My Inquiry
My Account
NXP Semiconductors TDA8035HN/C2/S1QL
- Part No.:
- TDA8035HN/C2/S1QL
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
TDA8035HN/C2/S1QL.pdf
- Description:
- IC INTFACE SPECIALIZED 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,431
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TDA8035HN/C2/S1QL from NXP Semiconductors is a highly integrated, low-power smart card interface IC designed for ISO 7816-compliant contact readers. It delivers regulated 5 V / 3 V / 1.8 V card supply (±5 %), supports up to 20 MHz card clock generation via CLKDIV1/CLKDIV2, provides thermal/short-circuit protection on all card contacts, and achieves ≤0.1 µA deep shutdown current - enabling power-efficient banking and payment terminals.
For engineers reviewing the TDA8035HN/C2/S1QL datasheet, TDA8035HN/C2/S1QL pinout, TDA8035HN/C2/S1QL application, or TDA8035HN/C2/S1QL equivalent, this page details its HVQFN32 package integration, EMV 4.3 C2-version compliance, DC-DC converter operation modes, fault detection behavior, and smart card I/O buffering with built-in debouncing on PRESN.
Technical Context
The TDA8035HN/C2/S1QL implements a dual-domain power architecture: VDDP (2.7–5.5 V) powers the DC-DC converter and internal regulator (VREG = 1.8 V), while VDD(INTF) (1.6–3.6 V) supplies the host interface logic. Its clock circuitry auto-detects external XTAL1 input or crystal oscillator mode and synchronously divides fXTAL into fXTAL/8, /4, /2, or full rate using two control pins.
Card-side protection includes ESD >8 kV (HBM), filtered overload detection (~120 mA), and automatic deactivation triggered by short-circuit, card removal, VDDP/VREG/VDD(INTF) drop, or overheating. The digital sequencer enforces precise activation/deactivation timing (e.g., tdeact = 35–250 µs) and integrates 4.05 ms hardware debouncing on PRESN.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC output | 5 V / 3 V / 1.8 V ±5 %; supports ISO 7816-3 cards with DC load up to 65 mA (5 V/3 V) or 35 mA (1.8 V) |
| Deep shutdown current | ≤0.1 µA at Tamb = 25 °C; enables ultra-low-power standby in battery-operated readers |
| Card clock frequency | Up to 20 MHz via synchronous division of fXTAL (fXTAL/8 to fXTAL); controlled by CLKDIV1/CLKDIV2 |
| I/O line count & type | Three protected half-duplex bidirectional buffered lines (I/O, AUX1, AUX2) referenced to VCC; 10 kΩ pull-up, 15 mA current limit |
| ESD protection | >8 kV HBM on card pins (I/O, RST, VCC, AUX1, CLK, AUX2, PRESN); meets EMV 4.3 C2 version requirements |
| Package | HVQFN32 (SOT617-7); 5 × 5 × 0.85 mm body; 32-terminal thermally enhanced no-lead package |
| Operating temperature | −25 °C to +85 °C ambient; validated for industrial and payment terminal environments |
Pinout & Package
HVQFN32 (SOT617-7) package: 5 mm × 5 mm × 0.85 mm body, 32 exposed-pad terminals, thermal vias recommended (Rth(j-a) = 55 K/W with 4 vias).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 (I/OUC) | Host interface I/O | Internal 10 kΩ pull-up to VDD(INTF); connects to host microcontroller data bus |
| 3 (CMDVCCN) | Activation trigger | Active-low command initiating card power-up sequence; latched during CS low |
| 5/6 (CLKDIV1/CLKDIV2) | Frequency selection | Binary-coded inputs selecting fXTAL/8, /4, /2, or fXTAL for CLK output (C3) |
| 7/8 (EN_5V/3VN / EN_1.8VN) | VCC voltage select | Logic-controlled selection of 5 V / 3 V (EN_1.8VN high) or 1.8 V (EN_1.8VN low) |
| 10 (OFFN) | Fault interrupt | Active-low NMOS open-drain output signaling short-circuit, card removal, or supply fault |
| 22 (VCC) | Card supply output | Regulated 5 V / 3 V / 1.8 V output decoupled with two 220 nF MLCCs (low ESR) |
| 23–24 (RST / CLK) | Card control signals | Direct drive to ISO 7816 C2 (reset) and C3 (clock) contacts; synchronized to activation sequence |
| 30 (PRESN) | Card presence sense | Active-low input with integrated 4.05 ms hardware debounce; triggers emergency deactivation on true/false transition |
Key Features
| Feature | Design Value |
|---|---|
| EMV 4.3 C2 compliance | Validated for payment systems requiring secure card interface with fault-tolerant activation/deactivation |
| Multi-voltage card supply | Single IC supports 5 V, 3 V, and 1.8 V smart cards via software-configurable EN pins and DC-DC converter topology |
