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Texas Instruments THS3061DR
- Part No.:
- THS3061DR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
THS3061DR.pdf
- Description:
- IC OPAMP CFA 1 CIRCUIT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,083
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Product details
Overview
THS3061DR from Texas Instruments is a single-channel, high-voltage current-feedback amplifier optimized for low-distortion, high-slew-rate signal conditioning in video, test equipment, and line-driver applications. It delivers 7000 V/μs slew rate at ±15 V supplies, 300 MHz unity-gain bandwidth, –81 dBc third-harmonic distortion at 10 MHz (G = 2, RL = 150 Ω), and ±145 mA output drive into 50 Ω - enabling clean amplification of large-swing, high-frequency signals in broadcast video and VDSL systems.
For engineers reviewing the THS3061DR datasheet, THS3061DR pinout, THS3061DR application, or THS3061DR equivalent, key selection criteria include its current-feedback architecture's gain-bandwidth independence, thermal performance under ±15 V operation, PowerPAD-enabled SOIC-8 package dissipation capability, and verified 0.1-dB flatness to 120 MHz at G = 2 - critical for wideband ADC driving and differential line transmission.
Technical Context
The THS3061DR implements a current-feedback topology with separate high-impedance noninverting input (518 kΩ) and low-impedance inverting input (71 Ω), enabling stable high-gain configurations via feedback resistor tuning. Its BiCOM-1 bipolar process supports ±15 V operation and delivers 0.3 dB peaking at unity gain - confirming minimal frequency response anomalies.
Bandwidth scales inversely with feedback resistance: 220 MHz at G = 10 (Rf = 200 Ω), 275 MHz at G = 2 (Rf = 560 Ω), and 300 MHz at G = 1 (Rf = 750 Ω). Output stage delivers ±145 mA into 50 Ω while maintaining < 0.01° differential phase error in NTSC/PAL video systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Unity-Gain Bandwidth | 300 MHz - enables stable G = 1 video buffer operation with full small-signal response up to 300 MHz. |
| Slew Rate | 7000 V/μs at ±15 V - supports linear amplification of 20-V-step transients in < 3 ns without slewing-induced distortion. |
| 0.1-dB Flatness | 120 MHz at G = 2 - ensures amplitude accuracy within ±0.1 dB across 120 MHz bandwidth for high-fidelity signal chain design. |
| HD3 @ 10 MHz | –81 dBc (RL = 150 Ω) - meets broadcast video spectral purity requirements for analog component video drivers. |
| Output Current | ±145 mA into 50 Ω - drives twisted-pair VDSL lines or dual 75-Ω video loads without external buffering. |
| Supply Range | ±5 V to ±15 V - supports both low-power portable instrumentation and high-voltage industrial signal conditioning. |
| Input Voltage Noise | 2.6 nV/√Hz - preserves SNR in high-gain preamplifier stages preceding high-speed ADCs. |
Pinout & Package
The THS3061DR is packaged in an 8-pin SOIC with PowerPAD™ thermally enhanced bottom pad (package code D), requiring solder connection to a PCB copper plane for thermal management per TI SLMA002 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (NC) | No internal connection | Must be left unconnected; no routing or grounding required. |
| 2 (VIN−) | Inverting input | Low-impedance node (71 Ω); connects to feedback network for current-feedback configuration. |
| 3 (VIN+) | Noninverting input | High-impedance node (518 kΩ); accepts signal source with minimal loading. |
| 4 (VS−) | Negative supply rail | Connects to –VCC (–5 V to –15 V); requires local 0.1 µF + 10 µF decoupling. |
| 5 (NC) | No internal connection | Must be left unconnected; no routing or grounding required. |
| 6 (VS+) | Positive supply rail | Connects to +VCC (+5 V to +15 V); requires local 0.1 µF + 10 µF decoupling. |
| 7 (VOUT) | Amplifier output | Drives 50 Ω loads directly; PowerPAD must be thermally coupled to PCB ground plane. |
