NXP Semiconductors TEA1610T/N6/DG,518
- Part No.:
- TEA1610T/N6/DG,518
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Supply Controllers, Monitors
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TEA1610T/N6/DG,518.pdf
- Description:
- IC CTLR SMPS SW SO16
- Quantity:
- Payment:

- Shipping:

Inventory:4,539
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TEA1610T/N6/DG,518 from NXP Semiconductors is a high-voltage zero-voltage-switching (ZVS) resonant converter controller implemented in DMOS process, designed to drive two discrete MOSFETs in half-bridge topology. It integrates a level-shift circuit, transconductance error amplifier, latched shutdown, and oscillator with programmable frequency range (188–550 kHz bridge frequency), enabling stable operation across varying mains voltages in TV/monitor power supplies.
For engineers reviewing the TEA1610T/N6/DG,518 datasheet, TEA1610T/N6/DG,518 pinout, TEA1610T/N6/DG,518 application, or TEA1610T/N6/DG,518 equivalent, key selection criteria include high-side driver voltage rating (600 V), adjustable dead time via Rdt, 50 % duty cycle accuracy via internal ÷2 flip-flop, undervoltage lockout (13.4 V start, 9.4 V stop), and bootstrap diode integration for floating supply generation.
Technical Context
The TEA1610T/N6/DG,518 employs a current-controlled oscillator whose frequency is set by external capacitor Cf and charge/discharge currents at IRS and IFS pins, with bridge frequency precisely half the oscillator frequency due to internal divide-by-two logic. Its transconductance error amplifier (gm = 330 µA/mV) delivers up to 0.5 mA output current to regulate frequency-based output voltage.
Startup initiates with low-side MOSFET conduction only, charging the bootstrap capacitor (Cboot) before full half-bridge operation begins at VDD ≥ 13.4 V; shutdown is latched at SD = 2.33 V, clamping VDD to 12.0 V and requiring VDD ≤ 5.3 V to reset. The IC supports ZVS operation through precise dead-time control (0.37–0.43 µs) and high-side driver capability up to 600 V with −225 mA source / 300 mA sink current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bridge Frequency Range | 188–550 kHz - sets resonant tank switching rate; minimum ensures stable ZVS, maximum enables compact magnetics |
| High-Side Driver Voltage | 0–600 V - directly interfaces with high-voltage half-bridge switches without external level-shifting components |
| Transconductance (gm) | 330 µA/mV - defines error amplifier gain for precise feedback loop response in voltage regulation |
| Dead Time | 0.37–0.43 µs - prevents shoot-through in half-bridge by ensuring non-overlapping gate drive signals |
| Undervoltage Lockout (UVLO) | 13.4 V start / 9.4 V stop - provides hysteresis (4.0 V) to avoid oscillation near threshold during brownout conditions |
| Shut-down Threshold | 2.33 V (±70 mV) - enables precise overvoltage protection via external resistor divider on SD pin |
| Reference Voltage (VREF) | 3.0 V (±0.1 V) - stable 3 V reference for biasing Rdt, Rf(min), and R∆f resistors in oscillator tuning network |
Pinout & Package
TEA1610T/N6/DG,518 is housed in SO16 (SOT109-2) package: plastic small outline, 16 leads, 3.9 mm body width, low stand-off height - suitable for automated SMT assembly and high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I− (Pin 1) | Error amplifier inverting input | Connects to regulated output feedback node; forms precision voltage error sensing with I+ |
| I+ (Pin 2) | Error amplifier non-inverting input | Accepts stable reference (e.g., from TL431); differential input sets regulation setpoint |
| VCO (Pin 3) | Error amplifier output | Current-source output drives IRS pin; frequency modulation input for closed-loop regulation |
| PGND (Pin 4) | Power ground | Low-impedance return path for high-current gate drivers; must be separated from SGND |
| n.c. (Pin 5) | Not connected | High-voltage spacer; no internal connection - leave unconnected and unstubbed |
| SH (Pin 6) | High-side switch source | Connects to source of high-side MOSFET; referenced to floating VDD(F) supply |
| GH (Pin 7) | High-side gate driver output | Drives gate of high-side MOSFET; rated for 600 V common-mode voltage and −225 mA source |
| VDD(F) (Pin 8) | Floating supply for high-side driver | Powered by bootstrap capacitor; enables high-side gate drive without isolated supply |
| SGND (Pin 9) | Signal ground | Reference for logic, oscillator, and error amplifier; must be star-connected to minimize noise coupling |
| GL (Pin 10) | Low-side gate driver output | Drives gate of low-side MOSFET; −225 mA source / 300 mA sink capability |
| VDD (Pin 11) | Main supply voltage | 13.4 V startup threshold; powers internal logic and low-side driver; clamped to 12.0 V in shutdown |
| IFS (Pin 12) | Oscillator discharge current input | Sets falling slope of Cf voltage; determines dead time via Rdt between VREF and IFS |
