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NXP Semiconductors TFF1012HN/N1,135

Part No.:
TFF1012HN/N1,135
Manufacturer:
NXP Semiconductors
Category:
RF Mixers
Package:
16-VFQFN Exposed Pad
Datasheet:
AetrixTFF1012HN/N1,135.pdf
Description:
IC DOWNCONVERTER 16DHVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,480

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Product details

Overview

TFF1012HN/N1,135 from NXP Semiconductors is an integrated Ku-band downconverter IC for satellite LNB applications, combining low-noise pre-amplifier, mixer, buffer amplifier, and PLL synthesizer in a single DHVQFN16 package. It operates across 10.7–12.75 GHz RF input, delivers 30 dB typical conversion gain, achieves 9 dB SSB noise figure, and supports dual LO frequencies (9.75 GHz / 10.6 GHz) under 5 V supply with 52 mA typical current draw.

For engineers reviewing the TFF1012HN/N1,135 datasheet, TFF1012HN/N1,135 pinout, TFF1012HN/N1,135 application, or TFF1012HN/N1,135 equivalent, this page provides verified technical context, pin-level design meaning, real-world DVB-S/S2 LNB use cases, and validated alternative options for Ku-band receiver front-end design.

Technical Context

The TFF1012HN/N1,135 integrates a pHEMT-based LNA, double-balanced passive mixer, and fully integrated PLL with crystal-controlled 25 MHz reference and programmable divider to generate precise 9.75 GHz or 10.6 GHz LO signals. Its alignment-free architecture eliminates external tuning components.

It features internal regulated voltage generation for PLL loop filter (VREG pin), HB pin-controlled band switching between low-band (10.7–11.7 GHz) and high-band (11.7–12.75 GHz), and RF/IF ports matched to 50 Ω and 75 Ω respectively - enabling direct interface with CPW-fed antenna inputs and coaxial IF outputs.

Key Specifications

Parameter Value and Actual Design Meaning
RF Input Range 10.7–12.75 GHz (split into low/high bands); enables full Ku-band satellite signal capture per DVB-S/S2 standards.
LO Frequency 9.75 GHz (low band) or 10.6 GHz (high band); selected via HB pin logic, eliminating need for external LO source.
Conversion Gain 30 dB typical; sufficient to drive standard 75 Ω IF distribution without additional amplification.
Noise Figure 9 dB SSB; ensures high signal-to-noise ratio in weak-signal satellite reception environments.
Supply Voltage 4.5–5.5 V; single-rail operation simplifies power design versus multi-voltage LNB solutions.
Supply Current 52 mA typical; enables low-power LNB designs compliant with EN 50494/50600 power-over-coax limits.
Crystal Reference 25 MHz ±10 pF load capacitance; low-cost, industry-standard crystal reduces BOM cost and sourcing complexity.

Pinout & Package

Package: DHVQFN16 (SOT763-1), 2.5 × 3.5 × 0.85 mm, thermally enhanced with exposed die pad (GND, pin 0) for RF grounding and thermal dissipation.

Pin/Terminal Circuit Role Design Meaning
RF (4) RF input port Accepts 10.7–12.75 GHz satellite signal via CPW trace; requires AC coupling and impedance-matched layout to 50 Ω.
IF (14) IF output port Delivers 950–2150 MHz downconverted signal; designed for direct 75 Ω coaxial cable interface.
HB (10) Band selection control Logic-level input (0.8 V LOW / 2.0 V HIGH) that switches LO between 9.75 GHz and 10.6 GHz for band selection.
XO1 (12), XO2 (11) Crystal oscillator terminals Connects to 25 MHz fundamental-mode crystal; internal PLL uses this reference to synthesize exact LO frequencies.
VCC (16) Power supply input Single 5 V rail powers entire IC including LNA, mixer, PLL, and buffer; decoupling to GND required near pin.
GND (0), RF_GND1–3 (1–2,5), GND1 (6), GND2 (13), IF_GND (15) Ground terminals Multiple dedicated RF/IF/digital grounds tied to exposed die pad; mandatory for noise suppression and impedance stability.

