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NXP Semiconductors TDA8035HN/C2/S1J

Part No.:
TDA8035HN/C2/S1J
Manufacturer:
NXP Semiconductors
Category:
Specialized
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixTDA8035HN/C2/S1J.pdf
Description:
IC INTFACE SPECIALIZED 32HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,999

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Product details

Overview

TDA8035HN/C2/S1J from NXP Semiconductors is a highly integrated, low-power smart card interface IC designed for ISO 7816-compliant contact readers. It delivers regulated 5 V / 3 V / 1.8 V card supply (VCC), supports up to 20 MHz card clock generation, provides thermal/short-circuit protection on all card contacts, and achieves deep shutdown current as low as 0.1 µA - enabling power-efficient banking and payment terminals.

For engineers reviewing the TDA8035HN/C2/S1J datasheet, TDA8035HN/C2/S1J pinout, TDA8035HN/C2/S1J application, or TDA8035HN/C2/S1J equivalent, key selection considerations include its HVQFN32 package, EMV 4.3 compliance (C2 version), triple-voltage card supply capability, integrated DC-DC converter with VDDP input range of 2.7–5.5 V, and hardware-triggered activation/deactivation sequences.

Technical Context

The TDA8035HN/C2/S1J implements a dual-domain architecture: VDDP powers the DC-DC converter and internal regulators (VREG = 1.8 V), while VDD(INTF) supplies the host interface logic. Its clock circuitry auto-detects external clock or crystal source on XTAL1/XTAL2 and supports synchronous frequency division (fXTAL, /2, /4, /8) via CLKDIV1/CLKDIV2 pins.

Card I/O protection includes per-contact short-circuit detection, ESD tolerance >8 kV (HBM) on card pins, and filtered overload detection (~125 mA). Activation/deactivation is fully hardware-controlled via CMDVCCN, with built-in debouncing (4.05 ms) on PRESN and NMOS interrupt signaling on OFFN.

Key Specifications

ParameterValue and Actual Design Meaning
VDDP Supply Range2.7 V to 5.5 V - enables direct connection to common system rails without LDO pre-regulation
VCC Output Options5 V ±5 %, 3 V ±5 %, or 1.8 V ±5 % - selectable via EN_5V/3VN and EN_1.8VN pins for multi-standard card support
Deep Shutdown Current0.1 µA typical - extends battery life in portable card readers during idle periods
Card Clock FrequencyUp to 20 MHz with synchronous division (fXTAL, /2, /4, /8) - meets ISO 7816-3 timing requirements for high-speed transactions
ESD Protection>8 kV HBM on card pins (I/O, RST, VCC, AUX1, CLK, AUX2, PRESN) - eliminates need for external TVS diodes in most designs
EMV ComplianceEMV 4.3 certified (C2 version only) - satisfies security certification requirements for payment terminals
Thermal ShutdownIntegrated thermal protection with automatic deactivation - prevents latch-up and ensures safe operation under fault conditions

Pinout & Package

HVQFN32 package: plastic thermal-enhanced very thin quad flat no-lead package, 5 mm × 5 mm × 0.85 mm body, 32 terminals, exposed thermal pad.

PinCircuit RoleDesign Meaning
I/OUC (Pin 1)Host interface I/O lineBi-directional data path between host MCU and TDA8035HN/C2/S1J; internal 10 kΩ pull-up to VDD(INTF)
CMDVCCN (Pin 3)Activation trigger inputActive-low command initiating full card power-up sequence including VCC ramp, CLK enable, and RST assertion
VCC (Pin 22)Smart card supply outputRegulated 5 V / 3 V / 1.8 V output decoupled by two 220 nF MLCCs; current-limited to 65 mA (5 V/3 V) or 35 mA (1.8 V)
RST (Pin 23)Card reset outputActive-high reset signal delivered directly to C2 contact; synchronized to activation timing window
CLK (Pin 24)Card clock outputProgrammable-frequency clock (up to 20 MHz) delivered to C3 contact; duty cycle guaranteed 45–55 %
PRESN (Pin 30)Card presence sense inputActive-low mechanical switch input with integrated 4.05 ms debounce - eliminates false insertion/removal detection
OFFN (Pin 10)Fault interrupt outputOpen-drain NMOS output signaling card removal, short-circuit, overtemperature, or supply drop; pulled up internally to VDD(INTF)

