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NXP Semiconductors TEA1610T/N6/DG,518

Part No.:
TEA1610T/N6/DG,518
Manufacturer:
NXP Semiconductors
Category:
Power Supply Controllers, Monitors
Package:
16-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixTEA1610T/N6/DG,518.pdf
Description:
IC CTLR SMPS SW SO16
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,539

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Product details

Overview

TEA1610T/N6/DG,518 from NXP Semiconductors is a high-voltage zero-voltage-switching (ZVS) resonant converter controller implemented in DMOS process, designed to drive two discrete MOSFETs in half-bridge topology. It integrates a level-shift circuit, transconductance error amplifier, latched shutdown, and oscillator with programmable frequency range (188–550 kHz bridge frequency), enabling stable operation across varying mains voltages in TV/monitor power supplies.

For engineers reviewing the TEA1610T/N6/DG,518 datasheet, TEA1610T/N6/DG,518 pinout, TEA1610T/N6/DG,518 application, or TEA1610T/N6/DG,518 equivalent, key selection criteria include high-side driver voltage rating (600 V), adjustable dead time via Rdt, 50 % duty cycle accuracy via internal ÷2 flip-flop, undervoltage lockout (13.4 V start, 9.4 V stop), and bootstrap diode integration for floating supply generation.

Technical Context

The TEA1610T/N6/DG,518 employs a current-controlled oscillator whose frequency is set by external capacitor Cf and charge/discharge currents at IRS and IFS pins, with bridge frequency precisely half the oscillator frequency due to internal divide-by-two logic. Its transconductance error amplifier (gm = 330 µA/mV) delivers up to 0.5 mA output current to regulate frequency-based output voltage.

Startup initiates with low-side MOSFET conduction only, charging the bootstrap capacitor (Cboot) before full half-bridge operation begins at VDD ≥ 13.4 V; shutdown is latched at SD = 2.33 V, clamping VDD to 12.0 V and requiring VDD ≤ 5.3 V to reset. The IC supports ZVS operation through precise dead-time control (0.37–0.43 µs) and high-side driver capability up to 600 V with −225 mA source / 300 mA sink current.

Key Specifications

Parameter Value and Actual Design Meaning
Bridge Frequency Range188–550 kHz - sets resonant tank switching rate; minimum ensures stable ZVS, maximum enables compact magnetics
High-Side Driver Voltage0–600 V - directly interfaces with high-voltage half-bridge switches without external level-shifting components
Transconductance (gm)330 µA/mV - defines error amplifier gain for precise feedback loop response in voltage regulation
Dead Time0.37–0.43 µs - prevents shoot-through in half-bridge by ensuring non-overlapping gate drive signals
Undervoltage Lockout (UVLO)13.4 V start / 9.4 V stop - provides hysteresis (4.0 V) to avoid oscillation near threshold during brownout conditions
Shut-down Threshold2.33 V (±70 mV) - enables precise overvoltage protection via external resistor divider on SD pin
Reference Voltage (VREF)3.0 V (±0.1 V) - stable 3 V reference for biasing Rdt, Rf(min), and R∆f resistors in oscillator tuning network

Pinout & Package

TEA1610T/N6/DG,518 is housed in SO16 (SOT109-2) package: plastic small outline, 16 leads, 3.9 mm body width, low stand-off height - suitable for automated SMT assembly and high-density PCB layouts.

Pin/Terminal Circuit Role Design Meaning
I− (Pin 1)Error amplifier inverting inputConnects to regulated output feedback node; forms precision voltage error sensing with I+
I+ (Pin 2)Error amplifier non-inverting inputAccepts stable reference (e.g., from TL431); differential input sets regulation setpoint
VCO (Pin 3)Error amplifier outputCurrent-source output drives IRS pin; frequency modulation input for closed-loop regulation
PGND (Pin 4)Power groundLow-impedance return path for high-current gate drivers; must be separated from SGND
n.c. (Pin 5)Not connectedHigh-voltage spacer; no internal connection - leave unconnected and unstubbed
SH (Pin 6)High-side switch sourceConnects to source of high-side MOSFET; referenced to floating VDD(F) supply
GH (Pin 7)High-side gate driver outputDrives gate of high-side MOSFET; rated for 600 V common-mode voltage and −225 mA source
VDD(F) (Pin 8)Floating supply for high-side driverPowered by bootstrap capacitor; enables high-side gate drive without isolated supply
SGND (Pin 9)Signal groundReference for logic, oscillator, and error amplifier; must be star-connected to minimize noise coupling
GL (Pin 10)Low-side gate driver outputDrives gate of low-side MOSFET; −225 mA source / 300 mA sink capability
VDD (Pin 11)Main supply voltage13.4 V startup threshold; powers internal logic and low-side driver; clamped to 12.0 V in shutdown
IFS (Pin 12)Oscillator discharge current inputSets falling slope of Cf voltage; determines dead time via Rdt between VREF and IFS
CF (Pin 13)Oscillator timing capacitorExternal capacitor (e.g., 100–220 pF) defining oscillator ramp waveform and frequency resolution
IRS (Pin 14)Oscillator charge current inputSets rising slope of Cf; combined with IFS and R∆f, defines min/max frequency range
SD (Pin 15)Shut-down inputLatched shutdown trigger at 2.33 V; resets only after VDD drops below 5.3 V
VREF (Pin 16)3 V reference voltage outputStable 3.0 V reference for biasing oscillator resistors; ±0.1 V tolerance over temperature

