My Inquiry
My Account
NXP Semiconductors TDA8037TT/C1J
- Part No.:
- TDA8037TT/C1J
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
TDA8037TT/C1J.pdf
- Description:
- IC INTERFACE SPECIALIZED 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,442
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TDA8037TT/C1J from NXP Semiconductors is a low-power 3 V smart card interface IC designed for ISO/IEC 7816-3 compliant contact smart card readers. It delivers regulated 3 V ±5 % VCC output, thermal/short-circuit protection on all card contacts, and ESD immunity >8 kV (HBM) on card pins. With 250–400 µA shutdown current and integrated debouncing (4.05 ms typ.), it enables power-efficient Pay TV and banking card readers.
For engineers reviewing the TDA8037TT/C1J datasheet, TDA8037TT/C1J pinout, TDA8037TT/C1J application, or TDA8037TT/C1J equivalent, key selection criteria include its TSSOP16 package, 3 V supply domain, 16-pin ISO 7816 reader interface with three protected bidirectional I/O lines (C4/C7/C8), and compatibility with TDA8035/TDA8034 software stacks.
Technical Context
The TDA8037TT/C1J implements a dedicated smart card power and signal interface with an internal 1.8 V regulator, programmable VDDhost supervision via PORADJ, and synchronous clock division (fCLKIN or fCLKIN/2) - though CLKDIV functionality is excluded in the TSSOP16 variant. Its digital sequencer executes precise activation/deactivation sequences (tact = 182–554 µs; tdeact = 35–250 µs) triggered by CMDVCCN and PRESN.
It features dual-domain I/O: card-side signals (I/O, AUX1, AUX2) referenced to VCC with 10 kΩ pull-ups and 15 mA current limiting; host-side signals (I/OUC, AUX1UC, AUX2UC) referenced to VDD with identical pull-ups. Fault detection covers short-circuit, card removal, supply drop (VDD/VREG/VDDhost), and overheating, driving OFFN as NMOS interrupt.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply voltage (VDD) | 3.0–3.6 V - powers internal circuitry and host interface; requires 10 µF + 100 nF decoupling. |
| Card supply (VCC) | 2.85–3.15 V DC at ≤65 mA - regulated 3 V ±5 % output for ISO 7816 C1 contact; decoupled with two 220 nF MLCCs. |
| Shutdown current | 250–400 µA - ultra-low quiescent draw during inactive state, enabling battery-powered readers. |
| ESD protection | >8 kV HBM on card pins (I/O, RST, VCC, AUX1, CLK, AUX2, PRESN) - meets robustness requirements for public-access card terminals. |
| Operating temperature | −25 °C to +85 °C - qualified for industrial and consumer embedded environments including point-of-sale and set-top boxes. |
| Max clock input | 20 MHz on CLKIN - supports high-speed card protocols up to EMV 4.3 and Cisco Smart Card standards. |
| I/O frequency limit | 1 MHz max on card data lines - ensures reliable bit timing for T=0/T=1 protocols under worst-case load. |
Pinout & Package
TDA8037TT/C1J uses the plastic thin shrink small outline package (TSSOP16, SOT403-1), 4.4 mm body width, 0.65 mm pitch, lead-free and RoHS-compliant.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| AUX1UC (1) | Host auxiliary I/O | Bi-directional host interface line with 10 kΩ internal pull-up to VDD; used for extended command/data exchange. |
| I/OUC (2) | Host main I/O | Primary host-side data path (C7-equivalent), referenced to VDD; synchronized with card-side I/O via active pull-up logic. |
| AUX2UC (3) | Host auxiliary I/O | Secondary host auxiliary line with 10 kΩ pull-up to VDD; supports multi-line smart card protocols. |
| CLKIN (4) | External clock input | Accepts 1–20 MHz crystal or oscillator input; must be stable before CMDVCCN assertion to initiate activation. |
| VDD (5) | Main supply | 3.0–3.6 V input powering internal logic, host interface, and supervisors; requires local 10 µF + 100 nF decoupling. |
| OFFN (6) | Fault interrupt output | NMOS open-drain output (10 kΩ pull-up to VDD); asserts LOW on card removal, overcurrent, or supply fault. |
| PRESN (7) | Card presence sense | Active-LOW input with 4.05 ms hardware debounce; detects mechanical insertion/removal of ISO 7816 card. |
| RSTIN (8) | Host reset control | Active-HIGH input triggering card RST assertion; synchronized to internal sequencer for glitch-free reset timing. |
| I/O (9) | Card main I/O | ISO 7816 C7 contact interface, referenced to VCC; 10 kΩ pull-up, 15 mA current limit, 1 MHz max frequency. |
| CMDVCCN (10) | Activation command | Active-LOW input initiating full card power-up sequence (VCC ramp, CLK, RST); must remain stable until completion. |
