbitration; fault detection triggers automatic deactivation on short-circuit, card removal, VDDP/VREG/VDD(INTF) drop, or overheating - signaled via NMOS OFFN interrupt.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Output5 V / 3 V / 1.8 V ±5 %; supports EMV 4.3 (C2 version) and ISO 7816 cards with 65 mA (5 V/3 V) or 35 mA (1.8 V) continuous load
Deep Shutdown Current0.1 µA typical; enables ultra-low-power standby in battery-operated readers
Card Clock FrequencyfXTAL, fXTAL/2, fXTAL/4, or fXTAL/8 up to 20 MHz; synchronous transitions ensure ≥45 % duty cycle and pulse integrity
ESD Protection>8 kV HBM on card-side pins (I/O, RST, VCC, AUX1, CLK, AUX2, PRESN); meets IEC 61000-4-2 system-level robustness requirements
Supply SupervisionInternally fixed thresholds for VDDP (2.25 V typ) and VREG (1.45 V typ); external adjustment via PORADJ resistor bridge for VDD(INTF)
Thermal ProtectionAutomatic deactivation on junction temperature exceeding +125 °C; thermal resistance Rth(j-a) = 55 K/W with 4 thermal vias
Card Presence Debounce4.05 ms built-in delay (1280 × 1/fosc(int)_Low); eliminates mechanical switch bounce without external RC network

Pinout & Package

HVQFN32 package: plastic thermal-enhanced very thin quad flat package, no leads, 32 terminals, body size 5 mm × 5 mm × 0.85 mm (SOT617-7).

Pin/TerminalCircuit RoleDesign Meaning
I/OUC (Pin 1)Host interface data lineBi-directional I/O referenced to VDD(INTF); internal 10 kΩ pull-up enables level-shifting when VCC ≠ VDD(INTF)
CMDVCCN (Pin 3)Activation control inputActive-low command initiating full card activation sequence including VCC ramp, CLK enable, and RST assertion
VCC (Pin 22)Smart card supply outputRegulated 5 V / 3 V / 1.8 V output decoupled by two 220 nF MLCCs; overload detection at ~125 mA
RST (Pin 23)Card reset outputActive-high open-drain output synchronized to activation/deactivation timing; driven after VCC stabilization
CLK (Pin 24)Card clock outputProgrammable frequency (fXTAL/n) with 45–55 % duty cycle; rise/fall times controlled to meet ISO 7816-3 timing
PRESN (Pin 30)Card presence sense inputActive-low input with integrated 4.05 ms debounce; used to trigger emergency deactivation on card removal
OFFN (Pin 10)Fault interrupt outputActive-low NMOS open-drain interrupt signaling short-circuit, overtemperature, supply drop, or card extraction

Key Features

FeatureDesign Value
Triple-voltage VCC regulationSingle IC supports 5 V, 3 V, and 1.8 V ISO 7816 cards without external LDOs or switching regulators
Synchronous clock divisionCLKDIV1/CLKDIV2 control enables glitch-free, duty-cycle-preserving frequency changes during live card sessions
Integrated DC-to-DC converterSeparately powered (VDDP/GNDP) architecture isolates card supply noise from host interface rails
Hardware-accelerated fault responseSub-100 µs deactivation on VCC short-circuit or card removal - faster than software-controlled alternatives
Multi-rail I/O bufferingI/OUC/AUX1UC/AUX2UC referenced to VDD(INTF); I/O/AUX1/AUX2 referenced to VCC - enables mixed-voltage host-card systems

Applications

Banking Card ReaderPay-TV Conditional Access Module

Use Scenario: Embedded reader in ATM or point-of-sale terminal authenticating EMV chip cards.

IC Role / Device Role / Timing Role: Smart card interface controller managing VCC sequencing, CLK generation, RST timing, and fault-safe deactivation per ISO 7816-3.

Use Value: Enables C2-version compliance with EMV 4.3 payment standards while reducing BOM count via integrated DC-DC and supervision.

Use Scenario: Set-top box module reading subscription smart cards for content decryption.

IC Role / Device Role / Timing Role: Low-power card interface maintaining secure communication during intermittent channel tuning events.

Use Value: Deep shutdown current of 0.1 µA extends battery life in portable or always-on STB applications.

Electronic ID TerminalSecure Government Authentication System

Use Scenario: Border control kiosk verifying national eID cards compliant with ICAO 9303.

IC Role / Device Role / Timing Role: ISO 7816-1/2/3/4 interface with ESD-hardened card contacts and tamper-responsive fault detection.

Use Value: >8 kV HBM ESD protection ensures reliability in high-touch public infrastructure environments.

Use Scenario: Military-grade credential reader validating PKI-based smart cards in classified facilities.

IC Role / Device Role / Timing Role: Secure card interface with hardware-enforced deactivation on supply anomaly or thermal event.

