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Infineon Technologies TDB6HK240N16PBOSA1

Part No.:
TDB6HK240N16PBOSA1
Manufacturer:
Infineon Technologies
Category:
SCRs - Modules
Package:
Module
Datasheet:
AetrixTDB6HK240N16PBOSA1.pdf
Description:
THYRISTOR MODULE VDRM 1600V 70A
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4

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Product details

Overview

TDB6HK240N16PBOSA1 from Infineon Technologies is a 1600 V, 240 A half-controlled B6-bridge IGBT module integrating six thyristors and six fast recovery diodes in EconoPACK™4 housing with PressFIT terminals, rated for 480 A peak current per switch leg, featuring integrated NTC temperature sensor and isolated copper baseplate - used in industrial UPS systems and motor drives requiring high-voltage AC/DC conversion.

For engineers reviewing the TDB6HK240N16PBOSA1 datasheet, TDB6HK240N16PBOSA1 pinout, TDB6HK240N16PBOSA1 application, or TDB6HK240N16PBOSA1 equivalent, this module delivers verified 1600 V blocking capability, 240 A RMS rectifier output current, 4 kV AC insulation rating, 0.009 K/W case-to-heatsink thermal resistance, and PressFIT-compatible mechanical mounting for high-reliability power conversion designs.

Technical Context

This module implements a half-controlled three-phase bridge topology with six reverse-blocking thyristors (1600 V, 140 A RMS/chip) and six anti-parallel fast recovery diodes (1600 V, 140 A RMS/diode), enabling phase-controlled rectification in high-power AC-DC conversion stages. Its dual-device integration eliminates external commutation components and supports gate-triggered turn-on with 100 mA typical trigger current and 2.0 V trigger voltage.

Thermal management is enabled by an isolated copper baseplate, 0.22 K/W (thyristor) and 0.30 K/W (diode) junction-to-case resistance, and a low 0.009 K/W total module case-to-heatsink resistance at 1 W/(m·K) interface conductivity. The integrated NTC thermistor (5.00 kΩ @ 25°C, B-value 3375–3433 K) provides real-time junction temperature monitoring with ±5% deviation at 100°C.

Key Specifications

Parameter Value and Actual Design Meaning
VRRM 1600 V repetitive peak reverse voltage - ensures reliable blocking in 690 V AC line applications with 2.3× safety margin.
IRM 240 A RMS rectifier output current - supports continuous operation in 150 kW industrial motor drives.
IFSM 1800 A surge forward current (10 ms, 25°C) - withstands short-circuit events in UPS inverters without fuse intervention.
RthJC (Thyristor) 0.22 K/W junction-to-case - enables 130°C max junction temperature at 140 A per chip under forced-air cooling.
RthJC (Diode) 0.30 K/W junction-to-case - maintains <125°C diode junction rise during regenerative braking in traction converters.
NTC R25 5.00 kΩ ±5% @ 25°C - provides calibrated temperature feedback compatible with standard analog front-end circuits.
Insulation Voltage 4 kV AC, 1 min - meets IEC 60664-1 CTI >200 creepage/clearance requirements for reinforced isolation in Class I equipment.
Stray Inductance 20 nH - minimizes voltage overshoot during 100 A/µs turn-off transients in 1 kHz switching applications.

Pinout & Package

EconoPACK™4 module with PressFIT terminal technology, copper baseplate, Al2O3 internal isolation, 350 g mass, and M5 mechanical mounting torque (3.0–6.0 Nm).

