My Inquiry
My Account
STMicroelectronics TESEO-LIV3FL
- Part No.:
- TESEO-LIV3FL
- Manufacturer:
- STMicroelectronics
- Category:
- RF Receivers
- Package:
- 18-SMD Module
- Datasheet:
-
TESEO-LIV3FL.pdf
- Description:
- TESEO-LIV3FL LOW POWER MODULE
- Quantity:
- Payment:
- Shipping:
Inventory:577
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TESEO-LIV3FL from STMicroelectronics is a certified, standalone GNSS module integrating the Teseo III single-die receiver IC for simultaneous GPS/Galileo/GLONASS/BeiDou/QZSS positioning. It delivers 1.5 m CEP autonomous accuracy, -163 dBm tracking sensitivity, and 16 Mbit embedded Flash for data logging and firmware upgrades in a 9.7 × 10.1 mm LCC-18 package, enabling compact vehicle tracking and drone navigation systems.
For engineers reviewing the TESEO-LIV3FL datasheet, TESEO-LIV3FL pinout, TESEO-LIV3FL application, or TESEO-LIV3FL equivalent, key selection criteria include multiconstellation TTFF performance, RTC-assisted low-power standby (8 μA), SBAS/RTCM differential correction support, and I²C/UART NMEA interface compatibility with host microcontrollers.
Technical Context
The TESEO-LIV3FL implements a temperature-compensated crystal oscillator (TCXO) at 26 MHz to stabilize RF downconversion and minimize time-to-first-fix (TTFF), achieving <2.5 s warm start across all constellations. Its dedicated 32.768 kHz RTC domain maintains timekeeping during hardware standby and enables periodic wake-up for power-constrained asset trackers.
It supports three assisted GNSS modes: autonomous STAGPS® (5-day ephemeris prediction from on-device history), predictive AGNSS (14-day server-based forecasts via 8 KB biweekly seed), and real-time RT-AGPS (server-sourced ephemeris injection). All operate via proprietary NMEA commands over UART or I²C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| GNSS Constellations | Simultaneous GPS L1C/A, Galileo E1B/C, GLONASS L1OF, BeiDou B1, QZSS L1C/A - enables urban canyon resilience and regional coverage optimization |
| Tracking Sensitivity | -163 dBm - allows reliable position lock under weak-signal conditions (e.g., indoor parking garages, dense foliage) |
| Position Accuracy (CEP) | 1.5 m autonomous (GPS+Galileo), <1.5 m with SBAS - meets ISO 16750-4 Class III automotive location requirements |
| Power Consumption | 65 mW tracking, 8 μA standby - supports >1-year battery life in periodic-reporting telematics devices |
| Embedded Memory | 16 Mbit Flash - stores 7 days of 1 Hz log-type-1 data or firmware images for field-upgradable navigation stacks |
| Operating Temperature | -40 °C to +85 °C - qualified for under-hood automotive and outdoor industrial deployment without external thermal management |
| Timing Output | 1PPS with ±12.4 ns RMS jitter (GPS) - provides traceable UTC synchronization for time-critical IoT gateways and emergency call (eCall) modules |
Pinout & Package
Tiny 18-pin LCC package (9.7 × 10.1 × 2.3 mm), surface-mount, lead-free, RoHS-compliant. Exposed pad not electrically connected; no thermal pad requirement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 10, 12 | GND / GND_RF | Dedicated RF and digital ground planes - must be separated on PCB to prevent noise coupling into GNSS front-end |
| 2, 3 | TX / RX | Full-duplex UART interface (NMEA output/input) - supports 115.2 kbps default baud rate; TX floats when unused |
| 4 | 1PPS | Precision timing pulse synchronized to GPS time - used for timestamping sensor events or synchronizing distributed nodes |
| 5 | Wake-Up | Active-low interrupt input - triggers fast reacquisition from software/hardware standby without full power cycle |
| 6 | Vbatt | Backup supply (1.75–4.2 V) - maintains RTC and SRAM during main power loss; enables <2 s hot start recovery |
| 7, 8 | VCC_IO / VCC | Separate 1.8 V / 3.3 V IO and core supplies - allows direct interfacing with 1.8 V logic or 3.3 V host MCU without level shifters |
| 9 | nReset | Active-low reset input - drives hardware standby mode when pulled low; must float or be pulled high during normal operation |
| 11 | RF_IN | 50 Ω single-ended GNSS antenna input - requires matching network per layout guidelines; sensitive to impedance discontinuities |