Key Features

Feature Design Value
Integrated PLL + Mixer + LNA Eliminates discrete LO synthesis, filtering, and amplification stages - reduces PCB area by >40% vs. hybrid solutions.
Flat gain over frequency ±2.0 dB variation across full IF band (950–2150 MHz), ensuring consistent signal level for demodulator AGC stability.
Low phase noise (1.4° RMS) Minimizes constellation rotation in QPSK/8PSK DVB-S2 signals, directly improving BER performance at low C/N.
ESD protection on all pins HBM ≥2 kV on all I/O pins - enables robust handling during LNB assembly and field installation without extra protection devices.
Alignment-free concept No external tuning capacitors or inductors required; production calibration not needed, lowering test time and cost.

Applications

DVB-S/S2 Satellite Receiver LNB Multi-Switch LNB Systems

Use Scenario: Front-end downconversion in consumer satellite dish LNBs receiving broadcast signals from geostationary satellites.

IC Role / Device Role / Timing Role: Integrated downconverter providing RF-to-IF translation, LO generation, and gain staging in single chip.

Use Value: Enables compact, low-cost, high-reliability LNB modules meeting ETSI EN 50494 Class A spectral mask and noise requirements.

Use Scenario: Centralized LNB unit distributing signals to multiple receivers via multiswitch infrastructure.

IC Role / Device Role / Timing Role: Dual-band downconverter supporting tone-switched band selection (22 kHz) and polarization control.

Use Value: Delivers stable 950–2150 MHz IF output across temperature (−40°C to +85°C), ensuring uninterrupted multi-room viewing.

Commercial VSAT Terminals Professional Satellite Monitoring Receivers

Use Scenario: Receive-only terminals for enterprise data backhaul or IP video distribution in remote locations.

IC Role / Device Role / Timing Role: High-linearity downconverter (IP3o = 17.5 dBm) preserving modulation fidelity in dense-spectrum environments.

Use Value: Maintains >30 dB image rejection and −10 dB input/output return loss, reducing adjacent-channel interference in shared dishes.

Use Scenario: Lab-grade or field-deployable satellite spectrum analyzers and signal monitors.

IC Role / Device Role / Timing Role: Precision downconverter with low spurious (<−60 dBc) and integrated phase noise density (1.4° RMS).

Use Value: Supports accurate carrier-to-noise measurement and modulation quality analysis without external LO cleanup.

Equivalent & Alternatives

The following parts are listed as comparable options for similar satellite downconverter applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX21002ETX+ Requires external VCO and loop filter; no integrated crystal oscillator; 3.3 V only; smaller 4×4 mm TQFN. Lacks built-in 25 MHz crystal interface and band-switching logic; needs external tone decoder for HB control. Select when board space is critical and existing 3.3 V infrastructure exists; accept added component count and layout sensitivity.
STV0902B Separate LNA + mixer + PLL ICs; supports wider 950–2150 MHz IF but no integrated RF input matching network. Requires external 50 Ω RF balun and IF filtering; higher external component count increases cost and size. Choose for legacy designs already using ST's satellite tuner ecosystem or where IF flexibility beyond 2150 MHz is required.

Compared with MAX21002ETX+ and STV0902B, the TFF1012HN/N1,135 offers lowest system-level BOM count and smallest footprint for Ku-band LNBs due to its monolithic integration of crystal oscillator, PLL, mixer, and LNA - reducing design risk and qualification time for DVB-S/S2 compliance.

Availability

TFF1012HN/N1,135 is available at Aetrix Electronics and suitable for satellite TV reception systems, professional VSAT terminals, and multi-switch LNB deployments requiring stable component supply, long-term lifecycle support, and consistent electrical performance across production batches.

Supply support for TFF1012HN/N1,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The TFF1012HN/N1,135 belongs to NXP's satellite receiver front-end product line, engineered specifically to replace discrete LNB architectures with highly integrated, production-ready downconverters for DVB-S/S2 broadcast systems.

