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Texas Instruments THS3061DGNR

Part No.:
THS3061DGNR
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Datasheet:
AetrixTHS3061DGNR.pdf
Description:
IC OPAMP CFA 1 CIRCUIT 8HVSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,429

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Product details

Overview

THS3061DGNR from Texas Instruments is a single-channel, high-voltage current-feedback amplifier optimized for low-distortion, high-slew-rate signal conditioning. It delivers 7000 V/μs slew rate at ±15 V supplies, 300 MHz unity-gain bandwidth, –81 dBc 3rd-harmonic distortion at 10 MHz (G = 2, RL = 150 Ω), and ±145 mA output drive into 50 Ω - enabling use in VDSL line drivers and high-voltage ADC preamplifiers.

For engineers reviewing the THS3061DGNR datasheet, THS3061DGNR pinout, THS3061DGNR application, or THS3061DGNR equivalent, key selection criteria include its current-feedback architecture's gain-dependent bandwidth behavior, PowerPAD™ thermal performance in MSOP-8 packaging, ±5 V to ±15 V supply flexibility, and verified video-grade differential gain (0.02%) and phase (0.01°) accuracy.

Technical Context

The THS3061DGNR employs a current-feedback topology with transimpedance gain of 0.7 MΩ (min), where bandwidth scales inversely with feedback resistor value (e.g., 275 MHz at G = 2 with Rf = 560 Ω, 220 MHz at G = 10 with Rf = 200 Ω). Its input stage features asymmetric impedance: 518 kΩ noninverting, 71 Ω inverting, requiring careful layout to minimize imbalance-induced distortion.

It operates across ±4.5 V to ±16.5 V supply rails, with quiescent current ranging 6.3–12 mA depending on voltage and temperature. The device achieves < 0.3 dB peaking in unity-gain configuration and maintains 0.1-dB flatness to 120 MHz (G = 2, ±15 V), supporting wideband linear amplification without external compensation.

Key Specifications

ParameterValue and Actual Design Meaning
Unity-gain bandwidth300 MHz - enables stable high-frequency closed-loop operation without external compensation
Slew rate7000 V/μs at ±15 V - supports full-scale 20-V step response in <1 ns with minimal slewing error
3rd harmonic distortion–81 dBc @ 10 MHz, G = 2, RL = 150 Ω - meets broadcast video and DSL spectral purity requirements
Output current±145 mA into 50 Ω - drives terminated twisted-pair lines and capacitive loads without external buffers
Supply range±5 V to ±15 V - compatible with industrial, test equipment, and legacy analog signal chains
Differential gain/phase0.02% / 0.01° (NTSC/PAL) - preserves color fidelity in composite video distribution
Input voltage noise2.6 nV/√Hz - low enough to avoid degrading SNR in 12–14-bit ADC front ends

Pinout & Package

The THS3061DGNR is housed in an 8-pin MSOP package with exposed PowerPAD™ thermal pad (DGN), requiring solder connection to a PCB copper plane for thermal management per TI SLMA002 guidelines.

Pin/TerminalCircuit RoleDesign Meaning
1 (NC)No internal connectionMust remain unconnected; no routing or grounding required
2 (VIN−)Inverting inputLow-impedance node (71 Ω); sensitive to parasitic capacitance - requires short, guarded trace
3 (VIN+)Noninverting inputHigh-impedance node (518 kΩ); matches typical source impedances in line-driver applications
4 (VS−)Negative supply railReturn path for internal bias and output stage; must be low-inductance with local 0.1 µF + 10 µF decoupling
5 (NC)No internal connectionMust remain unconnected; no routing or grounding required
6 (VS+)Positive supply railPrimary power input; connects to exposed PowerPAD™ for thermal conduction
7 (VOUT)Amplifier outputCapable of sourcing/sinking ±145 mA; requires direct routing to load with controlled impedance
8 (NC)No internal connectionMust remain unconnected; no routing or grounding required