Use Value: Automatic emergency deactivation within 250 µs on VDDP drop or overheating prevents side-channel data leakage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar smart card interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SLB9670Trusted Platform Module (TPM) with integrated smart card controller; requires external VCC regulation and lacks DC-DC converterDesigned for PC platform security; not optimized for standalone card readers or low-power embedded useSelect TDA8035HN/C1/S1EL for cost-sensitive, self-contained readers needing integrated power and compact HVQFN32 footprint
ST8024Legacy NXP device; identical pinout but higher active current (8 mA vs. 5 mA typical) and no 1.8 V support or deep shutdown modeLimited to 5 V/3 V cards; unsuitable for modern low-voltage EMV and eID applicationsChoose TDA8035HN/C1/S1EL for new designs requiring 1.8 V compatibility, <0.5 µA shutdown, and enhanced ESD robustness

Compared with SLB9670 and ST8024, the TDA8035HN/C1/S1EL uniquely combines integrated triple-voltage DC-DC conversion, sub-1 µA deep shutdown, and >8 kV card-side ESD in a thermally enhanced 5×5 mm HVQFN32 package - delivering lower system BOM cost and higher reliability for dedicated smart card readers.

Availability

TDA8035HN/C1/S1EL is available at Aetrix Electronics and suitable for banking card readers, pay-TV conditional access modules, electronic ID terminals, and secure government authentication systems requiring stable component supply and long-term lifecycle support.

Supply support for TDA8035HN/C1/S1EL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in smart card, NFC, and secure element technologies.

The TDA8035HN/C1/S1EL belongs to NXP's contact smart card reader IC product line, engineered specifically to replace legacy TDA8024/TDA8034 devices with enhanced power efficiency, broader voltage support, and stronger fault resilience for EMV and eID infrastructure.

FAQ

What is the maximum card clock frequency supported by the TDA8035HN/C1/S1EL?

The TDA8035HN/C1/S1EL supports card clock frequencies up to 20 MHz via its programmable CLKDIV1/CLKDIV2 divider chain, generating fXTAL, fXTAL/2, fXTAL/4, or fXTAL/8 outputs with guaranteed 45–55 % duty cycle and synchronous transition integrity - meeting ISO 7816-3 timing requirements for high-speed smart card protocols.

Does the TDA8035HN/C1/S1EL support 1.8 V smart cards?

Yes, the TDA8035HN/C1/S1EL fully supports 1.8 V smart cards with ±5 % regulation, delivering up to 35 mA continuous current and featuring AC current spike handling of 15 nA/s up to 20 MHz. Its EN_1.8VN control pin enables seamless voltage selection alongside 5 V and 3 V modes - critical for modern eID and EMV applications.

How does the TDA8035HN/C1/S1EL handle card insertion and removal events?

The TDA8035HN/C1/S1EL uses the PRESN pin with built-in 4.05 ms hardware debounce to detect card presence. On insertion, it initiates a controlled activation sequence; on removal during a session, it triggers immediate emergency deactivation - pulling RST low, stopping CLK, and ramping VCC to zero within 250 µs - ensuring data integrity and preventing card damage.

What is the purpose of the OFFN pin on the TDA8035HN/C1/S1EL?

The OFFN pin on the TDA8035HN/C1/S1EL is an active-low NMOS open-drain interrupt output that signals fault conditions including VCC short-circuit, card removal, VDDP/VREG/VDD(INTF) supply drop, or overheating. It features a 10 kΩ internal pull-up to VDD(INTF) and enables host microcontrollers to respond to critical events without polling.

Can multiple TDA8035HN/C1/S1EL devices operate in parallel on the same host bus?

Yes, the TDA8035HN/C1/S1EL includes a Chip Select (CS) digital input (Pin 29) that allows parallel operation of multiple devices. When CS is high, all interface signals function normally; when CS is low, CMDVCCN, RSTIN, CLKDIV1/2, and EN pins are latched, and I/OUC/AUX1UC/AUX2UC enter high-impedance mode - enabling shared bus architectures.

TDA8035HN/C1/S1EL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Applications:
-
Interface:
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Voltage - Supply:
-
Supplier Device Package:
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TDA8035HN/C1/S1EL FAQ

1.How can I place an order for TDA8035HN/C1/S1EL through Aetrix?

Please submit a Request for Quotation (RFQ) for TDA8035HN/C1/S1EL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TDA8035HN/C1/S1EL reliable?

The price and inventory of TDA8035HN/C1/S1EL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA8035HN/C1/S1EL is usually 5 days.

3.What payment methods are accepted for TDA8035HN/C1/S1EL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA8035HN/C1/S1EL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TDA8035HN/C1/S1EL?

TDA8035HN/C1/S1EL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TDA8035HN/C1/S1EL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TDA8035HN/C1/S1EL?

For technical support, including TDA8035HN/C1/S1EL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA8035HN/C1/S1EL requirements.

6.How does Aetrix verify that TDA8035HN/C1/S1EL is sourced from the original manufacturer or authorized distributors?

All TDA8035HN/C1/S1EL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA8035HN/C1/S1EL meets industry standards.

7.What is the process for return or replacement of TDA8035HN/C1/S1EL?

All TDA8035HN/C1/S1EL units undergo pre-shipment inspection (PSI). If there is an issue with TDA8035HN/C1/S1EL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TDA8035HN/C1/S1EL part is unused and in its original packaging.

Return procedure for TDA8035HN/C1/S1EL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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