FAQ

What is the primary function of the TFF1012HN/N1,135 in a satellite LNB system?

The TFF1012HN/N1,135 serves as a fully integrated Ku-band downconverter IC in satellite LNB systems, performing low-noise amplification, frequency mixing, and PLL-based local oscillator synthesis in a single DHVQFN16 package. It converts incoming 10.7–12.75 GHz RF signals to standard 950–2150 MHz IF outputs while maintaining 9 dB noise figure and 30 dB conversion gain - making it central to DVB-S/S2 signal integrity and sensitivity.

How does the HB pin control band selection in the TFF1012HN/N1,135?

The HB (High Band) pin on the TFF1012HN/N1,135 is a digital control input that selects between two LO frequencies: applying a logic HIGH (≥2.0 V) configures the internal PLL for 10.6 GHz LO (high band, 11.7–12.75 GHz RF), while a logic LOW (≤0.8 V) sets 9.75 GHz LO (low band, 10.7–11.7 GHz RF). This enables seamless band switching in tone-controlled LNB systems without external circuitry.

What crystal specifications are required for proper operation of the TFF1012HN/N1,135?

The TFF1012HN/N1,135 requires a 25 MHz fundamental-mode crystal with 10 pF load capacitance and ≤40 Ω ESR, connected between XO1 (pin 12) and XO2 (pin 11). This crystal serves as the reference for the internal PLL, which divides and multiplies to generate precise 9.75 GHz or 10.6 GHz LO frequencies - deviation outside these specs risks LO inaccuracy and degraded phase noise performance.

Can the TFF1012HN/N1,135 operate from a 3.3 V supply?

No, the TFF1012HN/N1,135 is specified for 4.5–5.5 V operation only. Its internal LNA, mixer, and PLL circuits are optimized for 5 V biasing, and operation below 4.5 V may cause gain compression, increased noise figure, or PLL unlock. The datasheet explicitly defines VCC min as 4.5 V, and no 3.3 V characterization data is provided for the TFF1012HN/N1,135.

What thermal considerations apply to the TFF1012HN/N1,135 in sealed LNB housings?

The TFF1012HN/N1,135 has a junction-to-case thermal resistance (Rth(j-c)) of 35 K/W and is rated for operation from −40°C to +85°C ambient. In sealed LNB enclosures, thermal performance depends on soldering the exposed die pad (GND, pin 0) to a large copper pour connected to chassis ground. Without adequate thermal vias and copper area, junction temperature rise may exceed limits during continuous high-gain operation.

TFF1012HN/N1,135 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
16-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
RF Type:
Ku-Band
Frequency:
10.7GHz ~ 12.75GHz
Number of Mixers:
1
Gain:
30dB
Noise Figure:
9dB
Secondary Attributes:
-
Current - Supply:
52mA
Voltage - Supply:
5V
Mounting Type:
Surface Mount
Supplier Device Package:
16-DHVQFN (2.5x3.5)

TFF1012HN/N1,135 FAQ

1.How can I place an order for TFF1012HN/N1,135 through Aetrix?

Please submit a Request for Quotation (RFQ) for TFF1012HN/N1,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TFF1012HN/N1,135 reliable?

The price and inventory of TFF1012HN/N1,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TFF1012HN/N1,135 is usually 5 days.

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TFF1012HN/N1,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TFF1012HN/N1,135 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TFF1012HN/N1,135?

For technical support, including TFF1012HN/N1,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TFF1012HN/N1,135 requirements.

6.How does Aetrix verify that TFF1012HN/N1,135 is sourced from the original manufacturer or authorized distributors?

All TFF1012HN/N1,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TFF1012HN/N1,135 meets industry standards.

7.What is the process for return or replacement of TFF1012HN/N1,135?

All TFF1012HN/N1,135 units undergo pre-shipment inspection (PSI). If there is an issue with TFF1012HN/N1,135, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TFF1012HN/N1,135 part is unused and in its original packaging.

Return procedure for TFF1012HN/N1,135:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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