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Texas Instruments THS3201MDGNREP

Part No.:
THS3201MDGNREP
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Datasheet:
AetrixTHS3201MDGNREP.pdf
Description:
IC OPAMP CFA 1 CIRCUIT 8HVSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,448

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Product details

Overview

THS3201MDGNREP from Texas Instruments is a radiation-hardened, high-speed current-feedback amplifier optimized for defense, aerospace, and medical applications requiring ultra-low distortion and wide bandwidth. It delivers 1.8-GHz unity-gain bandwidth, 6700 V/µs slew rate (G = 2, ±7.5 V), –78 dBc IMD3 at 20 MHz, 11-dB noise figure (G = 10), and ±7.5-V dual-supply operation - enabling high-fidelity arbitrary waveform generation and high-resolution ADC driving.

For engineers reviewing the THS3201MDGNREP datasheet, THS3201MDGNREP pinout, THS3201MDGNREP application, or THS3201MDGNREP equivalent, key selection criteria include its 8-pin MSOP-PowerPAD™ package, extended temperature range (–55°C to +125°C), low input-referred voltage noise (1.65 nV/√Hz), and compatibility with ±3.3 V to ±7.5 V supplies in precision analog signal chains.

Technical Context

The THS3201MDGNREP implements a current-feedback architecture with 16-Ω inverting input impedance and 780-kΩ noninverting input resistance, enabling stable gain-setting via external feedback resistors (e.g., RF = 768 Ω for G = 2). Its transimpedance gain exceeds 100 kΩ over temperature, supporting fast settling (20 ns to 0.1%) and near-step-independent rise/fall times (0.7/0.9 ns).

Designed for extended-life military and space-grade systems, it features controlled baseline, single-fab/supply/test-site traceability, and thermal pad (PowerPAD™) requiring PCB connection to ground or thermal plane. Absolute maximum supply voltage is 16.5 V, with continuous output drive capability of ±100 mA into 100 Ω.

Key Specifications

Parameter Value and Actual Design Meaning
Unity-Gain Bandwidth 1.8 GHz at ±7.5 V - enables direct drive of >1-GHz sampling ADCs without intermediate buffering.
Slew Rate 6700 V/µs (G = 2, 5-V step, RL = 100 Ω) - supports clean large-signal transient response in pulse amplification.
IMD3 Distortion –78 dBc at 20 MHz (G = 10, 2-VPP envelope, RL = 100 Ω) - meets stringent spectral purity requirements in comms and radar IF stages.
Noise Figure 11 dB (G = 10, RG = 28 Ω, RF = 255 Ω) - minimizes system noise floor degradation in low-level signal conditioning paths.
Supply Voltage Range ±3.3 V to ±7.5 V - accommodates both low-power portable systems and high-voltage test equipment rails.
Input Voltage Noise 1.65 nV/√Hz (f > 10 MHz) - preserves SNR in wideband receiver front-ends and instrumentation amplifiers.
Operating Temperature –55°C to +125°C - qualified for harsh-environment deployment in avionics, satellite payloads, and battlefield electronics.

Pinout & Package

THS3201MDGNREP uses an 8-pin MSOP package with exposed thermal pad (PowerPAD™), requiring solder connection to a thermally conductive PCB plane per TI SLMA002/SLMA004 guidelines. The thermal pad is electrically isolated from internal circuitry.

Pin/Terminal Circuit Role Design Meaning
1 (NC) No internal connection Must be left unconnected; no routing or grounding required.
2 (VIN−) Inverting input Low-impedance node (16 Ω) accepting feedback network; sets closed-loop gain with RF.
3 (VIN+) Noninverting input High-impedance node (780 kΩ); used for reference biasing or signal injection in noninverting configurations.
4 (VS−) Negative supply rail Connect to system negative supply; decoupling capacitor (e.g., 0.1 µF) required adjacent to pin.
5 (NC) No internal connection Must be left unconnected; no routing or grounding required.
6 (VS+) Positive supply rail Connect to system positive supply; decoupling capacitor (e.g., 0.1 µF) required adjacent to pin.
7 (VOUT) Amplifier output Capable of ±100 mA drive into 100 Ω; requires series isolation resistor for capacitive loads > 10 pF.
8 (NC) No internal connection Must be left unconnected; no routing or grounding required.

