Texas Instruments THS3001HVCDGNR

Overview

THS3001HVCDGNR from Texas Instruments is a high-speed current-feedback operational amplifier designed for large-signal, wideband analog signal conditioning in communication, imaging, and video systems. It delivers 420MHz small-signal bandwidth (G = 1), 6500V/μs slew rate at ±15V supplies, 40ns settling time (0.1%), ≤3mV input offset voltage, and –96dBc THD at 1MHz - enabling ultra-fast ADC/DAC buffering and base station IF amplification.

For engineers reviewing the THS3001HVCDGNR datasheet, THS3001HVCDGNR pinout, THS3001HVCDGNR application, or THS3001HVCDGNR equivalent, key selection criteria include its current-feedback architecture, HVSSOP-8 thermal performance (R_θJA = 56.9°C/W), ±4.5V to ±16V dual-supply operation, and verified video-grade distortion metrics (0.01% differential gain, 0.02° differential phase).

Technical Context

The THS3001HVCDGNR employs a dielectrically isolated complementary bipolar (HVBiCOM) process with GHz f_T transistors, enabling true current-feedback topology where bandwidth is set primarily by feedback resistor value-not gain-allowing independent optimization of speed and closed-loop gain. Its transresistance-based architecture yields low input impedance at the inverting node (~15Ω) and high impedance at the noninverting node (~1.5MΩ), requiring asymmetric feedback networks for stability.

It operates in a single functional mode across ±4.5V to ±16V supplies or 9V–32V single supply, with internal biasing optimized for fast transient response and minimal slewing-induced distortion. Thermal design is critical: junction temperature must remain ≤125°C for long-term reliability, and the HVSSOP-8 package's R_θJB = 29.6°C/W supports board-level heat sinking in high-power-density layouts.

Key Specifications

Pinout & Package

HVSSOP-8 (DGN) package: 3mm × 4.9mm body, 0.5mm pitch, exposed thermal pad (connected to VCC– internally per TI layout guidelines).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed current-feedback amplifier applications.

Compared with THS3001HVCDGNR, THS3091DR trades bandwidth for faster edge response in narrow-pulse systems, while LMH6723MA/NOPB sacrifices both bandwidth and distortion performance to achieve ultra-low quiescent current - making THS3001HVCDGNR the optimal choice for wideband, low-distortion applications demanding 420MHz bandwidth and –96dBc THD.

Availability

THS3001HVCDGNR is available at Aetrix Electronics and suitable for communications infrastructure, medical imaging, broadcast video, and high-speed data acquisition systems requiring stable component supply and guaranteed long-term manufacturability.

Supply support for THS3001HVCDGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed amplifier design and manufacturing.

The THS3001HVCDGNR belongs to TI's high-speed current-feedback amplifier product line, engineered specifically for wideband, low-distortion signal conditioning in demanding RF, video, and test equipment applications.

FAQ

What is the maximum recommended feedback resistor value for stable operation of the THS3001HVCDGNR?

The THS3001HVCDGNR achieves optimal stability and bandwidth with a 1kΩ feedback resistor at G = 1. Increasing R_F beyond 1kΩ reduces bandwidth and degrades phase margin; values above 1.5kΩ risk oscillation. For G = 2, TI specifies 680Ω (±15V) or 750Ω (±5V) as maximum stable values. Always use 1% tolerance metal-film resistors placed adjacent to the inverting input pin to minimize parasitic inductance.

Does the THS3001HVCDGNR support single-supply operation, and what is the minimum usable supply voltage?

Yes, the THS3001HVCDGNR supports true single-supply operation from 9V to 32V. The minimum usable supply is 9V (i.e., V_CC+ = 9V, V_CC– = 0V), enabling rail-to-rail output swing of ±3.2V into 1kΩ at 25°C. Input common-mode range extends to within 3.2V of either rail, allowing direct interfacing with 3.3V or 5V logic-controlled signal sources when biased appropriately.

How does the THS3001HVCDGNR's current-feedback architecture affect PCB layout requirements?

The THS3001HVCDGNR's current-feedback topology demands strict layout discipline: the inverting input (Pin 2) must have minimal trace length and no vias, with feedback resistor placed directly adjacent; the noninverting input (Pin 3) requires guarded routing to prevent coupling; and both supply pins (4 and 7) need dedicated 10μF + 100nF bypass capacitors within 3mm. Ground plane integrity under the HVSSOP-8 thermal pad is mandatory to maintain R_θJB = 29.6°C/W.

Can the THS3001HVCDGNR drive a 75Ω coaxial cable directly, and what output swing is achievable?

Yes, the THS3001HVCDGNR can drive 75Ω coaxial cables directly. At ±15V supplies, it delivers ±12.1V output swing into 150Ω and ±12.8V into 1kΩ; extrapolating per load linearity, it sustains ≥±10.5V into 75Ω. This supports 21V_PP HD-SDI compliance with <0.5dB insertion loss at 100MHz - eliminating external line drivers in many broadcast designs.

What is the thermal derating limit for continuous operation of the THS3001HVCDGNR in HVSSOP-8 package?

The THS3001HVCDGNR has a maximum continuous junction temperature of 125°C for long-term reliability. With R_θJA = 56.9°C/W in HVSSOP-8, ambient temperature must be limited to ≤70°C at 1.2W dissipation. For sustained 100mA output into reactive loads, ensure ≥25% copper coverage under the thermal pad and use ≥4 thermal vias to inner ground planes to maintain safe operating area.