NXP Semiconductors TEA1999DB1546
- Part No.:
- TEA1999DB1546
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Supply Controllers, Monitors
- Package:
- -
- Datasheet:
-
TEA1999DB1546.pdf
- Description:
- TEA1999DB1546
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Product details
Overview
TEA1999DB1546 from NXP Semiconductors is a GreenChip synchronous rectifier (SR) controller IC for flyback SMPS secondary-side operation, featuring adaptive gate drive, drain-source differential sensing, and self-supply capability for low-voltage (<4.7 V) and high-side rectification applications. It drives external SR MOSFETs with 0.70 A source / 0.50 A sink gate drive strength and operates across 0–26 V output voltage range.
For engineers reviewing the TEA1999DB1546 datasheet, TEA1999DB1546 pinout, TEA1999DB1546 application, or TEA1999DB1546 equivalent, key selection considerations include its TSOP6 (SOT457) package, 1.4 μs minimum active time, −25 mV regulation threshold, UVLO with active gate pull-down, and compatibility with both standard and logic-level SR MOSFETs in USB BC/QuickCharge designs.
Technical Context
The TEA1999DB1546 implements a drain-source differential sensing architecture to control external SR MOSFETs in flyback converters, using the DRAIN and SOURCE pins to detect conduction onset and regulate gate drive to maintain a precise −25 mV (typ) VDS during regulation. Its adaptive gate driver dynamically adjusts output to sustain optimal MOSFET on-resistance across load conditions.
Startup is managed via CAP pin charging-either through DRAIN (≤15 mA typical at startup) or XV (up to 125 mA)-with UVLO activation at 3.7 V (typ) and hysteresis of 0.1 V. Overtemperature protection triggers at 165 °C (typ) with 20 °C hysteresis, actively pulling GATE low during fault conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range (XV) | 0 V to 21 V - Enables direct connection to output rail for logic-level MOSFET drive or ground for 10 V regulation |
| Drain Sense Voltage | −0.8 V to +120 V - Supports high-side rectification and withstands flyback voltage spikes without clamping |
| Regulation Threshold | −25 mV (typ) - Precisely maintains SR MOSFET VDS during conduction to minimize conduction loss |
| Gate Drive Strength | 0.70 A source / 0.50 A sink - Ensures fast turn-on/turn-off of SR MOSFETs up to 10 nF gate capacitance |
| Min Active Time | 1.4 μs (typ) - Prevents premature turn-off due to switching node ringing in high-dI/dt flyback designs |
| UVLO Threshold | 3.7 V start / 3.6 V stop (typ) - Provides stable power-up sequencing and fault-safe shutdown |
| No-Load Current | <250 μA - Reduces standby power loss in energy-efficient chargers and adapters |
Pinout & Package
TEA1999DB1546 is housed in a TSOP6 (SOT457) plastic surface-mounted package: 2.7 mm × 3.1 mm footprint, 1.1 mm max height, 0.95 mm pitch, with exposed pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CAP | Internal supply capacitor input | Provides decoupling and energy storage for internal circuitry; charged via DRAIN or XV depending on voltage levels |
| GND | Ground reference | Common return path for all internal circuits and gate driver sink current |
| XV | External supply input | Selects gate drive voltage: grounded → 10 V regulated; tied to output → 4.7–10 V regulated |
| GATE | SR MOSFET gate driver output | Delivers up to 0.70 A peak current to charge gate; includes 3.2 Ω (typ) active pull-down for fast turn-off |
| SOURCE | SR MOSFET source sense input | Direct Kelvin connection point to MOSFET source to eliminate PCB trace IR drop error in VDS sensing |
| DRAIN | SR MOSFET drain sense input | High-voltage input (up to +120 V) that detects MOSFET conduction state and initiates gate drive |
Key Features
| Feature | Design Value |
|---|---|
| Adaptive gate drive | Adjusts gate voltage in real time to maintain −25 mV VDS, minimizing conduction loss across full load range |
| Self-supply capability | Generates internal supply from DRAIN pin during startup and operation-enables high-side rectification without auxiliary winding |
| Drain-source differential sensing | Uses separate SOURCE and DRAIN inputs to reject PCB layout-induced sensing errors from high dI/dt paths |
| UVLO with active gate pull-down | Ensures SR MOSFET remains off during undervoltage conditions, preventing uncontrolled conduction and thermal runaway |
| Overtemperature protection | Shuts down gate driver at 165 °C (typ) and resumes at 145 °C (20 °C hysteresis), protecting against sustained overload or poor heatsinking |
Applications
| USB PD Fast Charging Adapter | Low-Voltage Battery Charger |
|---|---|
Use Scenario: 20 V–5 V variable-output USB Power Delivery adapter delivering up to 65 W with <100 mW no-load consumption. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier controller managing SR MOSFET switching timing and gate drive based on transformer secondary voltage polarity and magnitude. Use Value: Enables >94% efficiency at 20% load and <250 μA no-load current-meeting DOE VI and CoC Tier 2 requirements without auxiliary bias winding. | Use Scenario: 3.3 V/5 V lithium-ion battery charger for portable medical devices requiring ultra-low standby power and compact form factor. IC Role / Device Role / Timing Role: Self-powered SR controller operating directly from low output voltage, eliminating need for dedicated bias supply or Zener clamp. Use Value: Supports output voltages as low as 0 V while maintaining precise −25 mV VDS regulation-reducing conduction loss by >40% vs. Schottky diode solution. |
| High-Side Rectified Flyback | Smartphone QuickCharge Adapter |