Key Features

FeatureDesign Value
Current-feedback architectureEnables gain-independent settling time and scalable bandwidth via feedback resistor selection
PowerPAD™ thermal packageReduces θJA to 58.4°C/W - sustains 1.71 W dissipation at TJ = +125°C with proper PCB copper area
High output drive capability±145 mA into 50 Ω eliminates need for external output buffers in line-driving applications
Low distortion at high frequency–81 dBc HD3 at 10 MHz ensures compliance with VDSL2 Class B spectral mask and video sync integrity
Wide supply voltage rangeOperates from ±5 V to ±15 V - supports both low-power portable instrumentation and high-voltage test systems

Applications

VDSL Line DriverHigh-Voltage ADC Preamplifier

Use Scenario: Driving twisted-pair telephone lines in DSLAM or CPE equipment with 21-MHz upstream/downstream signals.

IC Role / Device Role / Timing Role: Final-stage line driver providing differential output, common-mode rejection, and return-loss compensation.

Use Value: Delivers –81 dBc 3rd-harmonic distortion at 10 MHz and ±145 mA drive into 100-Ω differential load - meeting ITU-T G.993.2 spectral emission limits.

Use Scenario: Amplifying sensor outputs (e.g., piezoelectric, photodiode transimpedance stages) before 14-bit SAR ADC sampling.

IC Role / Device Role / Timing Role: High-fidelity gain block preserving signal integrity during fast transient acquisition windows.

Use Value: 7000 V/μs slew rate and 300 MHz bandwidth enable accurate capture of >10-MHz small-signal transients without slewing-induced distortion.

Video Line DriverTest & Measurement Signal Generator Output Stage

Use Scenario: Buffering and distributing composite NTSC/PAL video signals across multiple monitors or recording devices.

IC Role / Device Role / Timing Role: DC-coupled video amplifier maintaining luminance/chrominance timing alignment and amplitude fidelity.

Use Value: 0.02% differential gain and 0.01° differential phase errors preserve color saturation and hue accuracy over 0–5.5 MHz baseband.

Use Scenario: Generating clean, high-amplitude waveforms (sine, square, pulse) in automated test equipment with programmable amplitude up to ±13 V.

IC Role / Device Role / Timing Role: Final output buffer delivering low-noise, low-distortion excitation signals to DUTs.

Use Value: 2.6 nV/√Hz input voltage noise and <0.3 dB peaking ensure flat frequency response and minimal harmonic contamination up to 120 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed current-feedback amplifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
THS3061DRSame die in SOIC-8 (D) package; higher θJA (97.5°C/W) limits max power dissipation to 410 mW at TA = +85°CPreferred for prototyping or low-power designs where thermal budget allows larger footprintSelect THS3061DR when board space permits SOIC and thermal load is ≤400 mW
OPA691350 mA output drive, lower slew rate (1100 V/μs), wider supply range (±5 V to ±12 V), no PowerPAD™Better suited for high-current, moderate-bandwidth applications (e.g., laser diode drivers) where distortion < –70 dBc sufficesChoose OPA691 only when ≥300 mA output current is mandatory and bandwidth ≤200 MHz is acceptable

Compared with THS3061DR and OPA691, the THS3061DGNR uniquely balances ultra-high slew rate (7000 V/μs), low distortion (–81 dBc), and thermally robust MSOP-PowerPAD packaging - making it optimal for space-constrained, high-fidelity line-driving applications demanding sustained 1.7 W dissipation.

Availability

THS3061DGNR is available at Aetrix Electronics and suitable for VDSL line drivers, high-voltage ADC preamplifiers, video distribution systems, and automated test equipment requiring stable component supply across extended production lifecycles.

Supply support for THS3061DGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies with over 50 years of innovation in high-performance amplifiers and data converters.

The THS3061DGNR belongs to TI's high-speed current-feedback amplifier product line, engineered specifically for broadband signal integrity in communications infrastructure, precision test equipment, and professional video systems.

