Texas Instruments THS3110CDR

Overview

THS3110CDR from Texas Instruments is a low-noise, high-voltage current-feedback operational amplifier optimized for video distribution and high-speed analog signal conditioning. It delivers 260 mA output drive, 1300 V/μs slew rate, 90 MHz bandwidth (G = 2), ±15 V supply operation, and features a dedicated power-down pin enabling quiescent current reduction from 4.8 mA to 270 μA - critical for multi-channel broadcast video routing systems.

For engineers reviewing the THS3110CDR datasheet, THS3110CDR pinout, THS3110CDR application, or THS3110CDR equivalent, key selection criteria include differential gain/phase performance at multiple 150 Ω loads, thermal management via PowerPAD™, SOIC-8 package compatibility with legacy video amplifier layouts, and verified NTSC/PAL video fidelity under ±15 V operation.

Technical Context

The THS3110CDR employs a current-feedback architecture with separate inverting/noninverting input current noise specifications (10 pA/√Hz and 2 pA/√Hz), enabling wide bandwidth stability with minimal gain-dependent peaking. Its transimpedance stage supports high closed-loop gain accuracy while maintaining 0.1-dB flatness up to 45 MHz at G = 2.

Power-down functionality is implemented via a referenced control pin (REF) requiring PD ≥ REF + 2 V to disable, with turn-on/turn-off delays of 4 μs and 6 μs respectively. The device operates across ±5 V to ±15 V supplies and maintains differential phase < 0.033° and differential gain < 0.013% into eight 150 Ω video loads per datasheet Figure 30 and 29.

Key Specifications

Pinout & Package

THS3110CDR is housed in an 8-pin SOIC (D) package with exposed PowerPAD™ thermal pad on the underside, requiring solder connection to a PCB copper plane for thermal dissipation. Pin 1 is NC; pins 2–5 are VIN−, VIN+, VS−, and VS+; pin 6 is VOUT; pins 7–8 are NC and PD (power-down control).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed current-feedback amplifier applications.

Compared with THS3111CDR and LMH6702MA/NOPB, THS3110CDR uniquely combines multi-load video drive capability, integrated power-down, and SOIC-8 PowerPAD™ packaging - making it the only option supporting broadcast-grade distribution with dynamic channel management.

Availability

THS3110CDR is available at Aetrix Electronics and suitable for video distribution amplifiers, high-speed pin drivers, and capacitive load buffering requiring stable component supply across industrial temperature ranges (–40°C to +85°C).

Supply support for THS3110CDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.

The THS3110 product line targets high-fidelity analog signal distribution in broadcast video, test equipment, and high-speed data acquisition - emphasizing low distortion, thermal robustness, and multi-load drive capability.

FAQ

What is the maximum number of 75 Ω video loads the THS3110CDR can drive while maintaining SMPTE-compliant differential phase?

The THS3110CDR maintains differential phase ≤ 0.033° into up to eight 150 Ω loads (equivalent to sixteen 75 Ω loads in parallel configuration) per Figure 30 of the SLOS422E datasheet. For strict 75 Ω point-to-point distribution, design for ≤ seven loads to retain margin against PCB trace impedance variation and connector tolerances - confirmed by THS3110CDR test conditions specifying RL = 150 Ω with worst-case ±100 IRE ramp.

Does the THS3110CDR require external compensation when driving 100 pF capacitive loads?

Yes, the THS3110CDR requires external series isolation resistance (RISO) when driving >50 pF capacitive loads. Per Figure 8 in the SLOS422E datasheet, a 54.9 Ω RISO is recommended for 100 pF loads with G = 5 and RL = 100 Ω. Omitting RISO risks peaking and instability - the THS3110CDR's current-feedback architecture remains stable only with proper RISO selection per capacitive load value.

How does the power-down feature of the THS3110CDR affect settling time during wake-up?

The THS3110CDR exhibits 4 μs turn-on time delay (to 90% of final output) and 6 μs turn-off delay (to 10% of final output) per Section 6.7 of the SLOS422E datasheet. During wake-up, full small-signal bandwidth (90 MHz) and slew rate (1300 V/μs) are restored within this window - no additional settling penalty applies beyond these fixed delays, as verified under VS = ±15 V, G = 2 conditions.

Can the THS3110CDR operate from a single +30 V supply instead of dual ±15 V rails?

Yes, the THS3110CDR supports single-supply operation from +10 V to +30 V per Recommended Operating Conditions table. At +30 V, the input common-mode range extends to +12.5 V (min), and output swing reaches +12 V (min) into 100 Ω. However, differential gain/phase data in the datasheet is characterized only for dual-supply ±15 V and ±5 V - single-supply performance must be validated per application, especially for video DC restoration.

What thermal design considerations apply to the THS3110CDR's PowerPAD™ in SOIC-8 packaging?

The THS3110CDR's PowerPAD™ requires solder connection to a minimum 1-inch² copper pour on the PCB's inner or outer layer to achieve θJA = 95°C/W and sustain 1.05 W at TA = +25°C. Per Dissipation Ratings Table, failure to thermally connect the PowerPAD™ raises junction temperature beyond +125°C under 260 mA load - risking parametric shift or long-term reliability loss. TI Technical Brief SLMA002 provides layout guidelines for optimal thermal conduction.