| Auto-sensing clock source | Detects external clock on XTAL1 or crystal on XTAL1/XTAL2 without configuration pin - reduces host GPIO usage |
| Integrated card protection | Thermal shutdown, short-circuit detection, >8 kV HBM ESD, and filtered 120 mA overload detection prevent false deactivations |
| Low-power sequencing | Deep shutdown (0.1 µA) and shutdown (300–500 µA) modes minimize quiescent consumption between transactions |
Applications
| Pay TV Conditional Access | EMV Payment Terminals |
|---|---|
|
Use Scenario: Secure decryption of encrypted broadcast streams using embedded Java Card applets. IC Role / Device Role / Timing Role: Smart card interface IC managing VCC, CLK, RST, and I/O with EMV 4.3 C2–compliant fault handling and activation timing. Use Value: Enables tamper-resistant content access via ISO 7816–compliant card communication while maintaining <0.1 µA standby draw for always-on set-top boxes. |
Use Scenario: Chip-and-PIN transaction processing in countertop or portable POS terminals. IC Role / Device Role / Timing Role: Primary card interface IC delivering regulated 3 V/1.8 V supply, 5 MHz card clock, and real-time short-circuit detection per EMV 4.3. Use Value: Guarantees certified payment session integrity with automatic deactivation on card removal or overcurrent - meeting PCI PTS v6.0 electrical safety requirements. |
| Banking Card Readers | Government ID Systems |
|
Use Scenario: High-reliability reading of financial cards in ATM front-ends and kiosk-based banking services. IC Role / Device Role / Timing Role: Contact reader controller providing thermal protection, 200 ms max deactivation time, and 4.05 ms PRESN debounce for mechanical switch noise immunity. Use Value: Eliminates false card-present signals and ensures robust operation across 100,000+ insertion cycles in unattended environments. |
Use Scenario: ePassport and national ID card authentication in border control and civil registration systems. IC Role / Device Role / Timing Role: Secure interface IC supporting BAC (Basic Access Control) and PACE protocols with ISO 7816–3 timing compliance. Use Value: Delivers certified interoperability with ICAO TR 31/32–compliant cards via precise CLK duty cycle (45–55 %) and controlled VCC ramp (t2 = t1 + 3T/2). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar smart card interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SLB9670 | TPM 2.0 co-processor with integrated smart card interface; requires external VCC regulation; no DC-DC converter | Targeted at trusted platform modules where cryptographic acceleration is primary; lacks standalone reader functionality | Select SLB9670 only when combining TPM and card interface in one security chip; not a direct replacement for dedicated reader ICs |
| TDA8024HN/C1 | Predecessor IC; lacks 1.8 V support, higher shutdown current (1 µA), no EMV 4.3 C2 certification, and no deep shutdown mode | Suitable for legacy 5 V/3 V-only readers without low-power or modern payment compliance requirements | Choose TDA8024HN/C1 only for cost-sensitive retrofits where 1.8 V cards and EMV 4.3 are not required |
Compared with SLB9670 and TDA8024HN/C1, the TDA8035HN/C2/S1QL uniquely integrates EMV 4.3 C2–certified DC-DC conversion, 0.1 µA deep shutdown, and hardware PRESN debouncing - making it the only option for new-design, low-power, standards-compliant contact readers.
Availability
TDA8035HN/C2/S1QL is available at Aetrix Electronics and suitable for Pay TV conditional access modules, EMV payment terminals, and government ID readers requiring stable component supply, long-term lifecycle support, and certified compliance documentation.
Supply support for TDA8035HN/C2/S1QL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with core expertise in smart card, NFC, and secure element technologies.
The TDA8035 belongs to NXP's contact smart card reader IC product line, engineered specifically for low-power, high-security ISO 7816 interfaces in payment, identification, and conditional access systems - succeeding the TDA8024 with enhanced voltage flexibility and EMV compliance.
FAQ
What is the key compliance distinction of the TDA8035HN/C2/S1QL versus earlier TDA8035 versions?