| 13, 14 | Ant_OFF / VCC_RF | Active antenna control and bias supply - VCC_RF powers external LNA; Ant_OFF disables antenna when module is idle |
| 16, 17 | SDA / SCL | I²C slave interface (100/400 kHz) - used for configuration, geofence setup, and odometer control; shares bus with other peripherals |
Key Features
| Feature | Design Value |
|---|---|
| STAGPS® Autonomous Prediction | 5-day ephemeris forecast generated on-device using historical sky observations - eliminates cellular dependency for cold-start acceleration |
| RTC-Assisted Standby | Hardware/software standby with sub-2-second wake-to-fix - enables battery-powered trackers to report position every 5 minutes with multi-year lifespan |
| Configurable Data Logging | Circular or standard buffer with 3 log formats (12–20 bytes/fix); supports odometer-triggered alarms and geofence entry/exit notifications |
| Dual-Mode AGNSS | Seamless fallback between 14-day server forecasts and 5-day self-sustaining prediction - maintains performance during intermittent connectivity outages |
| SBAS & RTCM Support | WAAS/EGNOS/GAGAN/MSAS corrections + RTCM 2.3 messages (types 1, 9, 31, 34) - improves accuracy to <1.5 m CEP in open-sky and suburban environments |
Applications
| Vehicle Telematics | Fleet Management |
|---|---|
|
Use Scenario: Real-time GPS tracking of commercial delivery vans with periodic position reporting and ignition-state detection. IC Role / Device Role / Timing Role: Primary GNSS positioning engine with 1PPS-synchronized event logging and RTC-driven wake scheduling. Use Value: Achieves <2.5 s warm TTFF and 1.5 m CEP accuracy even after overnight parking, reducing dispatch latency and route deviation alerts. |
Use Scenario: Centralized monitoring of municipal bus locations, arrival time prediction, and driver behavior analytics. IC Role / Device Role / Timing Role: High-integrity timing source and multiconstellation position resolver feeding CAN bus telemetry via host MCU. Use Value: SBAS-enhanced accuracy ensures precise stop-level arrival validation; embedded Flash stores 7-day trip logs for compliance auditing. |
| Drone Navigation | Personal Safety Devices |
|
Use Scenario: Indoor-outdoor transition navigation for delivery drones operating in urban canyons and warehouse loading docks. IC Role / Device Role / Timing Role: Multiconstellation receiver with QZSS augmentation and predictive AGNSS for rapid signal reacquisition after signal loss. Use Value: -163 dBm sensitivity and TCXO stability maintain lock during rapid maneuvers; 8 μA standby extends flight battery runtime between missions. |
Use Scenario: Wearable panic button with automatic fall detection and emergency location transmission via LTE-M/NB-IoT. IC Role / Device Role / Timing Role: Low-power GNSS engine with hardware standby and wake-on-motion triggering via host accelerometer. Use Value: Sub-2 s hot start ensures immediate location fix upon activation; geofence-triggered alerts notify caregivers when user exits safe zones. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar standalone GNSS module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| u-blox NEO-M8N | LCC-18, GPS/Galileo/GLONASS/BeiDou, -160 dBm tracking, no embedded Flash, 12 μA standby | Lacks onboard data logging and STAGPS® autonomous prediction; requires external memory and host-based assistance logic | Select when cost-sensitive designs prioritize minimal BOM count over field-upgradable firmware or offline prediction capability |
| Quectel L76-L | LCC-18, GPS/GLONASS/BeiDou, -165 dBm tracking, 4 MB Flash, -40°C to +85°C, no QZSS/SBAS | Higher sensitivity but lacks QZSS and SBAS support; limited RTCM message set (no type 34 GLONASS corrections) | Select for Asia-Pacific deployments where BeiDou dominance outweighs need for EGNOS/WAAS correction or Pacific-region QZSS augmentation |
Compared with NEO-M8N and L76-L, TESEO-LIV3FL uniquely integrates 16 Mbit Flash, STAGPS® autonomous prediction, and full SBAS/RTCM 2.3 support - making it optimal for battery-constrained, certification-ready applications requiring zero-host firmware logic and guaranteed sub-2.5 s TTFF.