FAQ

What is the maximum safe operating voltage for THS3061DGNR?

The THS3061DGNR has an absolute maximum supply voltage rating of ±16.5 V. For reliable long-term operation, TI specifies a maximum junction temperature of +125°C under continuous conditions. At ±15 V supplies, the device draws up to 12 mA per channel and dissipates ~1.7 W in the MSOP-PowerPAD package - requiring adequate PCB copper area per SLMA002 to maintain TJ ≤ +125°C. Exceeding ±16.5 V risks permanent damage.

Does THS3061DGNR require external compensation components?

No, the THS3061DGNR is internally compensated for unity-gain stability and exhibits <0.3 dB peaking in G = 1 configuration. Its current-feedback architecture means bandwidth is set by the external feedback resistor (Rf), not by compensation capacitors. Recommended Rf values are 750 Ω (G = 1), 560 Ω (G = 2), and 357 Ω (G = 5) at ±15 V - all yielding stable, predictable responses without added components.

Can THS3061DGNR drive a 150-Ω video load while maintaining NTSC/PAL specifications?

Yes, the THS3061DGNR delivers 0.02% differential gain error and 0.01° differential phase error when driving a 150-Ω load at G = 2, fully compliant with NTSC and PAL broadcast video standards. These values are measured under standard conditions (±15 V supplies, RL = 150 Ω) and remain stable across temperature - confirming suitability for professional video line drivers and distribution amplifiers.

How does the PowerPAD™ thermal pad on THS3061DGNR affect PCB layout?

The exposed PowerPAD™ on the THS3061DGNR's underside must be soldered to a dedicated thermal copper plane on the PCB to achieve its rated θJA of 58.4°C/W. TI recommends using ≥4 thermal vias (0.3-mm diameter) connecting the pad to inner-layer ground planes. Failure to connect the PowerPAD™ results in excessive junction temperature - potentially exceeding +150°C and causing parametric drift or failure. Refer to TI technical brief SLMA002 for verified layout patterns.

Is THS3061DGNR suitable for repetitive high-slew-rate sine-wave applications?

No - TI explicitly advises against using THS3061DGNR for repetitive signals exceeding 900 V/μs (e.g., high-amplitude, high-frequency sine waves), due to excessive supply current draw and risk of thermal overstress. For such applications, TI recommends the THS3091 or THS3095, which are rated for higher continuous slew rates. THS3061DGNR is optimized for pulsed, large-signal applications with ≥20 ns inter-pulse delay.

THS3061DGNR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Amplifier Type:
Current Feedback
Number of Circuits:
1
Output Type:
-
Slew Rate:
7000V/µs
Gain Bandwidth Product:
2.2 GHz
-3db Bandwidth:
300 MHz
Current - Input Bias:
6 µA
Voltage - Input Offset:
700 µV
Current - Supply:
8.3mA
Current - Output / Channel:
145 mA
Voltage - Supply Span (Min):
10 V
Voltage - Supply Span (Max):
30 V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-HVSSOP

THS3061DGNR FAQ

1.How can I place an order for THS3061DGNR through Aetrix?

Please submit a Request for Quotation (RFQ) for THS3061DGNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for THS3061DGNR reliable?

The price and inventory of THS3061DGNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS3061DGNR is usually 5 days.

3.What payment methods are accepted for THS3061DGNR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS3061DGNR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for THS3061DGNR?

THS3061DGNR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your THS3061DGNR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for THS3061DGNR?

For technical support, including THS3061DGNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS3061DGNR requirements.

6.How does Aetrix verify that THS3061DGNR is sourced from the original manufacturer or authorized distributors?

All THS3061DGNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS3061DGNR meets industry standards.

7.What is the process for return or replacement of THS3061DGNR?

All THS3061DGNR units undergo pre-shipment inspection (PSI). If there is an issue with THS3061DGNR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The THS3061DGNR part is unused and in its original packaging.

Return procedure for THS3061DGNR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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