| AUX2 (11) | Card auxiliary I/O | ISO 7816 C8 contact, referenced to VCC; identical electrical specs to I/O - supports extended protocol handshaking. |
| VCC (12) | Card power output | Regulated 3 V ±5 % output (65 mA continuous, ~125 mA overload threshold); decoupled with dual 220 nF MLCCs. |
| AUX1 (13) | Card auxiliary I/O | ISO 7816 C4 contact, referenced to VCC; enables three-wire card communication beyond basic T=0/T=1. |
| RST (14) | Card reset output | ISO 7816 C2 output, referenced to VCC; 20 mA current limit, <200 ns delay from RSTIN, 0.1 µs rise/fall time. |
| GND (15) | Ground reference | Common return for VDD, VCC, and all I/O; must be low-impedance and separated from noisy digital ground planes. |
| CLK (16) | Card clock output | ISO 7816 C3 output, referenced to VCC; 70 mA drive capability, 45–55 % duty cycle, 10 MHz max frequency. |
Key Features
| Feature | Design Value |
|---|---|
| ISO/IEC 7816-3 compliance | Fully implements physical layer requirements for Class A/B/C cards, including voltage, timing, and contact sequencing. |
| Integrated card presence debounce | Hardware-based 4.05 ms filtering eliminates mechanical switch bounce without MCU firmware overhead. |
| Multi-domain I/O referencing | I/O lines referenced separately to VCC (card side) and VDD (host side), enabling flexible system-level voltage partitioning. |
| Programmable VDDhost supervisor | PORADJ pin allows external resistor bridge to adjust reset threshold for host-supplied VDDhost, supporting custom power architectures. |
| Thermal and short-circuit protection | Automatic deactivation on die temperature >150 °C or VCC overload >125 mA, preventing damage during card faults. |
Applications
| Pay TV Conditional Access | EMV Banking Terminals |
|---|---|
Use Scenario: Integrated into set-top box smart card slots for decryption and subscription validation. IC Role / Device Role / Timing Role: Provides secure 3 V power, ISO 7816 clock/data interface, and fault-safe deactivation during card hot-swap. Use Value: Enables <100 µA standby current and <250 µs deactivation to meet CE/ETSI power and safety mandates. |
Use Scenario: Embedded in portable POS terminals for chip-and-PIN transaction processing. IC Role / Device Role / Timing Role: Manages card activation, clock generation, and ESD-hardened I/O per EMV 4.3 Level 1 requirements. Use Value: Delivers >8 kV HBM ESD protection and 3 V ±5 % VCC regulation to ensure certification compliance and field reliability. |
| Government ID Readers | Secure Access Control Systems |
Use Scenario: Used in national eID card readers for biometric authentication and digital signature verification. IC Role / Device Role / Timing Role: Executes precise ISO 7816 activation timing (tact = 182–554 µs) and supports auxiliary lines (AUX1/AUX2) for extended APDU exchange. Use Value: Guarantees deterministic card power-up and reset sequences required for PKI-based identity assurance workflows. |
Use Scenario: Deployed in physical access readers for corporate campuses and secure facilities. IC Role / Device Role / Timing Role: Interfaces with contact smart cards (e.g., MIFARE DESFire EV3) using three protected bidirectional lines (I/O, AUX1, AUX2). Use Value: Provides short-circuit protection on all card contacts and OFFN-driven fault reporting to prevent unauthorized access during tamper events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar smart card interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDA8035T | Legacy predecessor; higher shutdown current (500 µA typ.), no enhanced ESD (>8 kV), lacks PORADJ pin. | Compatible with same TSSOP16 footprint but lacks VDDhost supervision and modern fault detection granularity. | Select only for legacy design refresh where ESD and power targets are relaxed; not recommended for new EMV 4.3 designs. |
| SLB9670 | Trusted Platform Module (TPM) companion IC; integrates cryptographic engine, not a pure interface IC. | Targets secure boot and attestation, not direct smart card reader interfacing; requires different firmware stack. | Choose only when end application demands hardware-rooted trust - not as a drop-in replacement for TDA8037TT/C1J's reader functions. |
Compared with TDA8037TT/C1J, TDA8035T offers lower integration and higher power, while SLB9670 shifts focus from physical interface to cryptographic co-processing - making TDA8037TT/C1J the optimal choice for cost-sensitive, standards-compliant contact reader designs requiring low quiescent current and robust fault handling.