| CF (Pin 13) | Oscillator timing capacitor | External capacitor (e.g., 100–220 pF) defining oscillator ramp waveform and frequency resolution |
| IRS (Pin 14) | Oscillator charge current input | Sets rising slope of Cf; combined with IFS and R∆f, defines min/max frequency range |
| SD (Pin 15) | Shut-down input | Latched shutdown trigger at 2.33 V; resets only after VDD drops below 5.3 V |
| VREF (Pin 16) | 3 V reference voltage output | Stable 3.0 V reference for biasing oscillator resistors; ±0.1 V tolerance over temperature |
Key Features
| Feature | Design Value |
|---|---|
| Integrated high-voltage level shifter | Enables direct driving of high-side MOSFET up to 600 V without external level-shift IC or transformer |
| Transconductance error amplifier | 330 µA/mV gm with 2.5 V common-mode input range supports ultra-high-ohmic feedback networks |
| Integrated bootstrap diode | On-chip diode eliminates external component for charging Cboot, reducing BOM count and layout area |
| Latched shutdown with accurate threshold | 2.33 V SD threshold with ±70 mV tolerance enables reliable overvoltage protection without external comparator |
| Adjustable dead time and frequency range | Independent tuning of dead time (via Rdt) and min/max frequency (via Rf(min), R∆f) supports wide input/output requirements |
Applications
| TV Power Supply | Monitor Power Supply |
|---|---|
Use Scenario: 100–240 VAC input powering LCD backlight inverters and main DC rails in flat-panel TVs. IC Role / Device Role / Timing Role: ZVS resonant controller managing half-bridge switching at 200–500 kHz to minimize EMI and improve efficiency. Use Value: Enables >90 % efficiency at full load with reduced MOSFET switching losses and lower thermal stress on magnetics. |
Use Scenario: Compact AC/DC adapter for desktop monitors requiring low standby power and tight output regulation. IC Role / Device Role / Timing Role: Primary-side controller regulating output via frequency modulation while maintaining ZVS across line/load variations. Use Value: Achieves <300 mW no-load consumption using low-startup-current "green function" and UVLO hysteresis. |
| Industrial HV Power Supply | LED Driver Reference Design |
Use Scenario: High-reliability 48 V/5 A output supply for industrial instrumentation with wide input range. IC Role / Device Role / Timing Role: Resonant controller operating in discontinuous conduction mode with adaptive dead time for robust startup under capacitive loads. Use Value: Delivers ±1 % output regulation over 10:1 load range using transconductance amplifier's high PSRR and low offset (±2 mV). |
Use Scenario: Constant-current LED driver for architectural lighting where EMI compliance and dimming compatibility are critical. IC Role / Device Role / Timing Role: Frequency-modulated ZVS controller synchronizing with external PWM dimming signal via SD pin modulation. Use Value: Supports 1000:1 dimming ratio with flicker-free operation by leveraging latched shutdown for precise current pulse control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar zero-voltage-switching resonant converter controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TEA1611T/N6/DG,518 | Includes integrated 600 V high-side driver (vs. external MOSFET drive in TEA1610T); same SO16 package and pinout | Reduces external component count but requires higher gate charge MOSFETs; not drop-in compatible due to different driver architecture | Select TEA1611T when simplifying bill-of-materials outweighs need for discrete MOSFET selection flexibility |
| UCC256301DR | Higher integration (integrated gate drivers, X-capacitor discharge, soft-start); 500 V max high-side voltage vs. 600 V | Targets LLC resonant topologies with digital control; lacks adjustable dead time resistor interface of TEA1610T | Choose UCC256301DR for new designs prioritizing safety certifications and digital configurability over analog tuning flexibility |
Compared with TEA1610T/N6/DG,518, TEA1611T offers integrated high-side switching but sacrifices discrete MOSFET optimization, while UCC256301DR provides advanced protection features at the cost of reduced analog dead-time control - making TEA1610T/N6/DG,518 optimal for cost-sensitive, field-proven ZVS half-bridge designs requiring manual frequency/DT tuning.
Availability
TEA1610T/N6/DG,518 is available at Aetrix Electronics and suitable for TV power supplies, monitor power supplies, and industrial high-voltage power supplies requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for TEA1610T/N6/DG,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in high-performance mixed-signal ICs for automotive, industrial, and consumer power electronics.
The TEA1610T/N6/DG,518 belongs to NXP's GreenChip™ resonant controller product line, engineered specifically for energy-efficient, low-EMI AC/DC power conversion in display and high-voltage auxiliary supplies.
FAQ
What is the maximum high-side voltage rating supported by the TEA1610T/N6/DG,518?
