STMicroelectronics TESEO-LIV3F
- Part No.:
- TESEO-LIV3F
- Manufacturer:
- STMicroelectronics
- Category:
- RF Receivers
- Package:
- 18-SMD Module
- Datasheet:
-
TESEO-LIV3F.pdf
- Description:
- RF RCVR GNSS/GPS 1.575GHZ 18LCC
- Quantity:
- Payment:

- Shipping:

Inventory:2,065
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TESEO-LIV3F from STMicroelectronics is a certified, standalone GNSS module integrating the Teseo III positioning IC with embedded 26 MHz TCXO and 32 kHz RTC, supporting simultaneous GPS/GLONASS/BeiDou/Galileo/QZSS reception, -163 dBm tracking sensitivity, 1.5 m CEP accuracy, and 16 Mbit Flash for data logging and firmware upgrades - deployed in vehicle tracking, fleet management, and emergency call systems.
For engineers reviewing the TESEO-LIV3F datasheet, TESEO-LIV3F pinout, TESEO-LIV3F application, or TESEO-LIV3F equivalent, this module delivers multiconstellation timing and position solutions with autonomous assisted GNSS, hardware/software standby modes (17 µW / 75 mW), and UART/I²C interfaces - critical for low-power, high-accuracy location-aware designs.
Technical Context
The TESEO-LIV3F implements a fully integrated GNSS receiver architecture with dedicated TCXO for stable clock generation and RTC for reduced TTFF; it supports real-time AGPS, predictive ST-AGPS (up to 14-day orbit prediction), and autonomous assisted GNSS using stored ephemeris.
Its signal chain includes RF_IN input with internal LNA, VCC_RF output for active antenna biasing, and dual power domains (VCC 2.1–4.3 V, VCC_IO 3.3 V); navigation outputs are delivered via NMEA-compliant UART and I²C, with 1PPS timing pulse referenced to UTC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| GNSS Constellations | GPS L1C/A, GLONASS L1OF, BeiDou B1, Galileo E1B/C, QZSS L1C/A - enables robust urban canyon and high-dynamic positioning via concurrent multi-system tracking |
| Tracking Sensitivity | -163 dBm - allows reliable signal acquisition under weak-signal conditions (e.g., indoor, dense foliage, urban canyons) |
| Position Accuracy | 1.5 m CEP (autonomous), <1.5 m CEP with SBAS - meets requirements for insurance telematics and tolling compliance |
| Time To First Fix | Cold start: ≤32 s (GPS+GLONASS), Hot start: ≤1.5 s - accelerated by embedded RTC and predictive AGNSS |
| Power Consumption | 75 mW tracking, 17 µW standby - enables multi-year battery life in asset trackers and pet locators |
| Embedded Memory | 16 Mbit Flash - supports 7-day autonomous assisted GNSS, firmware reconfiguration, and field-upgradable navigation algorithms |
| Operating Temperature | -40°C to +85°C - qualified for automotive-grade deployment in engine bay–adjacent or outdoor-mounted applications |
| Supply Voltage | VCC: 2.1–4.3 V; VCC_IO: 3.3 V - compatible with common Li-ion/LiPo battery stacks and industrial 3.3 V rails |
Pinout & Package
Tiny LCC-18 surface-mount package (9.7 × 10.1 mm), RoHS-compliant, tape-and-reel packaging; requires reflow soldering per JEDEC J-STD-020 profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 10, 12 | GND / GND_RF | Dedicated analog/digital ground separation minimizes RF noise coupling into GNSS front-end |
| 2, 3 | TX / RX | Full-duplex UART interface (3.3 V logic) for NMEA command/response and raw measurement streaming |
| 4 | 1PPS | Precision 1 Hz time pulse synchronized to UTC, ±12.4 ns RMS jitter - used for time-stamping sensors or synchronizing distributed nodes |
| 5 | Wake-Up | Edge-triggered interrupt input enabling ultra-low-power wake-from-standby on motion or external event |
| 6 | Vbatt | Backup supply for RTC retention during main power loss - maintains timekeeping and AGNSS prediction state |
| 7 | VCC_IO | Fixed 3.3 V IO supply - powers digital interface logic and must be decoupled per layout guidelines |
| 8 | VCC | Main supply (2.1–4.3 V) powering RF/analog/digital core - supports direct battery connection without regulator |
| 9 | SYS_RSTn | Active-low hardware reset - initiates full cold start or recovers from lockup without firmware intervention |
| 11 | RF_IN | 50 Ω single-ended GNSS antenna input - accepts signals from passive ceramic patch or active antennas with bias-T |
| 13 | Ant_OFF | Open-drain control output enabling/disabling external active antenna - prevents current draw when module is idle |