Use Scenario: 12 V/3 A industrial flyback supply where primary-side isolation requires high-side SR placement to avoid ground-referenced secondary layout constraints. IC Role / Device Role / Timing Role: High-side SR controller deriving its supply from DRAIN pin during MOSFET off-time, synchronizing gate drive with transformer reset phase. Use Value: Eliminates auxiliary winding and associated leakage inductance, reducing BOM count by 2 components and improving cross-regulation in multi-output designs. | Use Scenario: Dual-port QC 3.0/4.0 wall adapter supporting 9 V/2 A and 12 V/1.5 A outputs with dynamic voltage negotiation. IC Role / Device Role / Timing Role: Adaptive SR controller coordinating with primary-side QC protocol IC to maintain high efficiency across multiple output voltage steps. Use Value: Maintains >92% efficiency at 5 V, 9 V, and 12 V outputs using same gate drive architecture-enabling single-platform design for multi-standard charging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous rectifier controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NCP4306DR2G | Fixed 5 V gate drive; no XV pin for adjustable output; 1.2 μs min on-time; supports only low-side configuration | Lacks self-supply capability for high-side or sub-4.7 V operation; requires auxiliary winding for bias | Choose when cost sensitivity outweighs efficiency at light load and high-side topology is unnecessary |
| Vishay SiHP20N60E | Integrated SR MOSFET + controller in TO-220FP; 600 V rating; no external gate drive needed | Monolithic solution eliminates discrete MOSFET but fixes voltage/current rating and increases thermal coupling | Prefer for simplified layout and higher voltage flybacks (>48 V output), accepting fixed 20 A current limit and larger footprint |
Compared with NCP4306DR2G, TEA1999DB1546 offers wider output voltage support (0–26 V vs. 5–24 V), self-supply capability, and adaptive regulation-critical for USB PD and low-voltage charging. Versus SiHP20N60E, TEA1999DB1546 provides design flexibility with external MOSFET selection, lower thermal resistance path, and finer control over gate timing.
Availability
TEA1999DB1546 is available at Aetrix Electronics and suitable for USB PD fast charging adapters, low-voltage battery chargers, and high-side rectified flyback power supplies requiring stable component supply, long-term lifecycle assurance, and compliance with energy-efficiency standards.
Supply support for TEA1999DB1546 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The TEA1999DB1546 belongs to NXP's GreenChip family of high-efficiency power conversion ICs, designed specifically to replace secondary-side diodes in flyback topologies with intelligent synchronous rectification-targeting ultra-low standby power and high light-load efficiency in compact AC-DC adapters and chargers.
FAQ
What is the function of the XV pin on the TEA1999DB1546?
The XV pin on the TEA1999DB1546 serves as an external supply input that determines the gate driver output voltage level. When grounded, it regulates the GATE output to ~10 V for driving standard SR MOSFETs; when connected to the converter output, it regulates GATE to match that voltage (minimum 4.7 V), enabling use with logic-level MOSFETs. This dual-mode operation makes TEA1999DB1546 adaptable to diverse flyback designs without changing the IC.
Can TEA1999DB1546 operate in high-side rectification configurations?
Yes, TEA1999DB1546 supports high-side rectification by generating its own supply voltage from the DRAIN pin during MOSFET off-time, eliminating the need for an auxiliary winding. Its drain sense input handles up to +120 V, and the self-supply architecture allows reliable operation even when the output voltage is below 4.7 V-making TEA1999DB1546 suitable for isolated high-side SR implementations in compact flyback designs.
What is the minimum active time (tact(sr)(min)) of TEA1999DB1546 and why is it important?
The TEA1999DB1546 has a minimum synchronous rectification active time of 1.4 μs (typ). This parameter prevents false turn-off caused by voltage ringing at the DRAIN node during high-dI/dt transitions. By enforcing this minimum on-time, TEA1999DB1546 ensures stable conduction during the true MOSFET current flow period-critical for maintaining efficiency and reliability in high-frequency flyback converters with fast-switching MOSFETs.
How does TEA1999DB1546 achieve low no-load power consumption?
TEA1999DB1546 achieves <250 μA typical no-load supply current through integrated power-save mode, which reduces internal bias currents when the DRAIN pin voltage falls below 5.5 V. Combined with UVLO hysteresis and low-quiescent gate driver circuitry, this enables TEA1999DB1546 to meet stringent energy-efficiency standards like DOE Level VI and EU CoC Tier 2-without requiring additional external circuitry or control signals.
Does TEA1999DB1546 include overtemperature protection?
Yes, TEA1999DB1546 incorporates overtemperature protection (OTP) that activates at 165 °C (typ) junction temperature. When triggered, the OTP circuit actively pulls the GATE pin low to disable the SR MOSFET, preventing thermal runaway. Operation resumes automatically once the junction cools to 145 °C (20 °C hysteresis). This protection is implemented directly in the gate driver stage and responds to excessive load, short-circuit, or poor thermal design-ensuring robust field reliability of TEA1999DB1546 in enclosed adapter environments.
TEA1999DB1546 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Box
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Applications:
- -
- Voltage - Input:
- -
- Voltage - Supply:
- -
- Current - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
TEA1999DB1546 FAQ
1.How can I place an order for TEA1999DB1546 through Aetrix?
Please submit a Request for Quotation (RFQ) for TEA1999DB1546 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TEA1999DB1546 reliable?
The price and inventory of TEA1999DB1546 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TEA1999DB1546 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TEA1999DB1546?
For technical support, including TEA1999DB1546 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TEA1999DB1546 requirements.
6.How does Aetrix verify that TEA1999DB1546 is sourced from the original manufacturer or authorized distributors?
All TEA1999DB1546 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TEA1999DB1546 meets industry standards.
7.What is the process for return or replacement of TEA1999DB1546?
All TEA1999DB1546 units undergo pre-shipment inspection (PSI). If there is an issue with TEA1999DB1546, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TEA1999DB1546 part is unused and in its original packaging.
Return procedure for TEA1999DB1546:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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