Key Features

FeatureDesign Value
Triple-voltage card supply generationSingle IC supports 5 V, 3 V, and 1.8 V ISO 7816 cards without external regulators or voltage translators
Hardware-automated activation/deactivationFull sequence (VCC ramp, CLK start, RST assert/deassert, I/O enable/disable) triggered by CMDVCCN edge - reduces host firmware complexity
Integrated DC-DC converterGenerates VCC from 2.7–5.5 V VDDP input using SAM/SAP/SBM/SBP capacitors - eliminates need for external boost/buck converters
Three protected bidirectional I/O linesI/O, AUX1, AUX2 each provide 15 mA current limiting, short-circuit protection, and 1.5 MHz max data rate - compliant with ISO 7816-3 electrical specs
EMV 4.3 certification (C2 version)Meets stringent security and interoperability requirements for payment systems - accelerates terminal certification cycles

Applications

Banking Card ReaderEMV Payment Terminal

Use Scenario: Desktop or portable device reading credit/debit cards in financial institutions or point-of-sale environments.

IC Role / Device Role / Timing Role: Smart card interface controller managing VCC regulation, clock generation, reset sequencing, and fault-safe deactivation per ISO 7816-3.

Use Value: Enables single-chip support for legacy 5 V, transitional 3 V, and modern 1.8 V cards - reducing BOM count and qualification effort.

Use Scenario: Secure payment terminal processing chip-based credit cards in retail, transit, or unattended kiosks.

IC Role / Device Role / Timing Role: EMV-certified interface IC handling secure power delivery, clock synchronization, and real-time fault response during transaction sessions.

Use Value: Built-in EMV 4.3 compliance (C2 version) shortens time-to-market for certified payment hardware.

Pay-TV Conditional Access ModuleGovernment ID Reader

Use Scenario: Set-top box or media gateway authenticating subscriber smart cards for content decryption.

IC Role / Device Role / Timing Role: Low-power card interface ensuring reliable communication during intermittent card insertions and extended standby periods.

Use Value: Deep shutdown current of 0.1 µA minimizes system-level quiescent draw - critical for always-on consumer electronics.

Use Scenario: National ID, ePassport, or driver's license reader used in border control, civil registration, or identity verification services.

IC Role / Device Role / Timing Role: High-reliability interface IC providing ESD-hardened I/O, thermal protection, and deterministic activation timing for secure document authentication.

Use Value: >8 kV HBM ESD rating on card pins eliminates external protection components - improving PCB layout density and field robustness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar smart card interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SLB9670VQ2.0Trusted Platform Module (TPM) with integrated smart card controller; requires external VCC regulator; no native EMV 4.3 certificationDesigned for PC/platform security, not dedicated card readers; lacks hardware activation sequencing and card-side ESD hardeningSelect only if TPM functionality is required alongside card interface; not a functional replacement for TDA8035HN/C2/S1J in reader designs
TDA8024HN/C1Predecessor IC; supports only 5 V card supply; no 1.8 V mode; higher active current (typ. 8 mA vs. 5 mA); lacks EMV 4.3 complianceLegacy banking terminals where 5 V-only cards are sufficient; no support for modern low-voltage cards or EMV certificationUse for cost-sensitive retrofits where 5 V-only operation and absence of EMV 4.3 are acceptable

Compared with SLB9670VQ2.0 and TDA8024HN/C1, the TDA8035HN/C2/S1J uniquely combines triple-voltage card supply, EMV 4.3 certification, sub-µA deep shutdown, and hardware-automated activation - making it the optimal choice for new-generation secure, low-power, multi-standard smart card readers.

Availability

TDA8035HN/C2/S1J is available at Aetrix Electronics and suitable for banking card readers, EMV payment terminals, Pay-TV conditional access modules, and government ID readers requiring stable component supply and long-term lifecycle support.

Supply support for TDA8035HN/C2/S1J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in smart card, NFC, and secure element technologies.

The TDA8035HN/C2/S1J belongs to NXP's contact smart card reader IC product line, engineered specifically to replace legacy interfaces like TDA8024 while delivering lower power, broader voltage support, and EMV 4.3 certification for next-generation payment and identification systems.

FAQ

What is the primary function of the TDA8035HN/C2/S1J in a smart card system?