The TEA1610T/N6/DG,518 supports a high-side driver voltage (VHS) up to 600 V, enabling direct interface with high-voltage half-bridge MOSFETs in offline resonant converters. This rating is specified in the Absolute Maximum Ratings table and validated under continuous operation with proper heatsinking and layout isolation per NXP's application note AN99011. The TEA1610T/N6/DG,518 maintains functional integrity up to this voltage without external level-shifting circuitry.
How does the TEA1610T/N6/DG,518 achieve accurate 50 % duty cycle in half-bridge operation?
The TEA1610T/N6/DG,518 achieves precise 50 % duty cycle by routing the oscillator signal through an internal divide-by-two flip-flop before feeding it to the output drivers. This ensures symmetrical timing between high-side and low-side gate drive signals, eliminating duty-cycle drift caused by oscillator asymmetry or propagation delays. The TEA1610T/N6/DG,518 datasheet confirms this architecture in Section 1 ("General description") and Figure 2 (block diagram), where the ÷2 block precedes both HIGH SIDE DRIVER and LOW SIDE DRIVER blocks.
Can the TEA1610T/N6/DG,518 operate without an external bootstrap capacitor?
No - the TEA1610T/N6/DG,518 requires an external bootstrap capacitor (Cboot) connected between VDD(F) and SH pins to generate the floating supply for the high-side driver. Although the IC integrates a bootstrap diode, the capacitor is mandatory to sustain gate drive voltage during high-side conduction. Startup relies on initial low-side conduction to charge Cboot, as detailed in Section 8.1 ("Start-up") of the TEA1610T/N6/DG,518 datasheet.
What is the purpose of the n.c. (Pin 5) on the TEA1610T/N6/DG,518 SO16 package?
Pin 5 of the TEA1610T/N6/DG,518 is designated "n.c." (not connected) and serves as a high-voltage spacer between PGND (Pin 4) and SH (Pin 6) to enhance creepage and clearance in high-voltage PCB layouts. It has no internal connection and must remain unconnected and unstubbed. This design choice improves isolation integrity in 600 V-rated applications, as confirmed in Table 3 ("Pin description") and Figure 4 ("Pin configuration for TEA1610T") of the TEA1610T/N6/DG,518 datasheet.
How is shutdown reset after activation of the TEA1610T/N6/DG,518 latched shutdown function?
After latched shutdown activation (triggered at SD = 2.33 V), the TEA1610T/N6/DG,518 remains in shutdown until VDD drops below the reset threshold of 5.3 V (typical). This reset condition releases the internal latch, allowing a new start-up cycle to begin once VDD rises above 13.4 V. The VDD(reset) parameter is specified in Table 6 ("Characteristics") and illustrated in Figure 8 ("Shut-down"), confirming that the TEA1610T/N6/DG,518 requires intentional power cycling or controlled VDD discharge to recover.
TEA1610T/N6/DG,518 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- Resonant Converter Controller
- Voltage - Input:
- 600V
- Voltage - Supply:
- 0V ~ 15V
- Current - Supply:
- 2.4 mA
- Operating Temperature:
- -25°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SO
TEA1610T/N6/DG,518 FAQ
1.How can I place an order for TEA1610T/N6/DG,518 through Aetrix?
Please submit a Request for Quotation (RFQ) for TEA1610T/N6/DG,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TEA1610T/N6/DG,518 reliable?
The price and inventory of TEA1610T/N6/DG,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TEA1610T/N6/DG,518 is usually 5 days.
3.What payment methods are accepted for TEA1610T/N6/DG,518?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TEA1610T/N6/DG,518 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TEA1610T/N6/DG,518?
TEA1610T/N6/DG,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TEA1610T/N6/DG,518 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TEA1610T/N6/DG,518?
For technical support, including TEA1610T/N6/DG,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TEA1610T/N6/DG,518 requirements.
6.How does Aetrix verify that TEA1610T/N6/DG,518 is sourced from the original manufacturer or authorized distributors?
All TEA1610T/N6/DG,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TEA1610T/N6/DG,518 meets industry standards.
7.What is the process for return or replacement of TEA1610T/N6/DG,518?
All TEA1610T/N6/DG,518 units undergo pre-shipment inspection (PSI). If there is an issue with TEA1610T/N6/DG,518, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TEA1610T/N6/DG,518 part is unused and in its original packaging.
Return procedure for TEA1610T/N6/DG,518:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TEA1610T/N6/DG,518 Tags

-
UC3845AD8TR
Texas Instruments

-
UC2843AD8TR
Texas Instruments

-
LM3880MFX-1AE/NOPB
Texas Instruments

-
LM3880MFX-1AA/NOPB
Texas Instruments

-
INA234AIYBJR
Texas Instruments

-
INA700AYWFR
Texas Instruments

-
LM3880MF-1AE/NOPB
Texas Instruments

-
LM3880MF-1AA/NOPB
Texas Instruments

-
LM3881MM/NOPB
Texas Instruments

-
UCC2802DTR
Texas Instruments

-
NCP4305DMTTWG
onsemi
-
INA237AIDGSR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