Availability
TDA8037TT/C1J is available at Aetrix Electronics and suitable for Pay TV conditional access modules, EMV banking terminals, and government ID readers requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for TDA8037TT/C1J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in smart card and secure element technologies.
The TDA8037 series belongs to NXP's contact smart card reader IC product line, engineered specifically for low-power, high-reliability ISO 7816 interfaces in payment, identification, and conditional access systems.
FAQ
What is the primary function of the TDA8037TT/C1J in a smart card system?
The TDA8037TT/C1J serves as a dedicated contact smart card interface IC that manages power delivery (3 V ±5 % VCC), clock generation (up to 10 MHz), and bidirectional data communication (I/O, AUX1, AUX2) per ISO/IEC 7816-3. It executes automatic activation/deactivation sequences, provides >8 kV HBM ESD protection on card pins, and monitors faults including short-circuit, card removal, and supply drop - all critical for secure, standards-compliant reader operation.
Does the TDA8037TT/C1J support clock division (e.g., fCLKIN/2) like the SO28 version?
No, the TDA8037TT/C1J in TSSOP16 package does not support clock division. The CLKDIV pin is not implemented in this variant, as confirmed in Section 2.2 and Table 4 of the datasheet, which explicitly states "with SO28 package only" for CLKDIV functionality. The TDA8037TT/C1J outputs CLK at the same frequency as CLKIN (1–20 MHz), with no internal division capability.
How does the TDA8037TT/C1J handle card presence detection and debounce?
The TDA8037TT/C1J uses the PRESN pin as an active-LOW card presence input with integrated hardware debounce of 4.05 ms (typical), derived from the low-frequency internal oscillator (300 kHz). This eliminates the need for external RC filters or MCU polling, ensuring reliable detection of mechanical card insertion/removal while suppressing switch bounce - a requirement for certified EMV and eID readers.
What are the key differences between TDA8037TT/C1J and TDA8037T (SO28)?
The TDA8037TT/C1J (TSSOP16) lacks CLKDIV, CS, PORADJ, and TEST pins present in the SO28 variant; it supports only basic parallel interface operation without chip select or external VDDhost threshold adjustment. Its thermal resistance is higher (160 °C/W vs. 69 °C/W), limiting maximum ambient temperature in high-power-density layouts. Both share identical core functionality: 3 V regulation, I/O protection, and ISO 7816 timing.
Can the TDA8037TT/C1J be used in EMV 4.3 Level 1 certified terminals?
Yes, the TDA8037TT/C1J is explicitly stated in the datasheet as compliant with EMV 4.3 payment systems. Its design meets critical Level 1 requirements: regulated 3 V ±5 % VCC output, >8 kV HBM ESD on card contacts, controlled activation/deactivation timing (tact/tdeact within spec), and short-circuit/overheat protection - all validated per EMVCo test plans for contact reader ICs.
TDA8037TT/C1J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Smart Card
- Interface:
- -
- Voltage - Supply:
- 3.3V
- Supplier Device Package:
- 16-TSSOP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
TDA8037TT/C1J FAQ
1.How can I place an order for TDA8037TT/C1J through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA8037TT/C1J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA8037TT/C1J reliable?
The price and inventory of TDA8037TT/C1J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA8037TT/C1J is usually 5 days.
3.What payment methods are accepted for TDA8037TT/C1J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA8037TT/C1J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA8037TT/C1J?
TDA8037TT/C1J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA8037TT/C1J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA8037TT/C1J?
For technical support, including TDA8037TT/C1J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA8037TT/C1J requirements.
6.How does Aetrix verify that TDA8037TT/C1J is sourced from the original manufacturer or authorized distributors?
All TDA8037TT/C1J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA8037TT/C1J meets industry standards.
7.What is the process for return or replacement of TDA8037TT/C1J?
All TDA8037TT/C1J units undergo pre-shipment inspection (PSI). If there is an issue with TDA8037TT/C1J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA8037TT/C1J part is unused and in its original packaging.
Return procedure for TDA8037TT/C1J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TDA8037TT/C1J Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
