Nexperia USA Inc. TDZ24J,115

Overview

TDZ24J,115 from Nexperia is a single Zener diode in SOD323F (SC-90) surface-mount package, designed for precision voltage regulation and overvoltage protection in space-constrained circuits. It delivers a nominal Zener voltage of 24 V (23.5–24.5 V at I_Z = 5 mA), 250 Ω typical differential resistance, ≤0.05 µA reverse current at 18.9 V, ±150 °C junction temperature rating, and AEC-Q101 qualification for automotive use.

For engineers reviewing the TDZ24J,115 datasheet, TDZ24J,115 pinout, TDZ24J,115 application, or TDZ24J,115 equivalent, this device is selected for low-profile voltage reference, ESD-tolerant clamp design, thermal-stable biasing in sensor interfaces, and transient suppression in 12/24 V automotive subsystems where SOD323F footprint and 500 mW power dissipation are critical constraints.

Technical Context

This Zener operates with a negative temperature coefficient of +16.8 to +18.4 mV/K across 5–10 mA working current, enabling predictable drift compensation in analog references. Its 250 Ω differential resistance ensures stable regulation under load variation, while 80 pF capacitance at 1 MHz supports high-frequency noise filtering without signal distortion.

The device sustains non-repetitive peak reverse power up to 40 W (for TDZ7V5J–TDZ30J series) with 100 µs square-wave pulses, and achieves 25 K/W junction-to-solder-point thermal resistance on FR4 PCB - critical for reliability in thermally dense automotive control modules.

Key Specifications

Pinout & Package

SOD323F (SC-90) plastic surface-mount package: 2.3–2.7 mm length, 1.15–1.35 mm width, 0.25–0.40 mm height, cathode-marked with bar on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener regulation applications.

Compared with BZX384-B24,115 and MMSZ5245B-TP, TDZ24J,115 uniquely combines AEC-Q101 qualification, SOD323F miniaturization, and 250 Ω differential resistance - making it the only option qualified for thermally demanding, space-constrained automotive voltage regulation where long-term parametric stability is mandatory.

Availability

TDZ24J,115 is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor interfaces, portable medical diagnostics, and telecom power sequencing requiring stable component supply, traceable sourcing, and lifecycle continuity.

Supply support for TDZ24J,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, discrete, and MOSFET solutions with focus on efficiency, reliability, and miniaturization.

The TDZxJ series targets automotive and industrial applications needing miniature, AEC-Q101-qualified Zener diodes for voltage reference, regulation, and transient suppression in harsh environments.

FAQ

What is the maximum continuous forward current for TDZ24J,115?

The absolute maximum forward current is 250 mA per the datasheet Limiting Values table. However, sustained operation above 100 mA is discouraged due to thermal limitations - the 500 mW total power dissipation rating implies that at VF ≈ 1.1 V, forward conduction should be limited to ~450 mA only in pulsed conditions, not DC.

How does the temperature coefficient affect regulation accuracy over −40 °C to +125 °C?

At 24 V nominal, the temperature coefficient is +16.8 to +18.4 mV/K. Over a 165 K range (−40 °C to +125 °C), this produces a total drift of approximately +2.77 to +3.04 V - meaning regulation shifts from ~21.2 V at −40 °C to ~27.0 V at +125 °C. Designers must account for this in tolerance budgets.

Can TDZ24J,115 replace TDZ22J in an existing design?

No direct substitution is recommended. TDZ22J has 21.6–22.4 V Zener range and 250 Ω r_dif, while TDZ24J shifts regulation by +1.6 V minimum. This alters clamping thresholds, bias points, and thermal dissipation - requiring revalidation of overvoltage protection margins and reference stability.

What is the recommended PCB pad layout for optimal thermal performance?

The datasheet specifies a 16 mm² tin-plated copper pad for the cathode on single-sided FR4. Use the exact SOD323F reflow footprint (2.1 × 0.6 mm solder lands, 0.95 mm spacing) from Figure 8. Avoid thermal relief on the cathode pad - solid copper connection is required to achieve the stated 25 K/W R_th(j-sp).