| 14 | VCC_RF | 3.3 V regulated output for active antenna biasing - eliminates need for external LDO in antenna path |
| 16, 17 | SDA / SCL | I²C bus (3.3 V) supporting configuration read/write, sensor fusion setup, and firmware update status polling |
Key Features
| Feature | Design Value |
|---|---|
| Multiconstellation Concurrent Tracking | Simultaneous GPS+GLONASS+Galileo or GPS+BeiDou - improves satellite visibility and geometric dilution of precision (GDOP) in obstructed environments |
| Autonomous Assisted GNSS | On-module ephemeris prediction up to 5 days using stored historical data - eliminates dependency on network connectivity for fast TTFF |
| ST-Assisted GPS™ Server Mode | Bi-weekly 8 KB seed download enables 14-day constellation-level orbit prediction - reduces cellular data cost and latency in connected trackers |
| Integrated TCXO & RTC | 26 MHz TCXO ensures ±0.5 ppm frequency stability over temperature; 32 kHz RTC enables sub-second TTFF recovery after power cycle |
| Data Logging Capability | 16 Mbit Flash stores position/time/velocity logs, aiding forensic analysis in insurance black boxes and fleet diagnostics |
| Regulatory Certification | CE-certified module - accelerates end-product certification for ETSI EN 303 413 and RED compliance in EU markets |
Applications
| Insurance Telematics | Fleet Management |
|---|---|
Use Scenario: Real-time mileage, harsh acceleration/braking, and geofence violation logging in OBD-II dongles. IC Role / Device Role / Timing Role: Primary GNSS positioning engine delivering timestamped location fixes at 10 Hz with 1PPS synchronization. Use Value: Enables usage-based insurance (UBI) scoring with <1.5 m CEP accuracy and autonomous 7-day log retention - no cloud dependency for claim verification. |
Use Scenario: Multi-vehicle route optimization, fuel consumption correlation, and driver behavior analytics across regional depots. IC Role / Device Role / Timing Role: Standalone location node feeding CAN or cellular gateway with NMEA GGA/RMC sentences and velocity vectors. Use Value: Reduces average TTFF to <2 s via predictive AGNSS, cutting cellular data overhead by 60% compared to standard A-GPS in rural coverage zones. |
| Emergency Call Systems (eCall) | Pet & Asset Tracking |
Use Scenario: Automatic crash detection triggering GSM call with precise coordinates, heading, and impact severity to PSAP. IC Role / Device Role / Timing Role: Certified GNSS source providing UTC-synchronized position within 100 ms of impact detection via Wake-Up pin. Use Value: Meets UNECE R156 eCall mandate requiring ≤100 m horizontal accuracy and ≤5 s TTFF - validated across -40°C to +85°C operating range. |
Use Scenario: Battery-powered collars or cargo tags reporting location every 6–24 hours with motion-triggered wake-up. IC Role / Device Role / Timing Role: Ultra-low-power positioning subsystem using hardware standby (17 µW) and RTC-driven periodic wake cycles. Use Value: Achieves >3-year battery life on CR2032 using 1PPS-assisted timing and flash-based log buffering - eliminating frequent maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar standalone GNSS module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| u-blox NEO-M9N | Supports GPS/Galileo/BeiDou/GLONASS/QZSS but lacks embedded Flash and predictive AGNSS; uses external TCXO. | No autonomous 7-day logging or serverless ephemeris prediction - requires continuous network assistance for optimal TTFF. | Choose when prioritizing global certification breadth (FCC/IC/ANATEL) over on-module intelligence and offline operation. |
| Quectel L96 | Single-constellation (GPS-only) design; no BeiDou/Galileo support; 2 MB Flash only; no RTC or TCXO integration. | Limited to cost-sensitive, low-accuracy applications like basic vehicle immobilizers - not suitable for EU eCall or UBI. | Choose only for legacy GPS-only deployments where multi-constellation resilience and sub-meter accuracy are non-critical. |
Compared with NEO-M9N and L96, TESEO-LIV3F uniquely integrates predictive AGNSS, 16 Mbit Flash, and certified TCXO/RTC in a compact LCC-18 package - delivering faster TTFF, longer battery life, and regulatory-ready positioning without external components or network dependency.
Availability
TESEO-LIV3F is available at Aetrix Electronics and suitable for vehicle tracking, insurance telematics, and emergency call systems requiring stable component supply, long-term lifecycle assurance, and pre-certified GNSS functionality.