The TDA8035HN/C2/S1J serves as a complete ISO 7816-compliant smart card interface controller. It generates regulated 5 V / 3 V / 1.8 V supply (VCC) for the card, produces precise clock signals up to 20 MHz, manages reset sequencing, handles bidirectional data transfer across three protected I/O lines, and executes automatic hardware-triggered activation and deactivation - all within a single HVQFN32 package. The TDA8035HN/C2/S1J integrates these functions to eliminate discrete regulators, oscillators, and protection components.

How does the TDA8035HN/C2/S1J achieve EMV 4.3 compliance?

The TDA8035HN/C2/S1J achieves EMV 4.3 compliance specifically in its C2 version (denoted in the part number), which has been validated against the EMVCo Contact Interface Specification v4.3 for electrical behavior, fault response, timing accuracy, and security features such as short-circuit and thermal protection. This certification applies only to the C2 variant - other versions like C1 lack this qualification. The TDA8035HN/C2/S1J implements mandatory EMV timing windows, controlled VCC ramp rates, and filtered overload detection (~125 mA) to meet the standard's robustness requirements.

What are the key differences between TDA8035HN/C2/S1J and its predecessor TDA8024?

The TDA8035HN/C2/S1J improves upon the TDA8024 with triple-voltage card supply (5 V / 3 V / 1.8 V vs. 5 V only), 30% lower active current (5 mA vs. ~7–8 mA), deep shutdown current reduced to 0.1 µA (vs. ~1 µA), integrated DC-DC converter eliminating external inductors, EMV 4.3 certification (C2 version), and enhanced ESD protection (>8 kV HBM on card pins). Software compatibility is maintained, allowing drop-in firmware reuse in many cases. The TDA8035HN/C2/S1J also adds hardware-controlled activation via CMDVCCN, simplifying host MCU code.

Can the TDA8035HN/C2/S1J operate with a 2.7 V system supply?

Yes, the TDA8035HN/C2/S1J supports a VDDP supply range of 2.7 V to 5.5 V, making it compatible with 2.7 V battery-powered or low-voltage system rails. At 2.7 V VDDP, the DC-DC converter operates in tripler mode for 5 V VCC output or doubler mode for 3 V/1.8 V outputs - maintaining full functionality. However, VDD(INTF) must remain within its specified 1.6–3.6 V range, typically supplied separately from a stable 3.3 V rail. The TDA8035HN/C2/S1J's ability to function down to 2.7 V VDDP enables use in energy-constrained portable readers without intermediate regulation.

What role does the OFFN pin play in fault handling for the TDA8035HN/C2/S1J?

OFFN is an open-drain NMOS interrupt output that signals fault conditions during active card sessions: short-circuit on VCC, card removal, VDDP/VDD(INTF)/VREG undervoltage, or overheating. When a fault occurs, OFFN pulls low to alert the host MCU, triggering immediate emergency deactivation. In standby, OFFN reflects card presence (high = card inserted, after debounce). Its internal 10 kΩ pull-up to VDD(INTF) ensures defined logic levels without external components. This direct hardware fault signaling allows the TDA8035HN/C2/S1J to respond within microseconds - critical for protecting both the IC and the smart card.

TDA8035HN/C2/S1J Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
-
Interface:
Analog
Voltage - Supply:
2.7V ~ 5.5V
Supplier Device Package:
32-HVQFN (5x5)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

TDA8035HN/C2/S1J FAQ

1.How can I place an order for TDA8035HN/C2/S1J through Aetrix?

Please submit a Request for Quotation (RFQ) for TDA8035HN/C2/S1J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TDA8035HN/C2/S1J reliable?

The price and inventory of TDA8035HN/C2/S1J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA8035HN/C2/S1J is usually 5 days.

3.What payment methods are accepted for TDA8035HN/C2/S1J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA8035HN/C2/S1J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TDA8035HN/C2/S1J?

TDA8035HN/C2/S1J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TDA8035HN/C2/S1J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TDA8035HN/C2/S1J?

For technical support, including TDA8035HN/C2/S1J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA8035HN/C2/S1J requirements.

6.How does Aetrix verify that TDA8035HN/C2/S1J is sourced from the original manufacturer or authorized distributors?

All TDA8035HN/C2/S1J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA8035HN/C2/S1J meets industry standards.

7.What is the process for return or replacement of TDA8035HN/C2/S1J?

All TDA8035HN/C2/S1J units undergo pre-shipment inspection (PSI). If there is an issue with TDA8035HN/C2/S1J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TDA8035HN/C2/S1J part is unused and in its original packaging.

Return procedure for TDA8035HN/C2/S1J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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