Key Features

Feature Design Value
Radiation-hardened EP grade Qualified for space and defense use with controlled baseline, extended product life cycle, and full traceability.
Current-feedback topology Enables bandwidth scalability independent of closed-loop gain - 850 MHz small-signal BW at G = +2, 565 MHz at G = +5.
PowerPAD™ thermal enhancement θJA = 58.4°C/W (JEDEC High-K board); thermal pad must be soldered to copper pour for reliable 125°C operation.
Low distortion at high frequency –73 dBc third-harmonic distortion at 10 MHz (G = +5) ensures fidelity in video, IF, and arbitrary waveform synthesis.
Wide common-mode input range ±5.1 V (min) at ±7.5 V supply - simplifies level-shifting in bipolar signal chains interfacing with FPGAs or DACs.

Applications

Arbitrary Waveform Generation High-Speed ADC Driver

Use Scenario: Generating precise, multi-tone RF stimuli for radar calibration and EW test benches.

IC Role / Device Role / Timing Role: Final-stage wideband buffer amplifying DAC outputs with minimal group delay variation.

Use Value: 1.8-GHz bandwidth and 6700 V/µs slew rate preserve edge integrity of sub-ns pulses without overshoot or droop.

Use Scenario: Driving 12–16-bit, 1-GSPS+ analog-to-digital converters in software-defined radio receivers.

IC Role / Device Role / Timing Role: Low-distortion, low-noise gain stage preceding ADC sampling front-end.

Use Value: –78 dBc IMD3 at 20 MHz and 11-dB noise figure maintain ENOB > 10 bits across Nyquist band.

ATE Signal Source Medical Imaging Front-End

Use Scenario: Precision stimulus generation in automated test equipment for high-frequency component validation.

IC Role / Device Role / Timing Role: Output driver delivering calibrated, low-jitter signals to DUTs under programmable gain control.

Use Value: ±7.5-V swing capability provides >14-VPP output into 50 Ω, exceeding standard instrument dynamic range.

Use Scenario: Ultrasound transmit beamformer channel amplification with tight phase matching across 128+ channels.

IC Role / Device Role / Timing Role: Current-feedback gain block ensuring matched propagation delay and amplitude flatness.

Use Value: 0.004° differential phase error (PAL) and 0.004% differential gain support <1% image distortion at 15-MHz center frequencies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed current-feedback amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
THS3202MDGNREP Dual-channel version with identical specs per channel; higher quiescent current (2×18 mA max) and larger die area. Required when simultaneous dual-path amplification is needed (e.g., I/Q modulation, differential signaling). Select THS3202MDGNREP only if dual-channel functionality is essential; THS3201MDGNREP offers lower power and smaller footprint for single-ended designs.
THS3001MDWREP Higher supply range (±15 V), lower bandwidth (420 MHz), higher slew rate (3200 V/µs), and higher distortion (–64 dBc IMD3 @ 10 MHz). Better suited for high-voltage, lower-frequency applications like piezoelectric actuator drivers or legacy test gear. Choose THS3001MDWREP when ±15-V rails and >10-VPP output are mandatory; THS3201MDGNREP excels where bandwidth and distortion dominate.

Compared with THS3202MDGNREP and THS3001MDWREP, THS3201MDGNREP uniquely balances 1.8-GHz bandwidth, –78 dBc IMD3, and MSOP-PowerPAD™ packaging for space-constrained, high-fidelity signal generation - making it optimal for single-channel, wideband, low-distortion roles in defense and medical systems.

Availability

THS3201MDGNREP is available at Aetrix Electronics and suitable for defense avionics, medical ultrasound systems, and automated test equipment requiring stable component supply across extended temperature and radiation environments.

Supply support for THS3201MDGNREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components for industrial, automotive, and aerospace markets.