Supply support for TESEO-LIV3F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power management, and analog/mixed-signal ICs for automotive, industrial, and consumer markets.
TESEO-LIV3F belongs to ST's Teseo GNSS product line, engineered specifically for certified, low-power, high-accuracy standalone positioning in safety-critical and battery-operated applications - emphasizing time-to-market reduction through embedded firmware and regulatory readiness.
FAQ
Does TESEO-LIV3F require an external antenna?
Yes - TESEO-LIV3F requires connection to an external GNSS antenna via its 50 Ω RF_IN pin. It supports both passive ceramic patch antennas and active antennas powered through the VCC_RF pin (3.3 V, up to 100 mA). Antenna matching network design must follow ST's reference layout in AN5022 to maintain -163 dBm sensitivity.
Can TESEO-LIV3F operate without a host microcontroller?
No - TESEO-LIV3F is not a self-contained system; it requires a host MCU to send NMEA commands (e.g., $PSTME, $PSTMC), configure constellations, manage firmware updates, and process navigation outputs. However, it performs all GNSS baseband processing, timing, and ephemeris prediction autonomously.
What is the role of the Vbatt pin?
Vbatt supplies backup power (1.8–4.3 V) exclusively to the internal RTC and SRAM holding AGNSS prediction state. When main VCC is removed, Vbatt preserves timekeeping and ephemeris history - enabling hot starts and maintaining up to 5-day autonomous prediction capability without network access.
Is TESEO-LIV3F compliant with EU eCall regulations?
Yes - TESEO-LIV3F is CE-certified per EN 303 413 and supports the mandatory eCall functional requirements: 100 m horizontal accuracy (CEP), ≤5 s TTFF, UTC-synchronized 1PPS output, and operation from -40°C to +85°C. Full eCall system compliance requires integration with a certified GSM module and crash sensor per UNECE R156.
TESEO-LIV3F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 18-SMD Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency:
- 1.575GHz
- Sensitivity:
- -163dBm
- Data Rate (Max):
- -
- Modulation or Protocol:
- BeiDou, Galileo, GLONASS, GNSS, GPS
- Applications:
- General Purpose
- Current - Receiving:
- -
- Data Interface:
- I2C, UART
- Memory Size:
- -
- Antenna Connector:
- Not Included
- Features:
- -
- Voltage - Supply:
- 2.1V ~ 4.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-LCC (9.7x10.1)
TESEO-LIV3F FAQ
1.How can I place an order for TESEO-LIV3F through Aetrix?
Please submit a Request for Quotation (RFQ) for TESEO-LIV3F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESEO-LIV3F reliable?
The price and inventory of TESEO-LIV3F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESEO-LIV3F is usually 5 days.
3.What payment methods are accepted for TESEO-LIV3F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESEO-LIV3F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TESEO-LIV3F?
TESEO-LIV3F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESEO-LIV3F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESEO-LIV3F?
For technical support, including TESEO-LIV3F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESEO-LIV3F requirements.
6.How does Aetrix verify that TESEO-LIV3F is sourced from the original manufacturer or authorized distributors?
All TESEO-LIV3F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESEO-LIV3F meets industry standards.
7.What is the process for return or replacement of TESEO-LIV3F?
All TESEO-LIV3F units undergo pre-shipment inspection (PSI). If there is an issue with TESEO-LIV3F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESEO-LIV3F part is unused and in its original packaging.
Return procedure for TESEO-LIV3F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TESEO-LIV3F Tags

-
MICRF220AYQS-TR
Microchip Technology

-
SX1239IMLTRT
Semtech Corporation

-
SI4356-B1A-FMR
Silicon Labs

-
SI4362-C2A-GMR
Silicon Labs

-
MAX1473EUI+T
Analog Devices Inc./Maxim Integrated

-
CMX992Q3
CML Micro

-
CMX994AQ4
CML Micro

-
MAX2112ETI+
Analog Devices Inc./Maxim Integrated

-
MAX2112ETI+T
Analog Devices Inc./Maxim Integrated

-
TESEO-LIV3R
STMicroelectronics
-
M20048-1
Antenova

-
CMX994EQ4
CML Micro
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

