Texas Instruments THS1206CDAR
- Part No.:
- THS1206CDAR
- Manufacturer:
- Texas Instruments
- Category:
- Analog to Digital Converters (ADC)
- Package:
- 32-TSSOP (0.240", 6.10mm Width)
- Datasheet:
-
THS1206CDAR.pdf
- Description:
- IC ADC 12BIT PIPELINED 32TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,538
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
THS1206CDAR from Texas Instruments is a 12-bit, 6 MSPS simultaneous-sampling analog-to-digital converter with four analog inputs, internal 1.5 V/3.5 V references (±5% accuracy, 50 ppm/°C), and integrated 16-word FIFO. It operates on a single 5-V analog supply and supports 3-V or 5-V digital interfaces. Used in radar front-ends where synchronized multi-channel acquisition at >2 MHz input frequency is required.
For engineers reviewing the THS1206CDAR datasheet, THS1206CDAR pinout, THS1206CDAR application, or THS1206CDAR equivalent, key selection criteria include simultaneous 4-channel sampling capability, differential/nonlinear error ≤ ±1 LSB, SNR ≥ 68 dB at 2 MHz, and TSSOP-32 package compatibility with glueless DSP/microcontroller interfacing.
Technical Context
The THS1206CDAR implements a multistage pipelined ADC architecture with output error correction logic to guarantee no missing codes across 0°C to 70°C. It supports two conversion modes: internally clocked single-conversion mode (up to 3 MSPS per channel) and externally clocked continuous-conversion mode (up to 6 MSPS aggregate, 1.5–6 MSPS per channel depending on channel count).
Input configuration is programmable per channel-single-ended or differential-with auto-scan support for 2–4 inputs. The integrated FIFO buffers converted data to decouple timing from host processor reads, while dual reference pins (REFP/REFM) allow optional external reference substitution for improved DC accuracy or temperature drift performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 12-bit - delivers 4096 discrete amplitude levels for high-fidelity signal digitization |
| Sampling Rate | 6 MSPS aggregate - enables real-time capture of signals up to Nyquist-limited 3 MHz bandwidth |
| DNL / INL | ±1 LSB / ±1.5 LSB - ensures monotonicity and <0.025% full-scale linearity error for precision measurement |
| SNR @ 2 MHz | 68 dB - corresponds to ~11.3 effective bits for clean baseband signal recovery |
| Reference Accuracy | ±5% with 50 ppm/°C drift - supports stable calibration over commercial temperature range |
| Power Dissipation | 216 mW max - enables integration into power-constrained DSP front-end systems |
| FIFO Depth | 16 × 12-bit words - absorbs burst data without requiring immediate host read response |
Pinout & Package
THS1206CDAR is housed in a 32-pin TSSOP (DA) package with 0.65 mm pitch, 11.3 mm × 4.4 mm body size, and exposed thermal pad (not electrically connected). Pin assignments are validated per TI SLAS217H datasheet Figure 1 and Terminal Functions table.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| AINP/AINM, BINP/BINM (Pins 32,31,30,29) | Differential or single-ended analog inputs | Four fully independent channels; simultaneous sampling with configurable input topology per channel |
| CONV_CLK / CONVST (Pin 15) | Mode-selectable clock/start input | Functions as external clock in continuous mode; falling-edge-triggered start in single-conversion mode |
| DATA_AV (Pin 16) | FIFO status indicator | Configurable active-high/low pulse or level signal indicating valid data ready for read |
| D0–D11 (Pins 1–6,9–14) | Parallel data/address bus | 12-bit bidirectional data path; D10/D11 double as register address lines RA0/RA1 for control register access |
| REFP / REFM (Pins 26,25) | Reference voltage inputs | Accept internal 3.5 V / 1.5 V or external reference sources; bypass capacitors required |
| CS0 / CS1 (Pins 22,21) | Chip select inputs | Active-low CS0 and active-high CS1 enable three-state bus operation and device addressing |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous 4-channel sampling | Enables phase-coherent acquisition across multiple sensors without time-skew compensation |
| Programmable input configuration | Each channel independently set to single-ended or differential mode via control registers |
| Glueless DSP interface | Direct connection to TI C5x/C6x DSPs using standard strobes and data bus-no external logic required |
| Auto-scan mode | Hardware-controlled sequential sampling of 2–4 selected inputs reduces software overhead in monitoring applications |