| 8 (NC) | No internal connection | Must be left unconnected; no routing or grounding required. |
Key Features
| Feature | Design Value |
|---|---|
| Current-feedback architecture | Enables gain-independent bandwidth scaling - e.g., 220 MHz at G = 10 using Rf = 200 Ω without stability compromise. |
| PowerPAD thermal enhancement | Reduces θJA to 97.5°C/W (SOIC-D) - allows continuous ±15 V operation at 8.3 mA quiescent current without thermal shutdown. |
| Low harmonic distortion | –81 dBc HD3 at 10 MHz ensures compliance with SMPTE 253M video line driver spectral mask requirements. |
| Differential phase/gain accuracy | 0.01° / 0.02% error at NTSC/PAL frequencies enables broadcast-grade analog video transmission. |
| High output current drive | ±145 mA into 50 Ω eliminates need for external current boosters in DSLAM line card designs. |
Applications
| Video Line Driver | VDSL Line Driver |
|---|---|
Use Scenario: Driving 75-Ω coaxial cables in SD/HD component video distribution systems with minimal signal degradation over 100 m. IC Role / Device Role / Timing Role: High-current, low-distortion buffer amplifier operating at G = 2 with 120 MHz 0.1-dB flatness. Use Value: Maintains < 0.01° differential phase and 0.02% differential gain for NTSC/PAL compatibility without post-compensation circuitry. | Use Scenario: Transmitting upstream/downstream VDSL signals over twisted-pair telephone lines with > 12 MHz bandwidth. IC Role / Device Role / Timing Role: Differential line driver configured with THS3062 dual variant (or two THS3061DRs) in balanced push-pull topology. Use Value: Delivers ±145 mA into 100-Ω differential load while meeting ITU-T G.993.1 spectral mask requirements up to 30 MHz. |
| High-Voltage ADC Preamplifier | Test & Measurement Signal Generator |
Use Scenario: Conditioning ±10 V sensor outputs prior to sampling by 14-bit, 100 MSPS ADCs in automated test equipment. IC Role / Device Role / Timing Role: Single-supply or split-supply gain stage with 300 MHz bandwidth and 7000 V/μs slew rate to preserve transient fidelity. Use Value: Enables full-scale step response capture with < 30 ns 0.01% settling time - critical for dynamic range validation. | Use Scenario: Generating clean, high-amplitude sine/square waves up to 100 MHz in benchtop arbitrary waveform generators. IC Role / Device Role / Timing Role: Final-stage output amplifier delivering > 20 VPP into 50 Ω with < –80 dBc harmonic distortion. Use Value: Eliminates need for external RF power amplifiers in mid-frequency signal sources, reducing BOM count and layout complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed current-feedback amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| THS3061DGNR | Same die in MSOP-8 PowerPAD package (θJA = 58.4°C/W vs 97.5°C/W); identical electrical specs. | Better thermal performance in space-constrained PCBs; requires finer-pitch assembly. | Select THS3061DGNR when board area is limited and thermal margin is critical at ±15 V operation. |
| OPA691 | Wider 350 mA output drive but lower 270 MHz GBW; higher 12.5 mA quiescent current. | Preferred for ultra-high-current applications (>200 mA) where bandwidth ≤ 270 MHz suffices. | Choose OPA691 only when output current > ±145 mA is mandatory and 300 MHz bandwidth is not required. |
Compared with THS3061DGNR, THS3061DR offers lower-cost SOIC assembly and adequate thermal headroom for most ±15 V video line driver designs; versus OPA691, THS3061DR provides superior bandwidth-efficiency ratio (300 MHz/8.3 mA vs 270 MHz/12.5 mA) for distortion-sensitive wideband applications.
Availability
THS3061DR is available at Aetrix Electronics and suitable for video line driver, VDSL line driver, and high-voltage ADC preamplifier applications requiring stable component supply, long-term manufacturability, and TI-qualified production lots.
Supply support for THS3061DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies with over 50 years of amplifier innovation.
