Texas Instruments THS3062DGN

Overview

THS3062DGN from Texas Instruments is a dual-channel, high-voltage, current-feedback amplifier optimized for low-distortion, high-slew-rate signal conditioning. It delivers 7000 V/μs slew rate (G = 5, ±15 V), –81 dBc 3rd harmonic distortion at 10 MHz (G = 2, RL = 150 Ω), and 300 MHz unity-gain bandwidth - enabling precision video line driving and VDSL line driver applications with ±145 mA output drive into 50 Ω.

For engineers reviewing the THS3062DGN datasheet, THS3062DGN pinout, THS3062DGN application, or THS3062DGN equivalent, key selection criteria include its MSOP-8 PowerPAD™ package thermal performance, current-feedback architecture's gain-dependent bandwidth behavior, ±5 V to ±15 V supply flexibility, and verified differential gain/phase performance in NTSC/PAL video systems.

Technical Context

The THS3062DGN implements a current-feedback topology with separate high-impedance noninverting input (518 kΩ) and low-impedance inverting input (71 Ω), enabling wide bandwidth independent of closed-loop gain when using appropriate feedback resistors (e.g., 560 Ω at G = 2). Its BiCOM-1 bipolar process supports ±15 V operation and delivers 0.3 dB peaking at unity gain.

Bandwidth scales inversely with feedback resistance: 275 MHz at G = 2 (Rf = 560 Ω), 220 MHz at G = 10 (Rf = 200 Ω), and 120 MHz 0.1-dB flatness bandwidth. Distortion is minimized by maintaining high loop gain - evidenced by –81 dBc HD3 at 10 MHz and < 0.02% differential gain error driving multiple 150 Ω video loads.

Key Specifications

Pinout & Package

The THS3062DGN is housed in an 8-pin MSOP package with exposed PowerPAD™ thermal pad (DGN suffix), requiring solder connection to a PCB copper plane for thermal management per TI SLMA002 guidelines. Maximum power dissipation is 1.71 W at TJ = +125°C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed current-feedback amplifier applications.

Compared with THS3062DDA and THS3122, the THS3062DGN provides optimal balance of thermal efficiency in compact MSOP-8 packaging, lowest harmonic distortion at 10 MHz, and proven video fidelity - making it preferred for space-constrained, high-fidelity analog signal paths.

Availability

THS3062DGN is available at Aetrix Electronics and suitable for video line driver, VDSL line driver, and high-voltage ADC preamplifier applications requiring stable component supply across industrial temperature ranges (–40°C to +85°C).

Supply support for THS3062DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in high-speed amplifier design.

The THS3062DGN belongs to TI's THS306x current-feedback amplifier family, engineered specifically for applications demanding simultaneous high slew rate, wide bandwidth, and ultra-low distortion - such as professional video infrastructure and broadband communications.

FAQ

What is the maximum safe operating voltage for THS3062DGN?

The THS3062DGN has an absolute maximum supply voltage rating of ±16.5 V. However, the recommended operating range is ±5 V to ±15 V. Operation at ±16.5 V exceeds design specifications and risks reliability degradation; TI specifies ±15 V as the maximum rated condition for guaranteed performance including 7000 V/μs slew rate and –81 dBc HD3. Always observe derating curves in the datasheet for extended temperature operation.

Does THS3062DGN require external compensation components?

No, the THS3062DGN is internally compensated for unity-gain stability and does not require external compensation capacitors. Stability is maintained by selecting appropriate feedback resistors per Table 1 in the datasheet (e.g., 750 Ω for G = 1, 560 Ω for G = 2). Deviating from recommended Rf values - especially using excessively low resistances - can degrade phase margin and cause peaking or oscillation, particularly with capacitive loads.

How does THS3062DGN's PowerPAD™ thermal pad affect PCB layout?

The THS3062DGN's exposed PowerPAD™ must be soldered to a dedicated thermal copper plane on the PCB to achieve its specified θJA of 58.4°C/W and 1.71 W power dissipation. TI recommends connecting the pad to the most negative potential (VS−) for noise immunity and using ≥4 thermal vias (0.3 mm diameter) to inner ground planes. Failure to thermally anchor the PowerPAD™ results in junction temperature exceeding +125°C, triggering thermal shutdown or permanent damage.

Can THS3062DGN drive a 150 Ω load at 10 MHz with low distortion?

Yes, the THS3062DGN achieves –81 dBc 3rd harmonic distortion at 10 MHz driving a 150 Ω load with G = 2 and ±15 V supplies. This performance is validated in the datasheet's Electrical Characteristics table and Figure 20. For optimal results, use the recommended 560 Ω feedback resistor and ensure proper high-frequency layout: short traces, ground-plane isolation, and local 0.1 µF + 10 µF decoupling at each supply pin.

Is THS3062DGN suitable for single-supply operation?

No, the THS3062DGN is designed exclusively for split-supply operation (±5 V to ±15 V). Its input common-mode range is asymmetric and centered near midsupply - e.g., ±13.1 V at ±15 V supplies - and does not support rail-to-rail input or output with single-ended supplies. Attempting single-supply use (e.g., 0 V/30 V) violates absolute maximum ratings and will result in catastrophic failure. For single-supply high-speed amplifiers, consider TI's OPA695 or LMH6703 families instead.