| Internal voltage references | On-chip 1.5 V and 3.5 V references eliminate need for external precision reference ICs in cost-sensitive designs |
Applications
| Radar Signal Acquisition | Communications Baseband Processing |
|---|---|
Use Scenario: Digitizing I/Q outputs from quadrature downconverters in pulsed Doppler radar receivers. IC Role / Device Role / Timing Role: Simultaneous sampling of two differential IF channels (A and B) at 6 MSPS aggregate rate with sub-ns aperture jitter. Use Value: Preserves phase relationship between channels for accurate angle-of-arrival estimation; 68 dB SNR supports detection of weak targets amid clutter. | Use Scenario: Capturing multi-carrier OFDM symbols in broadband wireless infrastructure transceivers. IC Role / Device Role / Timing Role: Front-end ADC for dual-path receive chain-sampling two antenna branches synchronously at 3 MSPS each. Use Value: Enables MIMO processing with deterministic inter-channel timing; 12-bit resolution maintains EVM compliance for 64-QAM modulation. |
| Industrial Motor Control Feedback | Automotive Battery Management System |
Use Scenario: Sampling current and voltage feedback from three-phase inverter legs in servo drives. IC Role / Device Role / Timing Role: Simultaneous capture of three isolated analog inputs (phase A/B/C currents) plus DC bus voltage in single-conversion mode. Use Value: Eliminates sampling skew-induced torque ripple; auto-scan mode allows cyclic monitoring without CPU intervention. | Use Scenario: Monitoring cell voltages and pack temperature sensors in high-voltage EV battery packs. IC Role / Device Role / Timing Role: High-accuracy, low-drift ADC for 12-cell stack with internal reference used to minimize external component count. Use Value: ±1.5 LSB INL ensures <10 mV absolute voltage error across –40°C to 85°C; TSSOP package supports compact PCB layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed simultaneous-sampling ADC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADS8556IPMR | 6-channel, 16-bit, 650 kSPS, SAR architecture; requires external reference and separate power supplies | Better DC accuracy but lower speed; suited for precision data acquisition, not RF/IF sampling | Select when resolution >12-bit and throughput <1 MSPS per channel is acceptable |
| THS12082CDAR | 8-channel, 12-bit, 6 MSPS, same pinout and register map; adds channel sequencing and enhanced FIFO control | Drop-in upgrade path with identical footprint and software compatibility; higher channel density | Choose for new designs needing >4 channels without redesigning layout or firmware |
Compared with THS1206CDAR, ADS8556IPMR trades speed for resolution and linearity, while THS12082CDAR extends functionality within the same family-both require evaluation against system-level timing, power, and channel-count requirements.
Availability
THS1206CDAR is available at Aetrix Electronics and suitable for radar signal acquisition, communications baseband processing, and industrial motor control applications requiring stable component supply and long-term production continuity.
Supply support for THS1206CDAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in precision signal chain solutions.
The THS1206CDAR belongs to TI's high-speed data converter product line, designed specifically for demanding real-time acquisition in radar, instrumentation, and communications systems where simultaneous multi-channel sampling and low-latency interface are critical.
FAQ
What is the maximum sampling rate per channel for THS1206CDAR in continuous conversion mode?
The THS1206CDAR achieves up to 6 MSPS aggregate sampling, with per-channel rates dependent on active channel count: 6 MSPS for 1 channel, 3 MSPS for 2 channels, 2 MSPS for 3 channels, and 1.5 MSPS for 4 channels. This scaling results from the fixed pipeline latency and FIFO depth-each additional channel shares the same conversion clock cycle, reducing individual channel throughput proportionally. THS1206CDAR's architecture ensures all enabled channels sample simultaneously on every clock edge.
Does THS1206CDAR support differential input configurations?