The THS3061DR belongs to TI's high-speed current-feedback amplifier product line, engineered specifically for wideband, low-distortion signal conditioning in video infrastructure, communications line cards, and precision test equipment.
FAQ
What is the maximum safe operating voltage for THS3061DR?
The THS3061DR has an absolute maximum supply voltage rating of ±16.5 V per the datasheet Absolute Maximum Ratings table. For reliable long-term operation, TI specifies ±15 V as the recommended maximum operating voltage. Exceeding ±15 V risks accelerated parametric drift and reduced reliability, especially at elevated temperatures or high output current loads.
Does THS3061DR require external compensation components?
No, the THS3061DR is internally compensated for unity-gain stability and does not require external compensation capacitors. Its current-feedback architecture achieves stable operation across gains from –1 to +10 using only precision-matched feedback resistors (e.g., 750 Ω for G = 1, 560 Ω for G = 2). Layout best practices - including short traces, ground-plane isolation, and proper decoupling - are sufficient for robust performance.
Can THS3061DR drive a 75-Ω video load directly?
Yes, THS3061DR can drive a 75-Ω video load directly when configured as a G = 2 noninverting amplifier with appropriate feedback resistors (Rf = 560 Ω, Rg = 560 Ω). At ±15 V supplies, it delivers ±13 V output swing into 75 Ω (per Electrical Characteristics table), satisfying SMPTE 253M 1-VPP broadcast video level requirements with headroom. Differential drive using two THS3061DRs further improves noise immunity.
What thermal considerations apply to THS3061DR in SOIC-8 package?
The THS3061DR in SOIC-8 (package D) has θJA = 97.5°C/W per JEDEC High-K test board conditions. With 8.3 mA quiescent current and ±15 V supplies, power dissipation is ~250 mW - resulting in ~24°C junction-to-ambient rise. To maintain TJ < 125°C, ensure ≥1 in² copper pour under PowerPAD, use thermal vias to inner ground planes, and avoid adjacent heat sources per TI SLMA002 guidelines.
How does THS3061DR compare to THS3062 in pin compatibility?
The THS3061DR (single) and THS3062 (dual) share identical pinouts per channel in SOIC-8 packages: pins 2/3/4/6/7 map to VIN−/VIN+/VS−/VS+/VOUT for Channel 1, while THS3062 adds Channel 2 on pins 1/5/8 (2VIN−/2VOUT/2VIN+). Thus, THS3061DR cannot be drop-in replaced by THS3062 due to differing channel count and pin assignments - redesign is required to leverage dual functionality.
THS3061DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- Current Feedback
- Number of Circuits:
- 1
- Output Type:
- -
- Slew Rate:
- 7000V/µs
- Gain Bandwidth Product:
- 2.2 GHz
- -3db Bandwidth:
- 300 MHz
- Current - Input Bias:
- 6 µA
- Voltage - Input Offset:
- 700 µV
- Current - Supply:
- 8.3mA
- Current - Output / Channel:
- 145 mA
- Voltage - Supply Span (Min):
- 10 V
- Voltage - Supply Span (Max):
- 30 V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
THS3061DR FAQ
1.How can I place an order for THS3061DR through Aetrix?
Please submit a Request for Quotation (RFQ) for THS3061DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for THS3061DR reliable?
The price and inventory of THS3061DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS3061DR is usually 5 days.
3.What payment methods are accepted for THS3061DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS3061DR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for THS3061DR?
THS3061DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your THS3061DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for THS3061DR?
For technical support, including THS3061DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS3061DR requirements.
6.How does Aetrix verify that THS3061DR is sourced from the original manufacturer or authorized distributors?
All THS3061DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS3061DR meets industry standards.
7.What is the process for return or replacement of THS3061DR?
All THS3061DR units undergo pre-shipment inspection (PSI). If there is an issue with THS3061DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The THS3061DR part is unused and in its original packaging.
Return procedure for THS3061DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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