Availability
TESEO-LIV3FL is available at Aetrix Electronics and suitable for vehicle tracking, drone navigation, fleet telematics, and personal safety devices requiring stable component supply across automotive, logistics, and consumer electronics programs.
Supply support for TESEO-LIV3FL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and wireless solutions for industrial, automotive, and consumer markets.
The TESEO product line delivers certified, ready-to-deploy GNSS modules optimized for rapid integration into safety-critical and battery-operated location-aware systems - emphasizing low-power autonomy, regulatory compliance, and multiconstellation robustness.
FAQ
What GNSS constellations does TESEO-LIV3FL support simultaneously?
TESEO-LIV3FL supports concurrent reception of GPS L1C/A, Galileo E1B/C, GLONASS L1OF, BeiDou B1, and QZSS L1C/A signals. Firmware configuration allows selective activation of constellations - default is GPS+GLONASS - enabling optimization for regional coverage, urban multipath rejection, or signal availability in obstructed environments.
How does the embedded 16 Mbit Flash enhance system design?
The 16 Mbit Flash enables local storage of GNSS position logs (up to 7 days at 1 Hz), firmware updates without external memory, and persistent configuration parameters. It eliminates the need for host MCU flash expansion and supports autonomous data buffering during cellular outages - critical for asset trackers and emergency beacons.
What power modes does TESEO-LIV3FL offer, and how do they differ?
TESEO-LIV3FL provides hardware standby (nReset=0 V, VCC/VCC_IO/VBAT active), software standby (host-commanded, RTC-timed), and hardware off standby (VCC/VCC_IO off, VBAT only). Hardware standby draws 8 μA and retains RTC state; hardware off standby draws <1 μA but requires full reinitialization on wake.
Is TESEO-LIV3FL certified for CE and automotive use?
Yes - TESEO-LIV3FL holds CE marking per RED 2014/53/EU, EN 62368-1:2020+A11:2020, and ETSI EN 301 489-1/19. It operates from -40°C to +85°C and meets ISO 16750-4 for automotive environments. Full conformity documentation is published on st.com/teseo-liv3fl.
TESEO-LIV3FL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 18-SMD Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency:
- -
- Sensitivity:
- -163dBm
- Data Rate (Max):
- -
- Modulation or Protocol:
- BeiDou, Galileo, GLONASS, GNSS, GPS
- Applications:
- GPS
- Current - Receiving:
- -
- Data Interface:
- I2C, UART
- Memory Size:
- -
- Antenna Connector:
- Not Included
- Features:
- -
- Voltage - Supply:
- 1.75V ~ 4.2V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-LCC (9.7x10.1)
TESEO-LIV3FL FAQ
1.How can I place an order for TESEO-LIV3FL through Aetrix?
Please submit a Request for Quotation (RFQ) for TESEO-LIV3FL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TESEO-LIV3FL reliable?
The price and inventory of TESEO-LIV3FL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TESEO-LIV3FL is usually 5 days.
3.What payment methods are accepted for TESEO-LIV3FL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TESEO-LIV3FL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TESEO-LIV3FL?
TESEO-LIV3FL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TESEO-LIV3FL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TESEO-LIV3FL?
For technical support, including TESEO-LIV3FL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TESEO-LIV3FL requirements.
6.How does Aetrix verify that TESEO-LIV3FL is sourced from the original manufacturer or authorized distributors?
All TESEO-LIV3FL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TESEO-LIV3FL meets industry standards.
7.What is the process for return or replacement of TESEO-LIV3FL?
All TESEO-LIV3FL units undergo pre-shipment inspection (PSI). If there is an issue with TESEO-LIV3FL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TESEO-LIV3FL part is unused and in its original packaging.
Return procedure for TESEO-LIV3FL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TESEO-LIV3FL Tags
-
MICRF220AYQS-TR
Microchip Technology
-
SX1239IMLTRT
Semtech Corporation
-
SI4356-B1A-FMR
Silicon Labs
-
SI4362-C2A-GMR
Silicon Labs
-
MAX1473EUI+T
Analog Devices Inc./Maxim Integrated
-
CMX992Q3
CML Micro
-
CMX994AQ4
CML Micro
-
MAX2112ETI+
Analog Devices Inc./Maxim Integrated
-
MAX2112ETI+T
Analog Devices Inc./Maxim Integrated
-
TESEO-LIV3R
STMicroelectronics
-
M20048-1
Antenova
-
CMX994EQ4
CML Micro
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