The TDA8035HN/C2/S1QL is explicitly certified for EMV 4.3 payment systems (C2 version), unlike C1 variants. This includes validated fault detection timing, VCC regulation accuracy (±5 %), and ESD robustness (>8 kV HBM on card pins) required for PCI PTS and EMVCo approval. The C2 designation confirms full conformance testing per EMVCo specification, making TDA8035HN/C2/S1QL suitable for certified payment terminals where C1 versions are insufficient.
How does the TDA8035HN/C2/S1QL manage VCC voltage selection for different smart card types?
The TDA8035HN/C2/S1QL uses two dedicated control pins - EN_5V/3VN and EN_1.8VN - to configure VCC output. When EN_1.8VN is low, VCC = 1.8 V is selected. When EN_1.8VN is high, EN_5V/3VN determines VCC: high = 5 V, low = 3 V. This logic-driven selection eliminates external switching components and allows dynamic reconfiguration by the host MCU during card insertion detection - ensuring correct voltage before activation. The TDA8035HN/C2/S1QL's DC-DC converter automatically adapts topology (voltage tripler/doubler/follower) based on VDDP and target VCC.
What is the function and timing behavior of the OFFN pin on the TDA8035HN/C2/S1QL?
The OFFN pin on the TDA8035HN/C2/S1QL is an active-low NMOS open-drain interrupt output signaling fault conditions including short-circuit, card removal, VDDP/VREG/VDD(INTF) undervoltage, or overheating. During normal operation with CMDVCCN low, OFFN goes low immediately upon fault detection and triggers emergency deactivation. In standby (CMDVCCN high), OFFN reflects card presence (low = absent, high = present after 4.05 ms debounce). Its 10 kΩ internal pull-up to VDD(INTF) simplifies host interfacing without external resistors.
Can the TDA8035HN/C2/S1QL operate with an external clock source instead of a crystal oscillator?
Yes, the TDA8035HN/C2/S1QL supports both external clock input (applied to XTAL1) and crystal oscillator (XTAL1/XTAL2) modes. It auto-detects the source on each CMDVCCN falling edge: if a stable clock is present on XTAL1, the crystal oscillator remains disabled. No configuration pin is needed. External clock operation requires the signal to be applied before CMDVCCN activation, and supports frequencies up to 26 MHz. Duty cycle is guaranteed 48–52 % for fXTAL input, with series 56 pF capacitor recommended.
What thermal and electrical protections does the TDA8035HN/C2/S1QL provide for smart card contacts?
The TDA8035HN/C2/S1QL provides comprehensive card contact protection: thermal shutdown halts operation above safe junction temperature; short-circuit detection disables VCC within microseconds on any card pin (I/O, RST, VCC, AUX1, CLK, AUX2, PRESN); ESD tolerance exceeds 8 kV HBM on all card pins; and filtered overload detection at ~120 mA prevents nuisance deactivation during transient 200 mA spikes. These protections are validated per ISO 7816-3 and EMV 4.3 C2, ensuring reliable operation across 100,000+ card insertions.
TDA8035HN/C2/S1QL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- -
- Interface:
- Analog
- Voltage - Supply:
- 2.7V ~ 5.5V
- Supplier Device Package:
- 32-HVQFN (5x5)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
TDA8035HN/C2/S1QL FAQ
1.How can I place an order for TDA8035HN/C2/S1QL through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA8035HN/C2/S1QL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA8035HN/C2/S1QL reliable?
The price and inventory of TDA8035HN/C2/S1QL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA8035HN/C2/S1QL is usually 5 days.
3.What payment methods are accepted for TDA8035HN/C2/S1QL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA8035HN/C2/S1QL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA8035HN/C2/S1QL?
TDA8035HN/C2/S1QL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA8035HN/C2/S1QL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA8035HN/C2/S1QL?
For technical support, including TDA8035HN/C2/S1QL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA8035HN/C2/S1QL requirements.
6.How does Aetrix verify that TDA8035HN/C2/S1QL is sourced from the original manufacturer or authorized distributors?
All TDA8035HN/C2/S1QL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA8035HN/C2/S1QL meets industry standards.
7.What is the process for return or replacement of TDA8035HN/C2/S1QL?
All TDA8035HN/C2/S1QL units undergo pre-shipment inspection (PSI). If there is an issue with TDA8035HN/C2/S1QL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA8035HN/C2/S1QL part is unused and in its original packaging.
Return procedure for TDA8035HN/C2/S1QL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TDA8035HN/C2/S1QL Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
