Texas Instruments THS3202DR

Overview

THS3202DR from Texas Instruments is a dual current-feedback amplifier (CFA) designed for high-speed, low-distortion signal conditioning in demanding analog front-ends. It delivers 2 GHz unity-gain bandwidth, 9000 V/µs slew rate, ±115 mA output drive into 20 Ω, and operates from ±3.3 V to ±7.5 V (dual) or 6.6–15 V (single). It is widely deployed in RF/IF amplification, high-voltage ADC preamplification, and professional video line driving.

For engineers reviewing the THS3202DR datasheet, THS3202DR pinout, THS3202DR application, or THS3202DR equivalent, key selection considerations include its current-feedback architecture, thermal management requirements for the PowerPAD package, large-signal bandwidth at 4 V_PP, differential gain/phase error under NTSC/PAL loads, and supply voltage flexibility across ±5 V and 15 V operation.

Technical Context

The THS3202DR implements a BiCOM-II process-based current-feedback topology with separate high-impedance noninverting input (780 kΩ) and low-impedance inverting input (11 Ω), enabling stable wideband gain configurations. Its transimpedance gain (≥120 kΩ min over temperature) defines closed-loop behavior via feedback resistor selection rather than internal compensation.

It features independent amplifier channels sharing only supply rails, with crosstalk of –60 dB at 100 MHz. The device requires careful PCB layout: the exposed PowerPAD must be soldered to a thermally conductive copper plane to maintain junction temperature ≤125°C for long-term reliability and distortion performance.

Key Specifications

Pinout & Package

The THS3202DR is supplied in an SOIC-8 (D) package with exposed PowerPAD thermal pad on the underside, requiring connection to a PCB ground or thermal plane for reliable operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar current-feedback amplifier applications.

Compared with THS3201DR, the THS3202DR provides two independent high-speed channels in one package-reducing component count and inter-channel skew-but consumes twice the quiescent current. Versus THS3091D, it trades voltage headroom for 4.8× higher bandwidth and 4.5× faster slew rate, making it unsuitable for ±15 V legacy systems but optimal for modern wideband signal chains.

Availability

THS3202DR is available at Aetrix Electronics and suitable for RF and IF amplification, high-speed data acquisition, and professional video line driving requiring stable component supply, consistent lot-to-lot performance, and long-term production support.

Supply support for THS3202DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-performance amplifier design.

The THS320x family was engineered specifically for wideband, low-distortion signal conditioning in communications, instrumentation, and video systems-prioritizing speed, linearity, and thermal robustness over general-purpose op-amp versatility.

FAQ

What is the recommended power supply configuration for THS3202DR in high-fidelity video applications?

The THS3202DR performs optimally in video line driving at ±5 V supplies, delivering 0.008% differential gain error and 0.03° differential phase error into 150 Ω loads per NTSC/PAL standards. Use 10 µF + 0.1 µF ceramic bypass capacitors at each VS+ and VS− pin, and ensure the PowerPAD is soldered to a solid thermal plane to maintain junction temperature ≤125°C during continuous 4 V_PP output operation. THS3202DR must not operate without proper thermal coupling to PCB copper.

Does THS3202DR support single-supply operation, and what is the minimum usable supply voltage?

Yes, THS3202DR supports true single-supply operation from 6.6 V to 15 V. At 6.6 V, the device maintains functional operation with reduced output swing (±3.2 V into 100 Ω) and slightly degraded large-signal bandwidth (~700 MHz at 2 V_PP). For reliable performance across temperature, TI specifies minimum dual-supply operation at ±3.3 V (6.6 V total), and single-supply minimum is explicitly 6.6 V-not lower-even though absolute maximum ratings allow down to ±3 V.

How does the THS3202DR's current-feedback architecture affect stability and feedback resistor selection?

Unlike voltage-feedback op-amps, THS3202DR's stability depends critically on the value and parasitic inductance of the feedback resistor (R_F). For G = +2, R_F = 402 Ω is specified; deviating significantly causes peaking or oscillation. Layout must minimize inductance at the inverting input: use short, direct traces and avoid vias. THS3202DR does not require external compensation capacitors, but improper R_F selection or routing will degrade bandwidth flatness and increase distortion.

Can THS3202DR drive a 50 Ω transmission line directly, and what are the implications?

THS3202DR can source/sink ±115 mA into 20 Ω, so driving a 50 Ω load is feasible-but requires careful attention to termination and return path. For 50 Ω cable driving, use series termination at the amplifier output (e.g., 30 Ω in series with 50 Ω line) to prevent reflections. Output voltage swing drops to ~±3.45 V (min) into 100 Ω and less into 50 Ω; verify that THS3202DR's closed-loop output impedance (0.01 Ω typ) and thermal limits permit sustained operation. Do not AC-couple without DC bias restoration.

What thermal design guidelines apply to the THS3202DR's PowerPAD package?

The THS3202DR's SOIC-8 PowerPAD requires soldering the exposed thermal pad to a minimum 100 mm² copper area (ideally connected to internal ground plane) using ≥4 thermal vias (0.3 mm diameter, spaced evenly). Without this, θ_JA rises from 97.5°C/W to >150°C/W, risking junction temperatures >150°C at full output. TI's SLMA002 technical brief mandates thermal pad connection for all PowerPAD devices; THS3202DR will suffer permanent parametric shift or failure if operated without verified thermal attachment.