Key Features

Feature Design Value
Integrated high-voltage level shifterEnables direct driving of high-side MOSFET up to 600 V without external level-shift IC or transformer
Transconductance error amplifier330 µA/mV gm with 2.5 V common-mode input range supports ultra-high-ohmic feedback networks
Integrated bootstrap diodeOn-chip diode eliminates external component for charging Cboot, reducing BOM count and layout area
Latched shutdown with accurate threshold2.33 V SD threshold with ±70 mV tolerance enables reliable overvoltage protection without external comparator
Adjustable dead time and frequency rangeIndependent tuning of dead time (via Rdt) and min/max frequency (via Rf(min), R∆f) supports wide input/output requirements

Applications

TV Power Supply Monitor Power Supply

Use Scenario: 100–240 VAC input powering LCD backlight inverters and main DC rails in flat-panel TVs.

IC Role / Device Role / Timing Role: ZVS resonant controller managing half-bridge switching at 200–500 kHz to minimize EMI and improve efficiency.

Use Value: Enables >90 % efficiency at full load with reduced MOSFET switching losses and lower thermal stress on magnetics.

Use Scenario: Compact AC/DC adapter for desktop monitors requiring low standby power and tight output regulation.

IC Role / Device Role / Timing Role: Primary-side controller regulating output via frequency modulation while maintaining ZVS across line/load variations.

Use Value: Achieves <300 mW no-load consumption using low-startup-current "green function" and UVLO hysteresis.

Industrial HV Power Supply LED Driver Reference Design

Use Scenario: High-reliability 48 V/5 A output supply for industrial instrumentation with wide input range.

IC Role / Device Role / Timing Role: Resonant controller operating in discontinuous conduction mode with adaptive dead time for robust startup under capacitive loads.

Use Value: Delivers ±1 % output regulation over 10:1 load range using transconductance amplifier's high PSRR and low offset (±2 mV).

Use Scenario: Constant-current LED driver for architectural lighting where EMI compliance and dimming compatibility are critical.

IC Role / Device Role / Timing Role: Frequency-modulated ZVS controller synchronizing with external PWM dimming signal via SD pin modulation.

Use Value: Supports 1000:1 dimming ratio with flicker-free operation by leveraging latched shutdown for precise current pulse control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar zero-voltage-switching resonant converter controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
TEA1611T/N6/DG,518Includes integrated 600 V high-side driver (vs. external MOSFET drive in TEA1610T); same SO16 package and pinoutReduces external component count but requires higher gate charge MOSFETs; not drop-in compatible due to different driver architectureSelect TEA1611T when simplifying bill-of-materials outweighs need for discrete MOSFET selection flexibility
UCC256301DRHigher integration (integrated gate drivers, X-capacitor discharge, soft-start); 500 V max high-side voltage vs. 600 VTargets LLC resonant topologies with digital control; lacks adjustable dead time resistor interface of TEA1610TChoose UCC256301DR for new designs prioritizing safety certifications and digital configurability over analog tuning flexibility

Compared with TEA1610T/N6/DG,518, TEA1611T offers integrated high-side switching but sacrifices discrete MOSFET optimization, while UCC256301DR provides advanced protection features at the cost of reduced analog dead-time control - making TEA1610T/N6/DG,518 optimal for cost-sensitive, field-proven ZVS half-bridge designs requiring manual frequency/DT tuning.

Availability

TEA1610T/N6/DG,518 is available at Aetrix Electronics and suitable for TV power supplies, monitor power supplies, and industrial high-voltage power supplies requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for TEA1610T/N6/DG,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in high-performance mixed-signal ICs for automotive, industrial, and consumer power electronics.