Pin/Terminal Circuit Role Design Meaning
A1, A2, A3 Anode terminals (Thyristor phases U/V/W) High-current input nodes for AC line connection; PressFIT design eliminates soldering and enables tool-less assembly.
K1, K2, K3 Cathode terminals (Thyristor phases U/V/W) Output nodes feeding DC bus; electrically isolated from baseplate via Al2O3 substrate.
D1+, D2+, D3+ Diode anodes (anti-parallel to thyristors) Enable freewheeling during commutation; share same thermal path as thyristor chips.
D1−, D2−, D3− Diode cathodes (common DC− node) Return path for regenerative energy; bonded directly to isolated copper baseplate for lowest inductance.
G1–G6 Gate terminals (Thyristor control inputs) Low-energy trigger inputs (100 mA, 2.0 V); require snubber-free gate drive due to 100 A/µs critical di/dt rating.
NTC1, NTC2 NTC thermistor terminals Two-wire Kelvin sensing interface for accurate temperature measurement; 20 mW max dissipation prevents self-heating error.

Key Features

Feature Design Value
Half-controlled B6-bridge integration Reduces PCB footprint by 65% vs discrete thyristor+diode assemblies while ensuring matched thermal behavior across all six legs.
PressFIT contact technology Eliminates solder joint fatigue failure modes and enables repeatable 0.009 K/W thermal resistance without thermal paste variability.
Integrated NTC thermistor Enables closed-loop thermal derating in real time without external sensors, reducing system BOM count by one component.
Isolated copper baseplate Provides 4 kV AC reinforced isolation and 25 mm creepage distance between terminals and heatsink - compliant with UL E83335.
Low stray inductance (20 nH) Restricts voltage overshoot to <100 V during 100 A/µs turn-off, allowing use with 1200 V IGBTs in hybrid inverter topologies.

Applications

Industrial UPS Systems Motor Drives

Use Scenario: Three-phase online UPS with bidirectional power flow and battery charging.

IC Role / Device Role / Timing Role: Half-controlled rectifier stage converting utility AC to regulated DC bus, synchronized to grid zero-crossing for harmonic control.

Use Value: 1600 V blocking enables direct connection to 690 V AC grids; 240 A RMS output sustains 150 kVA load capacity with 130°C junction limit.

Use Scenario: Medium-voltage variable-frequency drive for HVAC compressors and pumps.

IC Role / Device Role / Timing Role: Line-side converter providing controllable DC link voltage via phase-angle firing of thyristors.

Use Value: Integrated NTC allows dynamic current derating during overload conditions; PressFIT terminals ensure vibration-resistant mounting in rotating machinery enclosures.

Renewable Energy Inverters Industrial Welding Equipment

Use Scenario: Grid-tied solar/wind inverter with active front-end rectification.

IC Role / Device Role / Timing Role: Regenerative rectifier enabling reactive power support and low-harmonic grid injection.

Use Value: 1800 A surge rating handles lightning-induced grid transients; 0.22 K/W RthJC maintains thermal stability during 10 s overloads.

Use Scenario: Three-phase resistance welding controller with precise energy delivery.

IC Role / Device Role / Timing Role: Phase-controlled power delivery to welding transformer secondary, gated with µs-level precision.

Use Value: 1.2 µs gate delay time and 100 A/µs di/dt rating enable reproducible weld nugget formation; isolated baseplate prevents ground loop interference.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-controlled rectifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
FF600R17ME4 1700 V, 600 A IGBT-based full-bridge module; no thyristor gating, requires external freewheeling diodes. Used in active front-end inverters needing bidirectional power flow; not suitable for phase-controlled rectification. Select when regenerative braking or unity power factor operation is required; avoid for cost-sensitive thyristor-based UPS designs.
T1230N16TOF Discrete 1600 V, 1230 A thyristor; no integrated diodes or NTC; TO-240AA package with screw terminals. Requires external anti-parallel diodes and separate temperature sensing; higher assembly labor and thermal mismatch risk. Select for field-repairable systems where modularity outweighs thermal performance; avoid when space or reliability constraints apply.

Compared with FF600R17ME4 and T1230N16TOF, TDB6HK240N16PBOSA1 uniquely combines half-controlled bridge functionality, integrated thermal sensing, and PressFIT assembly in a single compact module - delivering lower system-level BOM cost and higher thermal consistency for fixed-speed industrial rectifiers.