Yes, THS1206CDAR supports differential inputs on both channel pairs: AINP/AINM and BINP/BINM. Each pair can be independently configured as differential or single-ended via control register settings. In differential mode, the device achieves 65 dB SINAD and –70 dB THD at 2 MHz input frequency-superior to single-ended performance-making THS1206CDAR suitable for noise-sensitive applications like communications receivers where common-mode rejection is essential.
How does the internal FIFO in THS1206CDAR reduce host processor load?
The THS1206CDAR integrates a 16-word deep × 12-bit FIFO that buffers converted samples before host readout. This eliminates the need for precise timing synchronization between conversion completion and processor access-host can read data at its own pace as long as FIFO doesn't overflow. DATA_AV signaling indicates valid entries, enabling interrupt-driven or polling-based retrieval. For THS1206CDAR, this reduces software overhead in real-time systems where deterministic latency is critical, such as motor control feedback loops.
Can THS1206CDAR operate with an external reference voltage?
Yes, THS1206CDAR accepts external reference voltages applied to REFP and REFM pins, overriding the internal 3.5 V / 1.5 V references. This is configured via bit 0 of control register 0. External referencing improves DC accuracy and temperature stability when high-precision applications demand better than ±5% initial tolerance or 50 ppm/°C drift. THS1206CDAR requires 10 µF bypass capacitors on both REFP and REFM to AGND for noise suppression and stability.
What is the operating temperature range for THS1206CDAR?
THS1206CDAR is rated for operation from 0°C to 70°C ambient temperature-the commercial grade variant denoted by the "C" suffix in the part number. This range is validated per TI's recommended operating conditions and absolute maximum ratings. Thermal derating applies above 25°C ambient: power dissipation decreases linearly from 1453 mW at 25°C to 930 mW at 70°C. THS1206CDAR's TSSOP package provides adequate thermal performance for convection-cooled PCB layouts within this range.
THS1206CDAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 32-TSSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Number of Bits:
- 12
- Sampling Rate (Per Second):
- 6M
- Number of Inputs:
- 2, 4
- Input Type:
- Differential, Single Ended
- Data Interface:
- Parallel
- Configuration:
- S/H-MUX-ADC
- Ratio - S/H:ADC:
- 4:1
- Number of A/D Converters:
- 1
- Architecture:
- Pipelined
- Reference Type:
- External, Internal
- Voltage - Supply, Analog:
- 5V
- Voltage - Supply, Digital:
- 3V ~ 5.25V
- Features:
- Simultaneous Sampling
- Operating Temperature:
- 0°C ~ 70°C
- Supplier Device Package:
- 32-TSSOP
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
THS1206CDAR FAQ
1.How can I place an order for THS1206CDAR through Aetrix?
Please submit a Request for Quotation (RFQ) for THS1206CDAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS1206CDAR reliable?
The price and inventory of THS1206CDAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS1206CDAR is usually 5 days.
3.What payment methods are accepted for THS1206CDAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS1206CDAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS1206CDAR?
THS1206CDAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS1206CDAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS1206CDAR?
For technical support, including THS1206CDAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS1206CDAR requirements.
6.How does Aetrix verify that THS1206CDAR is sourced from the original manufacturer or authorized distributors?
All THS1206CDAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS1206CDAR meets industry standards.
7.What is the process for return or replacement of THS1206CDAR?
All THS1206CDAR units undergo pre-shipment inspection (PSI). If there is an issue with THS1206CDAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS1206CDAR part is unused and in its original packaging.
Return procedure for THS1206CDAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
THS1206CDAR Tags

-
ADC081C021CIMKX/NOPB
Texas Instruments

-
MCP3021A5T-E/OT
Microchip Technology

-
TLA2024IRUGR
Texas Instruments

-
MCP3221A5T-E/OT
Microchip Technology

-
MCP3221A5T-I/OT
Microchip Technology

-
MCP3221A4T-E/OT
Microchip Technology

-
MCP3221A6T-E/OT
Microchip Technology

-
MCP3221A0T-E/OT
Microchip Technology

-
MCP3221A1T-E/OT
Microchip Technology

-
ADC121S021CIMFX/NOPB
Texas Instruments

-
MCP3001-I/MS
Microchip Technology

-
MCP3001-I/SN
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