The THS3201MDGNREP belongs to TI's Enhanced Product (EP) family - engineered for mission-critical applications demanding extended temperature operation, radiation tolerance, and long-term supply assurance.

FAQ

What is the maximum operating junction temperature for THS3201MDGNREP?

The THS3201MDGNREP has a maximum junction temperature of 150°C for absolute maximum ratings, but its recommended continuous operating junction temperature is limited to 125°C for long-term reliability. Thermal design must ensure θJA = 58.4°C/W (MSOP-PowerPAD™) is maintained using adequate PCB copper area connected to the thermal pad, especially under ±7.5-V, high-output-current conditions.

Does THS3201MDGNREP support single-supply operation?

Yes, THS3201MDGNREP supports single-supply operation from 6.6 V to 15 V, as specified in the Recommended Operating Conditions table. However, its input common-mode range and output swing are optimized for symmetric dual supplies (±3.3 V to ±7.5 V); single-supply use requires careful DC biasing of VIN+ and load termination to preserve linearity and avoid clipping.

How does the PowerPAD™ thermal pad on THS3201MDGNREP affect PCB layout?

The PowerPAD™ thermal pad on THS3201MDGNREP must be soldered to a dedicated, low-thermal-resistance PCB copper plane - typically connected to ground or the most negative supply - to achieve rated θJA = 58.4°C/W. Failure to connect the pad results in excessive junction temperature rise and potential device failure. TI technical briefs SLMA002 and SLMA004 provide verified layout guidelines for thermal pad implementation.

What is the typical input bias current of THS3201MDGNREP at 25°C?

At 25°C and ±7.5-V supply, THS3201MDGNREP exhibits typical input bias current of ±13 µA at the inverting input and ±14 µA at the noninverting input. These values increase with temperature, reaching up to ±90 µA (inverting) and ±60 µA (noninverting) at 125°C - a critical consideration for high-impedance feedback networks or precision DC-coupled stages.

Can THS3201MDGNREP drive a 50-Ω load directly?

Yes, THS3201MDGNREP can drive a 50-Ω load directly, delivering ±5.7 V output swing (min) and ±100 mA output current (min) at ±7.5-V supply. For optimal stability and distortion performance, a series isolation resistor (e.g., 10–22 Ω) is recommended between VOUT and the 50-Ω load to dampen potential peaking caused by trace inductance or connector capacitance.

THS3201MDGNREP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Amplifier Type:
Current Feedback
Number of Circuits:
1
Output Type:
-
Slew Rate:
9800V/µs
Gain Bandwidth Product:
-
-3db Bandwidth:
1.8 GHz
Current - Input Bias:
14 µA
Voltage - Input Offset:
700 µV
Current - Supply:
14mA
Current - Output / Channel:
115 mA
Voltage - Supply Span (Min):
6.6 V
Voltage - Supply Span (Max):
15 V
Operating Temperature:
-55°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-HVSSOP

THS3201MDGNREP FAQ

1.How can I place an order for THS3201MDGNREP through Aetrix?

Please submit a Request for Quotation (RFQ) for THS3201MDGNREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for THS3201MDGNREP reliable?

The price and inventory of THS3201MDGNREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for THS3201MDGNREP is usually 5 days.

3.What payment methods are accepted for THS3201MDGNREP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for THS3201MDGNREP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for THS3201MDGNREP?

THS3201MDGNREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your THS3201MDGNREP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for THS3201MDGNREP?

For technical support, including THS3201MDGNREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your THS3201MDGNREP requirements.

6.How does Aetrix verify that THS3201MDGNREP is sourced from the original manufacturer or authorized distributors?

All THS3201MDGNREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that THS3201MDGNREP meets industry standards.

7.What is the process for return or replacement of THS3201MDGNREP?

All THS3201MDGNREP units undergo pre-shipment inspection (PSI). If there is an issue with THS3201MDGNREP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The THS3201MDGNREP part is unused and in its original packaging.

Return procedure for THS3201MDGNREP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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