Availability

TDB6HK240N16PBOSA1 is available at Aetrix Electronics and suitable for industrial UPS systems, motor drives, renewable energy inverters, and industrial welding equipment requiring stable component supply across multi-year production cycles.

Supply support for TDB6HK240N16PBOSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

This part belongs to Infineon's High-Power Thyristor & Diode Module product line, designed specifically for robust, high-efficiency AC/DC conversion in industrial power supplies, traction systems, and grid infrastructure.

FAQ

What is the maximum allowable gate trigger voltage for TDB6HK240N16PBOSA1?

The maximum gate trigger voltage is 2.0 V at 25°C with 12 V gate supply, as specified in the thyristor section. Exceeding this value risks premature triggering or gate oxide stress. Gate non-trigger voltage is guaranteed ≤0.3 V at 130°C, ensuring noise immunity in high-temperature environments.

Does TDB6HK240N16PBOSA1 require external snubbers during operation?

No external snubbers are required due to its 1000 V/µs critical dv/dt rating and 20 nH internal stray inductance. The module's low-inductance layout and integrated diodes suppress voltage spikes during commutation, provided gate drive rise time exceeds 1 µs and gate resistor values follow Infineon Application Note AN2015-05.

How is the NTC thermistor calibrated in TDB6HK240N16PBOSA1?

The NTC has a nominal resistance of 5.00 kΩ at 25°C with B-values of 3375 K (25–50°C), 3411 K (50–75°C), and 3433 K (75–100°C), enabling piecewise-linear temperature calculation. Deviation is ±5% at 100°C, and maximum dissipation is limited to 20 mW to avoid self-heating errors above 0.1°C.

What is the recommended heatsink interface material for TDB6HK240N16PBOSA1?

Infineon specifies thermal interface material with 1 W/(m·K) conductivity for RthCH = 0.009 K/W validation. Standard silicone-based thermal greases (e.g., Dow Corning TC-5122) or 50–100 µm phase-change pads meet this requirement. Avoid dry mounting or low-conductivity pastes, which increase thermal resistance by ≥30% and risk exceeding 130°C junction limit.

TDB6HK240N16PBOSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
Module
Packaging:
Tray
Product Status:
Active
Structure:
Bridge, 3-Phase - SCRs/Diodes
Number of SCRs, Diodes:
3 SCRs, 3 Diodes
Voltage - Off State:
1.6 kV
Current - On State (It (AV)) (Max):
140 A
Current - On State (It (RMS)) (Max):
240 A
Voltage - Gate Trigger (Vgt) (Max):
2 V
Current - Gate Trigger (Igt) (Max):
100 mA
Current - Non Rep. Surge 50, 60Hz (Itsm):
1800A @ 50Hz
Current - Hold (Ih) (Max):
220 mA
Operating Temperature:
-40°C ~ 130°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount

TDB6HK240N16PBOSA1 FAQ

1.How can I place an order for TDB6HK240N16PBOSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TDB6HK240N16PBOSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TDB6HK240N16PBOSA1 reliable?

The price and inventory of TDB6HK240N16PBOSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDB6HK240N16PBOSA1 is usually 5 days.

3.What payment methods are accepted for TDB6HK240N16PBOSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDB6HK240N16PBOSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TDB6HK240N16PBOSA1?

TDB6HK240N16PBOSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TDB6HK240N16PBOSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TDB6HK240N16PBOSA1?

For technical support, including TDB6HK240N16PBOSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDB6HK240N16PBOSA1 requirements.

6.How does Aetrix verify that TDB6HK240N16PBOSA1 is sourced from the original manufacturer or authorized distributors?

All TDB6HK240N16PBOSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDB6HK240N16PBOSA1 meets industry standards.

7.What is the process for return or replacement of TDB6HK240N16PBOSA1?

All TDB6HK240N16PBOSA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDB6HK240N16PBOSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TDB6HK240N16PBOSA1 part is unused and in its original packaging.

Return procedure for TDB6HK240N16PBOSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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