Infineon Technologies TDM3885XUMA1

Overview

TDM3885XUMA1 from Infineon is a fully integrated 4 A synchronous buck DC/DC module with embedded 0.68 µH inductor, operating from 4.7 V to 14 V input and delivering 0.5 V to 5.0 V output with ±1.0% reference accuracy. It features 600 kHz fixed switching frequency, 10 µA shutdown current, and Enhanced Stability IPOL engine enabling ceramic-capacitor-only operation without external compensation. Used in server point-of-load rails requiring compact, high-efficiency regulation.

For engineers reviewing the TDM3885XUMA1 datasheet, TDM3885XUMA1 pinout, TDM3885XUMA1 application, or TDM3885XUMA1 equivalent, key selection criteria include its integrated inductor footprint (3.1 mm × 3.8 mm × 2.3 mm), FCCM/DEM mode control via En/FCCM pin, PG open-drain status signaling, OCSET-configurable over-current thresholds, and thermal shutdown at 145 °C with 25 °C hysteresis.

Technical Context

The TDM3885XUMA1 implements an adaptive on-time PWM controller with internal LDO biasing (Vcc derived from PVin), zero-cross detection, and pseudo-constant-frequency operation. Its IPOL architecture eliminates need for external loop compensation while supporting pre-bias startup and soft-start ramp rate of 0.2 mV/µs.

It integrates top and bottom MOSFETs (R_DS(on) = 106.4 mΩ / 33.9 mΩ), bootstrap driver (BOOST–SW), and power-good monitoring (PG) with 85–95% V_FB window. Over-current protection offers three user-selectable thresholds via OCSET pin connection (PGND/Vcc/floating), and thermal shutdown triggers at 145 °C with 25 °C hysteresis.

Key Specifications

Pinout & Package

Package: PG-LGA-15-2, 3.1 mm × 3.8 mm × 2.3 mm, lead-free/halogen-free, RoHS6 compliant. Exposed thermal pad (pins 6, 8, 14, 15) connects directly to PGND plane for optimal thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck regulator applications.

Compared with MPM3683-7 and TPSM84624, TDM3885XUMA1 delivers optimal balance of 4 A capability, ultra-small 3.1×3.8 mm footprint, and 600 kHz operation-making it uniquely suited for dense server and telecom PoL deployments where height (<2.3 mm) and layout simplicity are critical.

Availability

TDM3885XUMA1 is available at Aetrix Electronics and suitable for server and computing power delivery, communications infrastructure DC-DC conversion, and industrial FPGA power management requiring stable component supply and long-term lifecycle support.

Supply support for TDM3885XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

The TDM3885 belongs to Infineon's IPOL (Integrated POL) product line-designed specifically for space-constrained, high-reliability point-of-load applications in datacenter, telecom, and industrial systems where integration, thermal performance, and ease of use are prioritized.

FAQ

What is the recommended input capacitor configuration for TDM3885XUMA1?

Use a minimum 22 µF X5R/X7R ceramic capacitor with ≤5 mΩ ESL placed within 2 mm of PVin and PGND pins. Add a 100 nF high-frequency bypass capacitor adjacent to the same pins. Total input capacitance should be ≥30 µF to limit ripple below 50 mVpp at 4 A load. Avoid tantalum or aluminum electrolytic capacitors due to ESR and lifetime limitations.

How does the OCSET pin configure over-current protection thresholds?

OCSET sets one of three current-limit thresholds: connecting to PGND yields 6.5 A nominal, leaving it floating yields 5.4 A, and connecting to Vcc yields 4.3 A. These values are thermally compensated and measured at the switch node. The setting is latched during startup and remains active until reset by cycling EN or power cycle; no dynamic reconfiguration is supported during operation.

Can TDM3885XUMA1 operate without an external bootstrap capacitor?

No. A 0.1 µF X7R ceramic capacitor must be placed between BOOST and SW pins. This capacitor supplies gate-drive energy for the high-side MOSFET during each switching cycle. Omitting it causes immediate failure of the high-side switch, resulting in no output voltage and potential thermal damage. The capacitor must be located within 1 mm of both pins with low-inductance routing.

Is the AGND pin required to be isolated from PGND on the PCB?

AGND and PGND are internally connected inside the IC but must be joined externally at a single point near the device - typically at the thermal pad or a dedicated star ground node. Separating them creates ground loops that degrade feedback accuracy and cause instability. The datasheet specifies PGND-to-AGND voltage must remain within ±0.3 V; violating this risks reference error and output inaccuracy.