NXP Semiconductors TEA19051BAMTK/1J

Overview

TEA19051BAMTK/1J from NXP Semiconductors is a USB-PD 3.0 and QC4+ secondary-side SMPS controller in HVSON16 (SOT1308-1) package, delivering 2% CV/CC regulation accuracy, <30 mW no-load power, and integrated USB-PD PHY, charge pump for NMOS gate drive, and fast DISCH functionality. It enables compact, CoC Tier-2/EuP Lot6-compliant USB-C chargers with programmable PPS and cable compensation.

For engineers reviewing the TEA19051BAMTK/1J datasheet, TEA19051BAMTK/1J pinout, TEA19051BAMTK/1J application, or TEA19051BAMTK/1J equivalent, key selection considerations include its hardware-enforced protections (OTP, OVP, OSP), MTP-programmable PDOs (up to 7, including 4 PPS), dual GPIO temperature sensing, and single-optocoupler feedback architecture interfacing with TEA193x primary and TEA199x SR controllers.

Technical Context

The TEA19051BAMTK/1J implements a digitally controlled analog CV/CC loop with 12-bit DAC (voltage) and 10-bit DAC (current), where VSNS and ISNS pins interface with external resistor dividers and sense resistors (2–22.5 mΩ) to regulate output voltage (2.9–21 V) and current with hardware-backed adaptive protection logic. Its embedded MCU executes protocol stacks (USB-PD 2.0/3.0, QC2.0/3.0/4+, BC1.2) while maintaining independent hardware safety monitors.

It integrates a USB-PD physical layer with CC1/CC2 detection and communication, DP/DM support for QC/Battery Charging, and dedicated SW (NMOS gate drive at VCC + 6 V) and DISCH (fast Vbus discharge with vSafe0V compliance) terminals. All protections - except UVP - are implemented in hardware with latched or safe-restart behavior, ensuring fail-safe operation even during MCU lockup.

Key Specifications

Pinout & Package

HVSON16 package (SOT1308-1), 3.5 × 5.5 × 0.85 mm body size, leadless, reflow-solderable, with exposed die pad (EDP) for thermal conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB-PD secondary-side controller applications.

Compared with STUSB4500QTR and MPQ4282-AEC1, the TEA19051BAMTK/1J uniquely combines full SMPS secondary regulation (CV/CC), hardware safety co-processing, 7-PDO programmability, and dual NTC temperature sensing in a single HVSON16 package - enabling certified, compact, and thermally robust USB-C chargers with minimal external components.

Availability

TEA19051BAMTK/1J is available at Aetrix Electronics and suitable for USB-C fast-charging adapters, multi-protocol laptop docks, and industrial USB hub power supplies requiring stable component supply, long-term lifecycle support, and compliance with USB-PD 3.0, QC4+, and energy efficiency standards.

Supply support for TEA19051BAMTK/1J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with deep expertise in power management and USB protocol IP.

The TEA19051BAMTK/1J belongs to NXP's TEA190xx smart-charging controller family, designed specifically for high-efficiency, safety-certified USB-C and Quick Charge power adapters targeting smartphone, tablet, and laptop markets.

FAQ

What protocols does the TEA19051BAMTK/1J support out of the box?

The TEA19051BAMTK/1J natively supports USB-PD 2.0 and 3.0 (including PPS), Qualcomm Quick Charge 2.0/3.0/4+, Battery Charging 1.2, and unstructured VDMs for vendor ID discovery. All protocol stacks execute on its embedded MCU, with MTP memory storing up to seven programmable power data objects (PDOs), four of which can be configured as PPS profiles. The TEA19051BAMTK/1J also includes hardware-level CC1/CC2 and DP/DM interfaces to ensure physical-layer compliance without firmware dependency.

How does the TEA19051BAMTK/1J achieve <30 mW no-load power consumption?

The TEA19051BAMTK/1J achieves sub-30 mW system-level no-load power through ultra-low-quiescent-current circuitry, intelligent peripheral gating during detach state, and hardware-managed power-down sequencing. When unattached, only essential blocks (CC detection, UVLO monitor, and 1 mA DISCH sink) remain active; analog loops and protocol engines shut down. Its HVSON16 package and optimized internal regulators minimize leakage, and the single-optocoupler feedback eliminates auxiliary bias supplies - all contributing to CoC Tier-2 and EuP Lot6 compliance. This performance is validated in reference designs combining TEA19051BAMTK/1J with TEA193x and TEA199x controllers.

Can the TEA19051BAMTK/1J replace a TL431 in existing SMPS designs?

Yes - the TEA19051BAMTK/1J is explicitly architected as a programmable, enhanced replacement for the TL431 shunt regulator. Its VSNS pin maps to TL431's REF input, OPTO pin to its cathode, and GND to its anode. Unlike the TL431, the TEA19051BAMTK/1J adds constant-current regulation, USB-PD/QC protocol handling, hardware protections, and MTP configurability - all while retaining pin-compatible feedback topology. Migration requires updating the resistor divider (per MTP-programmed ratio) and adding minimal support components (e.g., DISCH resistor, NTCs), but preserves the core optocoupler-based isolation scheme.

What thermal management features does the TEA19051BAMTK/1J provide?

The TEA19051BAMTK/1J provides three-tier thermal management: (1) internal die temperature monitoring via on-die sensor, (2) two configurable GPIO pins supporting NTC thermistors for adapter and cable-connector temperature measurement (<5 °C accuracy, 0–120 °C), and (3) hardware-latched OTP with user-defined thresholds stored in MTP. Both external NTC channels use adaptive current sources (15/60/240 µA) to maintain linearity across temperature ranges. The exposed die pad (EDP) serves as primary thermal path, requiring direct PCB copper connection for sustained >3 A operation and OTP derating control.

Is the TEA19051BAMTK/1J pin-compatible with other variants in the TEA19051B series?

Yes - all TEA19051Bx variants, including TEA19051BAMTK/1J, share identical HVSON16 (SOT1308-1) packaging and 100 % pin-to-pin compatibility. Differences between variants (e.g., TEA19051BAATK/1, TEA19051BABTK/1) reside solely in factory-programmed MTP contents - such as default PDO sets, cable compensation values, GPIO configurations, and protection thresholds - not in silicon or pin function. This allows design reuse across SKUs and field-upgradable feature sets via I²C or VDM-based MTP reprogramming.