NXP Semiconductors TEA19051BAFTK/1J

Overview

TEA19051BAFTK/1J from NXP Semiconductors is a USB-PD 3.0 and QC4+ secondary-side SMPS controller with integrated USB-PD PHY, 12-bit CV DAC (±2 % voltage accuracy), 10-bit CC DAC (±2 % current accuracy), and hardware-based protections including OTP, OVP, OCP, and OSP. It drives an external NMOS load switch via SW pin and supports programmable power supply (PPS) for fast-charging adapters up to 21 V output.

For engineers reviewing the TEA19051BAFTK/1J datasheet, TEA19051BAFTK/1J pinout, TEA19051BAFTK/1J application, or TEA19051BAFTK/1J equivalent, key selection criteria include its HVSON16 package, dual-protocol support (USB-PD 3.0 + QC4+), <30 mW no-load power, hardware-latched protections, and MTP-programmable PDOs with cable compensation.

Technical Context

The TEA19051BAFTK/1J implements a digitally controlled analog CV/CC loop with independent VSNS (voltage sense) and ISNS (current sense) inputs, enabling precise regulation across 2.9 V–21 V output range. Its embedded MCU executes protocol stacks (USB-PD 3.0 PPS, QC4+, BC1.2) while hardware accelerators handle attach/detach detection on CC1/CC2 and DP/DM lines.

Protection logic resides in dedicated hardware blocks - not firmware - ensuring fail-safe response during microcontroller lockup. Adaptive OVP/UVP thresholds scale with programmed PDO voltage, and OTP uses both internal die sensor and two external NTC inputs (GPIO1/GPIO2) with configurable trip levels stored in MTP memory.

Key Specifications

Pinout & Package

HVSON16 package (SOT1308-1) with 16 terminals and exposed die pad (EDP) for thermal dissipation. Pin count optimized for compact USB-C adapter designs requiring minimal external components.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB-PD and QC secondary-side controller applications.

Compared with STUSB4500QTR and MPQ4282GQ-A, the TEA19051BAFTK/1J uniquely combines USB-PD 3.0 PPS, QC4+, and BC1.2 in one die with hardware-enforced protections, integrated NMOS gate drive (SW), and MTP-configurable thermal management - eliminating external protocol ICs and discrete safety components.

Availability

TEA19051BAFTK/1J is available at Aetrix Electronics and suitable for USB-C fast-charging adapters, multi-protocol laptop power supplies, and universal docking station PSUs requiring stable component supply, long-term lifecycle support, and compliance with CoC Tier-2 and DOE VI efficiency standards.

Supply support for TEA19051BAFTK/1J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with deep expertise in power management and USB protocol silicon.

The TEA19051BAFTK/1J belongs to NXP's TEA190xx smart-charging controller family, engineered specifically for high-efficiency, multi-protocol USB-C SMPS designs targeting smartphone, tablet, and laptop chargers with stringent no-load and thermal safety requirements.

FAQ

What USB-PD and QC protocols does the TEA19051BAFTK/1J support?

The TEA19051BAFTK/1J supports USB-PD 2.0 and 3.0 including Programmable Power Supply (PPS), Qualcomm QuickCharge QC2.0, QC3.0, and QC4+, plus Battery Charging 1.2 (BC1.2). All protocols are implemented in on-chip ROM and MTP-configurable firmware, with hardware acceleration for CC1/CC2 and DP/DM line detection. The TEA19051BAFTK/1J can be factory-configured to disable QC2.0/QC3.0 for USB-PD certification testing.

How does the TEA19051BAFTK/1J achieve <30 mW no-load power?

The TEA19051BAFTK/1J achieves <30 mW system-level no-load power through aggressive circuit gating during unattached state, ultra-low-quiescent-current analog blocks, and minimal external component count (~15 parts). Its HVSON16 package with exposed die pad improves thermal efficiency, reducing leakage. The TEA19051BAFTK/1J enters deep-sleep mode after detach detection, powering down non-essential blocks while retaining USB-C attach readiness on CC pins.

What protections are implemented in hardware versus firmware in the TEA19051BAFTK/1J?

In the TEA19051BAFTK/1J, all critical protections - overtemperature (OTP), overvoltage (OVP), undervoltage (UVP), overcurrent (OCP), output short (OSP), open-supply (OSUP), and open-ground (OGP) - are implemented in dedicated hardware logic. This ensures fail-safe operation even if the embedded MCU locks up. Only non-critical features like MTP configuration and VDM processing rely on firmware. The TEA19051BAFTK/1J allows latched or safe-restart behavior for each protection via MTP settings.

Can the TEA19051BAFTK/1J drive an external NMOS load switch directly?

Yes, the TEA19051BAFTK/1J drives an external NMOS load switch directly via its SW pin, which outputs VCC + 6 V using an integrated charge pump. This eliminates the need for an external high-side driver IC. The SW pin remains low when VCC is below UVLO or during fault conditions, ensuring the NMOS stays off. An external pull-up resistor between NMOS gate and Vbus is required for fail-safe operation if the SW pin becomes disconnected.

What is the role of the DISCH pin on the TEA19051BAFTK/1J?

The DISCH pin on the TEA19051BAFTK/1J provides a low-ohmic internal switch to rapidly discharge the Vbus output to vSafe0V (<0.8 V) during USB-PD hard reset sequences. An external current-limiting resistor sets peak discharge current and IC power dissipation. The TEA19051BAFTK/1J monitors actual Vbus voltage during discharge by briefly opening the DISCH switch every millisecond to sample output level, ensuring compliance with USB-PD vSafe0V timing requirements.