The TEA1610T/N6/DG,518 belongs to NXP's GreenChip™ resonant controller product line, engineered specifically for energy-efficient, low-EMI AC/DC power conversion in display and high-voltage auxiliary supplies.

FAQ

What is the maximum high-side voltage rating supported by the TEA1610T/N6/DG,518?

The TEA1610T/N6/DG,518 supports a high-side driver voltage (VHS) up to 600 V, enabling direct interface with high-voltage half-bridge MOSFETs in offline resonant converters. This rating is specified in the Absolute Maximum Ratings table and validated under continuous operation with proper heatsinking and layout isolation per NXP's application note AN99011. The TEA1610T/N6/DG,518 maintains functional integrity up to this voltage without external level-shifting circuitry.

How does the TEA1610T/N6/DG,518 achieve accurate 50 % duty cycle in half-bridge operation?

The TEA1610T/N6/DG,518 achieves precise 50 % duty cycle by routing the oscillator signal through an internal divide-by-two flip-flop before feeding it to the output drivers. This ensures symmetrical timing between high-side and low-side gate drive signals, eliminating duty-cycle drift caused by oscillator asymmetry or propagation delays. The TEA1610T/N6/DG,518 datasheet confirms this architecture in Section 1 ("General description") and Figure 2 (block diagram), where the ÷2 block precedes both HIGH SIDE DRIVER and LOW SIDE DRIVER blocks.

Can the TEA1610T/N6/DG,518 operate without an external bootstrap capacitor?

No - the TEA1610T/N6/DG,518 requires an external bootstrap capacitor (Cboot) connected between VDD(F) and SH pins to generate the floating supply for the high-side driver. Although the IC integrates a bootstrap diode, the capacitor is mandatory to sustain gate drive voltage during high-side conduction. Startup relies on initial low-side conduction to charge Cboot, as detailed in Section 8.1 ("Start-up") of the TEA1610T/N6/DG,518 datasheet.

What is the purpose of the n.c. (Pin 5) on the TEA1610T/N6/DG,518 SO16 package?

Pin 5 of the TEA1610T/N6/DG,518 is designated "n.c." (not connected) and serves as a high-voltage spacer between PGND (Pin 4) and SH (Pin 6) to enhance creepage and clearance in high-voltage PCB layouts. It has no internal connection and must remain unconnected and unstubbed. This design choice improves isolation integrity in 600 V-rated applications, as confirmed in Table 3 ("Pin description") and Figure 4 ("Pin configuration for TEA1610T") of the TEA1610T/N6/DG,518 datasheet.

How is shutdown reset after activation of the TEA1610T/N6/DG,518 latched shutdown function?

After latched shutdown activation (triggered at SD = 2.33 V), the TEA1610T/N6/DG,518 remains in shutdown until VDD drops below the reset threshold of 5.3 V (typical). This reset condition releases the internal latch, allowing a new start-up cycle to begin once VDD rises above 13.4 V. The VDD(reset) parameter is specified in Table 6 ("Characteristics") and illustrated in Figure 8 ("Shut-down"), confirming that the TEA1610T/N6/DG,518 requires intentional power cycling or controlled VDD discharge to recover.

TEA1610T/N6/DG,518 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
16-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Applications:
Resonant Converter Controller
Voltage - Input:
600V
Voltage - Supply:
0V ~ 15V
Current - Supply:
2.4 mA
Operating Temperature:
-25°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SO

TEA1610T/N6/DG,518 FAQ

1.How can I place an order for TEA1610T/N6/DG,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for TEA1610T/N6/DG,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TEA1610T/N6/DG,518 reliable?

The price and inventory of TEA1610T/N6/DG,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TEA1610T/N6/DG,518 is usually 5 days.

3.What payment methods are accepted for TEA1610T/N6/DG,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TEA1610T/N6/DG,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TEA1610T/N6/DG,518?

TEA1610T/N6/DG,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TEA1610T/N6/DG,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TEA1610T/N6/DG,518?

For technical support, including TEA1610T/N6/DG,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TEA1610T/N6/DG,518 requirements.

6.How does Aetrix verify that TEA1610T/N6/DG,518 is sourced from the original manufacturer or authorized distributors?

All TEA1610T/N6/DG,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TEA1610T/N6/DG,518 meets industry standards.

7.What is the process for return or replacement of TEA1610T/N6/DG,518?

All TEA1610T/N6/DG,518 units undergo pre-shipment inspection (PSI). If there is an issue with TEA1610T/N6/DG,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TEA1610T/N6/DG,518 part is unused and in its original packaging.

Return procedure for TEA1610T/N6/DG,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TEA1610T/N6/DG,518 Tags

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