NXP Semiconductors TEA1610P/N5,112

Overview

TEA1610P/N5,112 from NXP Semiconductors is a high-voltage DMOS monolithic controller for zero-voltage-switching (ZVS) resonant half-bridge converters. It drives two external MOSFETs, integrates a high-side level shifter and bootstrap diode, delivers 50 % duty cycle via internal ÷2 flip-flop, and supports adjustable dead time (0.37–0.43 µs), min/max bridge frequency (188–550 kHz), and latched shutdown at 2.33 V. It is used in TV/monitor power supplies operating from universal mains.

For engineers reviewing the TEA1610P/N5,112 datasheet, TEA1610P/N5,112 pinout, TEA1610P/N5,112 application, or TEA1610P/N5,112 equivalent, key selection criteria include high-side driver voltage rating (600 V), transconductance error amplifier (330 µA/mV), oscillator current programmability (IFS/IRS pins), and DIP16 package compatibility with legacy board layouts.

Technical Context

The TEA1610P/N5,112 implements a current-controlled oscillator whose frequency is set by external capacitor Cf and programmable charge/discharge currents on IRS and IFS pins - enabling precise tuning of bridge frequency between 188 kHz and 550 kHz. Its internal ÷2 logic ensures exact 50 % duty cycle at the output drivers, critical for ZVS operation in resonant LLC or series-resonant topologies.

It integrates a transconductance error amplifier (gm = 330 µA/mV) that sources current into the IRS pin to modulate oscillator frequency for output voltage regulation. The high-side driver uses an integrated bootstrap supply with built-in diode (V_d(boot) = 1.5–2.1 V) and operates up to 600 V common-mode voltage (V_HS), while undervoltage lockout (V_DD(start) = 12.9–13.9 V) and latched shutdown (V_SD(th) = 2.26–2.40 V) provide robust protection.

Key Specifications

Pinout & Package

DIP16 plastic dual in-line package (SOT38-1), 300 mil body width, 16-pin through-hole mount compatible with standard wave-solder processes and legacy power supply PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar zero-voltage-switching resonant converter controller applications.

Compared with TEA1610T/N5,118, the TEA1610P/N5,112 offers superior thermal dissipation in free-air environments and mechanical robustness for field-serviceable power supplies; versus UCC256301DR, it provides deterministic analog timing, lower BOM count, and proven reliability in cost-sensitive consumer display applications.

Availability

TEA1610P/N5,112 is available at Aetrix Electronics and suitable for TV power supplies, monitor power supplies, and industrial high-voltage power supplies requiring stable component supply, long-term lifecycle support, and legacy DIP16 footprint compatibility.

Supply support for TEA1610P/N5,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer electronics, with core expertise in high-voltage analog and mixed-signal ICs.

The TEA1610 product line was designed specifically for cost-effective, high-efficiency resonant AC-DC power conversion in display and industrial power supplies, emphasizing robustness, programmability, and ease of implementation in ZVS topologies.

FAQ

What is the function of the n.c. pin (Pin 5) on the TEA1610P/N5,112?

Pin 5 is explicitly designated as "not connected" and serves as a high-voltage spacer to ensure adequate creepage distance between adjacent pins under 600 V operating conditions. It has no internal connection and must remain unconnected on the PCB. This design feature maintains isolation integrity in high-side driver circuits where SH (Pin 6) operates at up to 600 V relative to PGND (Pin 4), as confirmed in the official NXP datasheet section 7.2.

How does the TEA1610P/N5,112 achieve zero-voltage switching in a resonant half-bridge?

The TEA1610P/N5,112 achieves ZVS by precisely controlling bridge frequency (188–550 kHz) to track the resonant tank's natural frequency, ensuring MOSFETs switch only when drain-source voltage crosses zero. Its current-controlled oscillator, adjustable dead time (0.37–0.43 µs), and 50 % duty cycle guarantee via internal ÷2 logic collectively enable soft-switching across line/load variations - directly stated in the General Description and Functional Description sections of the NXP datasheet.

Can the TEA1610P/N5,112 be used with a 220 pF oscillator capacitor?

Yes, the TEA1610P/N5,112 supports CF values including 220 pF, as validated in Figure 9 of the NXP datasheet showing measured oscillator frequency vs. IIRS for Cf = 220 pF. This value shifts the operational frequency range downward compared to 100 pF, enabling lower-frequency ZVS operation (e.g., ~200–400 kHz) while maintaining stability - consistent with the f_bridge(min) and f_bridge(max) specifications under varying CF conditions.

What is the purpose of the VREF pin (Pin 16) on the TEA1610P/N5,112?

VREF (Pin 16) provides a precision 2.9–3.1 V reference with −0.3 mV/K temperature coefficient, used to bias the R_dt, R_f(min), and R_∆f resistors that program dead time, minimum frequency, and maximum frequency. Its 1 mA sink capability and low output impedance (<5 Ω) ensure stable current sourcing into these timing networks - a key enabler of accurate, temperature-stable ZVS control as detailed in Sections 8.3–8.5 of the datasheet.

Does the TEA1610P/N5,112 include an integrated bootstrap diode?

Yes, the TEA1610P/N5,112 integrates a bootstrap diode with a forward voltage drop of 1.5–2.1 V at 5 mA, as specified in Table 6 of the NXP datasheet. This eliminates the need for an external diode in the high-side floating supply path, reducing component count and PCB area - a confirmed feature listed in the "Features" section and functional block diagram (Figure 2).