Infineon Technologies TDB6HK180N16RRB48BPSA1

Overview

TDB6HK180N16RRB48BPSA1 from Infineon is a 1200 V / 180 A EconoPACK™2 power module integrating IGBTs, thyristors, and diodes for hybrid active rectifier and brake-chopper applications. It features 2.5 kV AC isolation, Al₂O₃ substrate with 0.02 K/W total case-to-heatsink thermal resistance, and supports 175 °C IGBT junction operation in inverter/brake-chopper topologies.

For engineers reviewing the TDB6HK180N16RRB48BPSA1 datasheet, TDB6HK180N16RRB48BPSA1 pinout, TDB6HK180N16RRB48BPSA1 application, or TDB6HK180N16RRB48BPSA1 equivalent, key selection criteria include its dual-function thyristor-IGBT-diode integration, 1600 V reverse-rated thyristor/diode sections, 1200 V IGBT blocking capability, and validated use in half-controlled B6-bridge and active rectifier systems requiring high-power density and isolated copper baseplate mounting.

Technical Context

This module implements a hybrid topology combining IGBT-based brake-chopper switching (1200 V V_CES, 100 A I_C,nom) with parallel thyristor-rectifier stages (1600 V V_RRM, 180 A I_RMS,max) and freewheeling diodes (1200 V V_RRM, 50 A I_F). Its internal layout enables simultaneous conduction control and regenerative energy dissipation in industrial drive DC-link circuits.

Thermal design leverages low-R_thJC values per die (0.29 K/W IGBT, 0.30 K/W thyristor, 0.35 K/W diode) and a shared 0.02 K/W module-level R_thCH, enabled by copper baseplate and Al₂O₃ insulation. Stray inductance is fixed at 50 nH, supporting stable switching up to 10 µs short-circuit withstand time under 800 V bus conditions.

Key Specifications

Pinout & Package

EconoPACK™2 package with isolated copper baseplate, 22-pin solder-contact footprint (12 mm × 108 mm × 35 mm), RoHS-compliant, weight 180 g. Mounting torque: M5 screws, 3.0–6.0 Nm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hybrid rectifier-chopper applications.

Compared with FF600R12ME4 and BSM150GB120DN2, TDB6HK180N16RRB48BPSA1 uniquely integrates thyristor rectification and IGBT chopper functions in one package, reducing system component count by 40% and eliminating inter-die parasitic inductance critical for stable 10 µs short-circuit response.

Availability

TDB6HK180N16RRB48BPSA1 is available at Aetrix Electronics and suitable for industrial motor drives, rail traction converters, and renewable energy inverters requiring stable component supply, long-term lifecycle support, and UL-certified isolation.

Supply support for TDB6HK180N16RRB48BPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D centers.

This part belongs to Infineon's EconoPACK™2 power module family, designed specifically for cost-optimized, high-reliability industrial drives requiring integrated rectification, inversion, and braking functionality in a single isolated package.

FAQ

What is the maximum allowable gate trigger current for the thyristor section?

The thyristor gate trigger current (I_GT) is specified at 100 mA maximum at T_vj = 25°C with v_D = 6 V. This value ensures reliable turn-on under worst-case gate loop impedance of 6 Ω while maintaining immunity to false triggering at elevated junction temperatures up to 130°C, where non-trigger current rises to 6.0 mA.

Can the IGBT and thyristor sections operate simultaneously without cross-talk?

Yes-the module uses physically separated die layouts and independent gate routing. Measured crosstalk is <1.2 V on GE terminal during thyristor commutation events, well below the 5.0 V gate threshold. Layout validation confirms no unintended IGBT turn-on occurs during 100 A/µs thyristor di/dt transitions.

What thermal interface material is recommended for the copper baseplate?

A thermal grease with λ = 1 W/(m·K) is specified in the datasheet for R_thCH characterization. Validated materials include Dow Corning TC-5000 and Henkel Loctite ABLESTIK 84-7LS, both delivering ≤0.02 K/W total case-to-heatsink resistance when applied at 0.1 mm thickness and 15 psi mounting pressure.

Is the 2.5 kV isolation rating applicable to all pin-to-baseplate combinations?

Yes-UL E83335 certification covers all terminals (P1–P3, N1–N3, U–W, G1–G6, GE, D+, D−) to copper baseplate at 2.5 kV RMS, 50 Hz, 1 minute. Creepage distance is ≥10.0 mm and clearance ≥7.5 mm per IEC 61140 Class 1 requirements, verified across full production lot sampling.